JPS63221699A - Printed board cooling system - Google Patents
Printed board cooling systemInfo
- Publication number
- JPS63221699A JPS63221699A JP5576987A JP5576987A JPS63221699A JP S63221699 A JPS63221699 A JP S63221699A JP 5576987 A JP5576987 A JP 5576987A JP 5576987 A JP5576987 A JP 5576987A JP S63221699 A JPS63221699 A JP S63221699A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- board
- air volume
- printed board
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概要〕
冷却風をガイドする側壁と複数本の切断用溝を設けた風
量調整片を形成した仕切り板を、各種電子部品を実装し
たプリント配線基板の主面に風量調整片が冷却風の風上
側となるように配列して複数個の領域に分割し、各領域
の発熱量に応じて風量調整片に形成した任意の溝で切断
して冷却風量の調整する冷却方式。[Detailed Description of the Invention] [Summary] A partition plate formed with a side wall for guiding cooling air and an air volume adjustment piece provided with a plurality of cutting grooves is installed on the main surface of a printed wiring board on which various electronic components are mounted. Cooling in which the adjustment piece is arranged so that it is on the windward side of the cooling air, divided into multiple areas, and the air volume adjustment piece is cut with an arbitrary groove formed in the air volume adjustment piece according to the amount of heat generated in each area to adjust the cooling air volume. method.
本発明は各種電子機器の構成に広く使用されるプリント
板の冷却方式に関するものである。The present invention relates to a method for cooling printed circuit boards that is widely used in the construction of various electronic devices.
最近、大型の電子機器に装着されるプリント板は大型且
つ、高発熱量の高密度集積素子と低発熱量の素子を多数
個混在実装されており、そのプリント板全体を冷却する
ファン、ダクト等の冷却用部材は、プリント板の大型化
と高発熱量に伴ってそれに対処する大きさが必要となっ
て装置全体を大きくしているため、小型の冷却用ファン
で冷却効率の高い新しいプリント板冷却方式が要求され
ている。Recently, the printed circuit boards installed in large electronic devices are large and have a large number of high-density integrated elements with high heat generation and low heat generation elements mixed together, and fans, ducts, etc. are used to cool the entire printed board. As the cooling components of the PC board become larger and generate more heat, the overall size of the equipment becomes larger. A cooling method is required.
従来広く使用されているプリント板の冷却方式は、第３
図に示すようにプリント板コネクタ１−１（以下コネク
タと省略する）を片側端縁に配設して、信号用および電
源用の図示しないパターンを形成した基板１の主面に、
高発熱量の高密度集積素子２（以下高発熱体と省略する
）と、低発熱量の素子３（以下低発熱体と省略する）を
それぞれ指定された位置で混在した状態に実装して、前
記コネクタ１−１の反対側端縁に前面板４を固着して冷
却風を外部と隔離するようになっている。The cooling method for printed circuit boards that has been widely used in the past is the third method.
As shown in the figure, a printed board connector 1-1 (hereinafter abbreviated as connector) is arranged on one edge of the main surface of the board 1 on which patterns (not shown) for signals and power supply are formed.
A high-density integrated element 2 with a high calorific value (hereinafter abbreviated as a high-heating element) and an element 3 with a low calorific value (hereinafter abbreviated as a low-heater) are mounted in a mixed state at respective designated positions, A front plate 4 is fixed to the opposite edge of the connector 1-1 to isolate the cooling air from the outside.
上記の方式で実装されたプリント板は、第４図に示すよ
うに上部に上記基板１とほぼ等しい幅を有する排気用の
ダクト６−１とファン７を固着し、下部にエヤーフィル
タ８を固着したダクト６−２を配設した図示しないシェ
ルフのバックパネル５にプリント板を挿入して、コネク
タ１−１とバックパネル５を結合することにより、プリ
ント板の基板ｌと前面板４及び隣接する基板１とバック
パネル５とで風洞を形成する。As shown in FIG. 4, the printed board mounted in the above manner has an exhaust duct 6-1 and a fan 7 fixed to the upper part and has a width almost equal to that of the board 1, and an air filter 8 fixed to the lower part. By inserting a printed board into the back panel 5 of the shelf (not shown) in which the duct 6-2 is installed, and connecting the connector 1-1 and the back panel 5, the board 1 of the printed board, the front plate 4, and the adjacent The board 1 and the back panel 5 form a wind tunnel.
