JPS63201372U - - Google Patents
Info
- Publication number
- JPS63201372U JPS63201372U JP1987092188U JP9218887U JPS63201372U JP S63201372 U JPS63201372 U JP S63201372U JP 1987092188 U JP1987092188 U JP 1987092188U JP 9218887 U JP9218887 U JP 9218887U JP S63201372 U JPS63201372 U JP S63201372U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- memory alloy
- shape memory
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 3
- 238000005476 soldering Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Description
第１図はこの考案の一実施例を示す斜視図、第
２図は第１図に対応する一部断面立面図、第３図
は従来の部品を示す一部断面立面図、第４図は第
３図の部品を実装した状態を示す一部断面立面図
。
１は電極のリード、２はリード取り付け用ラン
ド、３は固定用部材、４は固定用穴、５はハンダ
、６は印刷配線板、８はスタンドオフピン、９は
コネクタ。なお、図中同一符号は同一または相当
部分を示す。
Fig. 1 is a perspective view showing an embodiment of this invention, Fig. 2 is a partially sectional elevational view corresponding to Fig. 1, Fig. 3 is a partially sectional elevational view showing conventional parts, and Fig. 4 is a partially sectional elevational view showing conventional parts. The figure is a partially sectional elevational view showing a state in which the parts shown in FIG. 3 are mounted. 1 is an electrode lead, 2 is a lead attachment land, 3 is a fixing member, 4 is a fixing hole, 5 is solder, 6 is a printed wiring board, 8 is a standoff pin, and 9 is a connector. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
ドにハンダ付けして接続される電極を有する表面
実装部品において、 上記印刷配線板への固定用に形状記憶合金を用
い、ハンダ付けのための加熱工程に際して上記形
状記憶合金の形状を変形して上記印刷配線板に装
着し、スタンドオフピンを設けて上記電極の変形
を防止することを特徴とする表面実装部品。[Claims for Utility Model Registration] A surface mount component having an electrode connected by soldering to a lead connection land provided on a printed wiring board, wherein a shape memory alloy is used for fixing to the printed wiring board. A surface mount component, characterized in that the shape memory alloy is mounted on the printed wiring board by deforming the shape of the shape memory alloy during a heating process for soldering, and standoff pins are provided to prevent deformation of the electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987092188U JPS63201372U (en) | 1987-06-16 | 1987-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987092188U JPS63201372U (en) | 1987-06-16 | 1987-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201372U true JPS63201372U (en) | 1988-12-26 |
Family
ID=30953666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987092188U Pending JPS63201372U (en) | 1987-06-16 | 1987-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201372U (en) |
-
1987
- 1987-06-16 JP JP1987092188U patent/JPS63201372U/ja active Pending