JPS63195726U - - Google Patents
Info
- Publication number
- JPS63195726U JPS63195726U JP8700887U JP8700887U JPS63195726U JP S63195726 U JPS63195726 U JP S63195726U JP 8700887 U JP8700887 U JP 8700887U JP 8700887 U JP8700887 U JP 8700887U JP S63195726 U JPS63195726 U JP S63195726U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- light receiving
- resin
- contact
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 235000014443 Pyrus communis Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8700887U JPS63195726U (2) | 1987-06-03 | 1987-06-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8700887U JPS63195726U (2) | 1987-06-03 | 1987-06-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63195726U true JPS63195726U (2) | 1988-12-16 |
Family
ID=30943838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8700887U Pending JPS63195726U (2) | 1987-06-03 | 1987-06-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63195726U (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01171252A (ja) * | 1987-12-25 | 1989-07-06 | Fuji Electric Co Ltd | 樹脂モールド形受光用半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6096424A (ja) * | 1983-11-01 | 1985-05-30 | Nec Corp | モ−ルド金型 |
-
1987
- 1987-06-03 JP JP8700887U patent/JPS63195726U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6096424A (ja) * | 1983-11-01 | 1985-05-30 | Nec Corp | モ−ルド金型 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01171252A (ja) * | 1987-12-25 | 1989-07-06 | Fuji Electric Co Ltd | 樹脂モールド形受光用半導体装置 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63151815U (2) | ||
| JPS6183036U (2) | ||
| JPS6387843U (2) | ||
| JPS63193853U (2) | ||
| JPS63170942U (2) | ||
| JPH0173946U (2) | ||
| JPH01156017U (2) | ||
| JPS62134253U (2) | ||
| JPH01115241U (2) | ||
| JPH01176928U (2) | ||
| JPH01156016U (2) | ||
| JPS62182946U (2) | ||
| JPS60126249U (ja) | シエル鋳型造型機における製品押出装置 | |
| JPH031535U (2) | ||
| JPS6394929U (2) | ||
| JPS63162529U (2) | ||
| JPS58189528U (ja) | モ−ルド型 | |
| JPS6167113U (2) | ||
| JPS62166637U (2) | ||
| JPS5872017U (ja) | 低圧成形用型 | |
| JPS63110035U (2) | ||
| JPS6357742U (2) | ||
| JPS63159830U (2) | ||
| JPS5892033U (ja) | プラスチツク成形金型用ホツトランナ−ノズル | |
| JPS588966U (ja) | 半導体受光装置 |