JPS63200341U - - Google Patents
Info
- Publication number
- JPS63200341U JPS63200341U JP3809987U JP3809987U JPS63200341U JP S63200341 U JPS63200341 U JP S63200341U JP 3809987 U JP3809987 U JP 3809987U JP 3809987 U JP3809987 U JP 3809987U JP S63200341 U JPS63200341 U JP S63200341U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- chip
- nozzle body
- diameter side
- conical taper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000032258 transport Effects 0.000 claims 1
Description
第１図ないし第３図はいずれもこの考案の実施
例を示したもので、これらの各図においてａはノ
ズルの断面図、ｂは同ノズルの底面図、第４図は
従来のノズルとＩＣチツプとを分離して示す斜視
図、第５図ａは第４図に示されたノズルの断面図
、同図ｂは同ノズルの底面図である。
図中、３はＩＣチツプ、１０はＩＣチツプ実装
用ノズル、１１はノズル本体、１１ａは吸着面、
１２，１３はテーパである。
Figures 1 to 3 all show examples of this invention, and in each of these figures, a is a cross-sectional view of the nozzle, b is a bottom view of the nozzle, and Figure 4 is a conventional nozzle and IC. FIG. 5a is a sectional view of the nozzle shown in FIG. 4, and FIG. 5b is a bottom view of the nozzle. In the figure, 3 is an IC chip, 10 is a nozzle for mounting the IC chip, 11 is a nozzle body, 11a is a suction surface,
12 and 13 are tapers.
Claims (1)
を有し、ＩＣチツプをその負圧により吸着保持し
て回路基板等の所定部位に搬送するＩＣチツプ実
装用ノズルにおいて、 上記ノズル本体の端面に円錐状のテーパを形成
し、上記ＩＣチツプに対する接触面を小さくした
ことを特徴とするＩＣチツプ実装用ノズル。 (2) 実用新案登録請求の範囲(1)において、上記
ノズル本体の内径側に円錐状のテーパが形成され
ているＩＣチツプ実装用ノズル。 (3) 実用新案登録請求の範囲(1)において、上記
ノズル本体の外径側に円錐状のテーパが形成され
ているＩＣチツプ実装用ノズル。 (4) 実用新案登録請求の範囲(1)において、上記
ノズル本体の内径側および外径側の双方に円錐状
のテーパが形成されているＩＣチツプ実装用ノズ
ル。[Claims for Utility Model Registration] (1) For IC chip mounting, which has a cylindrical nozzle body connected to a pressure reducing means, and which suctions and holds the IC chip using its negative pressure and transports it to a predetermined location on a circuit board, etc. 1. A nozzle for mounting an IC chip, characterized in that a conical taper is formed on the end face of the nozzle body to reduce the contact surface with the IC chip. (2) The IC chip mounting nozzle according to claim (1), wherein the nozzle body has a conical taper formed on the inner diameter side. (3) The nozzle for IC chip mounting according to claim (1) of the utility model registration, wherein a conical taper is formed on the outer diameter side of the nozzle body. (4) The IC chip mounting nozzle according to claim (1), wherein a conical taper is formed on both the inner diameter side and the outer diameter side of the nozzle body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3809987U JPS63200341U (en) | 1987-03-16 | 1987-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3809987U JPS63200341U (en) | 1987-03-16 | 1987-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63200341U true JPS63200341U (en) | 1988-12-23 |
Family
ID=30850028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3809987U Pending JPS63200341U (en) | 1987-03-16 | 1987-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63200341U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5966199A (en) * | 1982-10-08 | 1984-04-14 | 株式会社日立製作所 | Package conveying mechanism |
-
1987
- 1987-03-16 JP JP3809987U patent/JPS63200341U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5966199A (en) * | 1982-10-08 | 1984-04-14 | 株式会社日立製作所 | Package conveying mechanism |
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