JPS63201340U - - Google Patents
Info
- Publication number
- JPS63201340U JPS63201340U JP1987092686U JP9268687U JPS63201340U JP S63201340 U JPS63201340 U JP S63201340U JP 1987092686 U JP1987092686 U JP 1987092686U JP 9268687 U JP9268687 U JP 9268687U JP S63201340 U JPS63201340 U JP S63201340U
- Authority
- JP
- Japan
- Prior art keywords
- utility
- model registration
- cooling fan
- bent
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Description
第1図a〜cは本考案の実施例を示し、第2図
は従来の冷却フアンを示している。
図中2は集積回路、8a〜8c,9a〜9c,
11a〜11cは針金である。
1a to 1c show an embodiment of the present invention, and FIG. 2 shows a conventional cooling fan. In the figure, 2 is an integrated circuit, 8a to 8c, 9a to 9c,
11a to 11c are wires.
Claims (1)
つて、 折り曲げた針金を集合させて構成したことを特
徴とする冷却フアン構造。 (2) 針金を球状に折り曲げたことを特徴とする
実用新案登録請求の範囲第1項記載の冷却フアン
構造。 (3) 針金を半球状に折り曲げたことを特徴とす
る実用新案登録請求の範囲第1項記載の冷却フア
ン構造。[Scope of Claim for Utility Model Registration] (1) A cooling fan for cooling electronic components, characterized in that it is constructed by assembling bent wires. (2) The cooling fan structure according to claim 1 of the utility model registration, characterized in that a wire is bent into a spherical shape. (3) The cooling fan structure according to claim 1 of the utility model registration claim, characterized in that a wire is bent into a hemispherical shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987092686U JPS63201340U (en) | 1987-06-16 | 1987-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987092686U JPS63201340U (en) | 1987-06-16 | 1987-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201340U true JPS63201340U (en) | 1988-12-26 |
Family
ID=30954614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987092686U Pending JPS63201340U (en) | 1987-06-16 | 1987-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201340U (en) |
-
1987
- 1987-06-16 JP JP1987092686U patent/JPS63201340U/ja active Pending
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