JPS63197848U - - Google Patents
Info
- Publication number
- JPS63197848U JPS63197848U JP8809187U JP8809187U JPS63197848U JP S63197848 U JPS63197848 U JP S63197848U JP 8809187 U JP8809187 U JP 8809187U JP 8809187 U JP8809187 U JP 8809187U JP S63197848 U JPS63197848 U JP S63197848U
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- thermoplastic resin
- laminated
- convex protrusion
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Bag Frames (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の電子部品包装用袋の斜視図で
ある。
１：電子部品包装用袋、２：熱可塑性樹脂フイ
ルム、３：透明導電性樹脂フイルム、４：透明導
電性樹脂フイルムに積層接着された熱可塑性樹脂
フイルム、５：凸状突起、６：透明導電性樹脂フ
イルムと熱可塑性樹脂フイルムとが積層接着され
た二層フイルム、７：開口部。
FIG. 1 is a perspective view of the electronic component packaging bag of the present invention. 1: Bag for packaging electronic parts, 2: Thermoplastic resin film, 3: Transparent conductive resin film, 4: Thermoplastic resin film laminated and bonded to transparent conductive resin film, 5: Convex projection, 6: Transparent conductive A two-layer film in which a thermoplastic resin film and a thermoplastic resin film are laminated and bonded. 7: Opening.
Claims (1)
気室を形成する凸状突起が設けられており、更に
凸状突起の頂面に於いて、透明導電性樹脂フイル
ムと熱可塑性樹脂フイルムとが積層接着された二
層フイルムの、熱可塑性樹脂フイルム側が積層一
体化されている導電性緩衝性シートから構成され
、該導電性緩衝性シートを重ね合わせ、且つ、一
部開口部を残して、周縁に沿つて熱融着して得ら
れる電子部品包装用袋。 A convex protrusion forming a large number of independent air chambers is provided on one side of the thermoplastic resin film, and a transparent conductive resin film and a thermoplastic resin film are laminated and bonded on the top surface of the convex protrusion. The thermoplastic resin film side of the two-layer film is composed of conductive cushioning sheets that are laminated and integrated, and the conductive cushioning sheets are overlapped and a portion is opened along the periphery, leaving a part of the opening. A bag for packaging electronic parts obtained by heat-sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8809187U JPS63197848U (en) | 1987-06-09 | 1987-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8809187U JPS63197848U (en) | 1987-06-09 | 1987-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197848U true JPS63197848U (en) | 1988-12-20 |
Family
ID=30945893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8809187U Pending JPS63197848U (en) | 1987-06-09 | 1987-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197848U (en) |
-
1987
- 1987-06-09 JP JP8809187U patent/JPS63197848U/ja active Pending
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