JPS63201342U - - Google Patents
Info
- Publication number
- JPS63201342U JPS63201342U JP9265987U JP9265987U JPS63201342U JP S63201342 U JPS63201342 U JP S63201342U JP 9265987 U JP9265987 U JP 9265987U JP 9265987 U JP9265987 U JP 9265987U JP S63201342 U JPS63201342 U JP S63201342U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- cross
- leads
- boundary
- sectional area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例に係わるリードフレー
ムを示す斜視図、第２図は一対のリードフレーム
の組み合せ配置を示す平面図、第３図は第２図の
−線に相当する部分によつてチツプに対する
リードの接続を説明するための断面図、第４図は
完成したダイオードを示す断面図、第５図は従来
のリードフレームを示す斜視図、第６図は従来の
一対のリードフレームの組み合せ配置を示す平面
図、第７図は第６図の−線に相当する部分に
よつてチツプのリードに対する接続方法を説明す
るための断面図である。
１…第１のリードフレーム、２……第２のリー
ドフレーム、３，４……リード、７……チツプ、
１０，１１……連結部、２８，２９……貫通孔。
Fig. 1 is a perspective view showing a lead frame according to an embodiment of the present invention, Fig. 2 is a plan view showing the combined arrangement of a pair of lead frames, and Fig. 3 is a portion corresponding to the - line in Fig. 2. 4 is a sectional view showing a completed diode, FIG. 5 is a perspective view of a conventional lead frame, and FIG. 6 is a cross-sectional view of a pair of conventional lead frames. FIG. 7 is a plan view showing the combined arrangement, and a cross-sectional view for explaining a method of connecting the chip to the leads by a portion corresponding to the - line in FIG. 6. 1... First lead frame, 2... Second lead frame, 3, 4... Lead, 7... Chip,
10, 11...Connecting portion, 28, 29...Through hole.
Claims (1)
状に支持したリードフレームにおいて、 前記リード３と前記連結部１０との境界又は境
界近傍部分の断面積をこれに隣接する部分の断面
積よりも小さくしたことを特徴とするリードフレ
ーム。[Claims for Utility Model Registration] In a lead frame in which a plurality of leads 3 are supported in a cantilevered manner by connecting portions 10, the cross-sectional area of the boundary or the vicinity of the boundary between the leads 3 and the connecting portion 10 is defined as A lead frame characterized by having a cross-sectional area smaller than that of a portion adjacent to the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9265987U JPH0419804Y2 (en) | 1987-06-16 | 1987-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9265987U JPH0419804Y2 (en) | 1987-06-16 | 1987-06-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63201342U true JPS63201342U (en) | 1988-12-26 |
| JPH0419804Y2 JPH0419804Y2 (en) | 1992-05-06 |
Family
ID=30954560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9265987U Expired JPH0419804Y2 (en) | 1987-06-16 | 1987-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0419804Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001203312A (en) * | 2000-01-18 | 2001-07-27 | Sanken Electric Co Ltd | Lead terminal and semiconductor device |
-
1987
- 1987-06-16 JP JP9265987U patent/JPH0419804Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001203312A (en) * | 2000-01-18 | 2001-07-27 | Sanken Electric Co Ltd | Lead terminal and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0419804Y2 (en) | 1992-05-06 |