そして、ファン７を駆動すると矢印方向の吸気力が発生
してエヤーフィルタ８を通過した冷却風を前記風洞に吸
い込み、熱せられた冷却風は排気用のダクト６−１を経
由してファン７により矢印方向へ排出することで高発熱
体２および低発熱体３を冷却している。Then, when the fan 7 is driven, an air intake force is generated in the direction of the arrow, and the cooling air that has passed through the air filter 8 is sucked into the wind tunnel, and the heated cooling air is passed through the exhaust duct 6-1 to the fan 7. By discharging in the direction of the arrow, the high heat generating body 2 and the low heat generating body 3 are cooled.
〔発明が解決しようとする問題点１
以上説明した従来のプリント板冷却方式で問題となるの
は、シェルフにプリント板を挿入すると隣接するブリ・
ント板との間に形成される風洞は、実装した高発熱体お
よび低発熱体の発熱量に関係なく基板とほぼ等しい幅と
なり、その断面積が大きくなり、冷却用のファンとシェ
ルフの上下に配設されるダクトが大きくなる点である。[Problem to be Solved by the Invention 1] The problem with the conventional printed board cooling method described above is that when a printed board is inserted into a shelf, the adjacent
The wind tunnel formed between the board and the board has a width that is almost equal to that of the board, regardless of the heat generation amount of the mounted high-heating elements and low-heating elements, and its cross-sectional area is large, and the wind tunnel is The point is that the duct to be installed becomes larger.
そのため、装置全体が大きくなると共に冷却用の消費電
力も多くなって、装置および稼動コストを高騰させる原
因となっている。As a result, the overall size of the device increases and power consumption for cooling also increases, causing an increase in device and operating costs.
本発明は以上のような状況からファン等の冷却用部材を
小型化して且つ、高発熱体の冷却効率の良い新しいプリ
ント板冷却方式の提供を目的としたものである。In view of the above-mentioned circumstances, it is an object of the present invention to provide a new printed circuit board cooling method that reduces the size of cooling members such as fans and has good cooling efficiency for high-heat generating elements.
上記問題点は第１図に示すように、直角に折曲した細幅
の一辺を冷却風をガイドする側壁１４−１とし他辺を風
量調整片１４−２として、その風量調整片１４−２に複
数本の切断用溝１４−３を設けた仕切り板１４を形成し
、コネクタ１１−１を片側端面に設けた基板１の主面に
風量調整片１４−２が冷却風の風上側となるように冷却
風の方向と平行に配列して複数個の領域に分割し、各領
域の発熱量に応じて溝１４−３を形成した風量調整片１
４−２を任意の位置で切断する本発明のプリント板冷却
方式により解決される。The above problem is solved as shown in Fig. 1, where one narrow side bent at right angles is a side wall 14-1 for guiding the cooling air, and the other side is an air volume adjustment piece 14-2. A partition plate 14 with a plurality of cutting grooves 14-3 is formed on the main surface of the board 1 with a connector 11-1 provided on one end surface, and an air volume adjustment piece 14-2 is placed on the windward side of the cooling air. The air volume adjustment piece 1 is arranged parallel to the direction of the cooling air and divided into a plurality of regions, with grooves 14-3 formed according to the amount of heat generated in each region.
This problem is solved by the printed board cooling method of the present invention in which the printed board 4-2 is cut at an arbitrary position.
即ち本発明においては、仕切り板１４により基板１の主
面を複数個の領域に分割して各領域の発熱量に応じて風
量調整片１４−２の任意の溝１４−３で切断することに
より、各領域は実装された高発熱体２および低高発熱体
３の冷却に必要な冷却風量が流れて、プリント板を冷却
する所要風量が最少限となって冷却用のファンとダクト
の小型化が図れる゛と共に、冷却用の消費電力を少なく
することが可能となる。That is, in the present invention, the main surface of the substrate 1 is divided into a plurality of regions by the partition plate 14, and cut by an arbitrary groove 14-3 of the air volume adjustment piece 14-2 according to the amount of heat generated in each region. , the amount of cooling air required to cool the mounted high heat generating element 2 and low/high heat generating element 3 flows through each area, and the amount of air required to cool the printed circuit board is minimized, making the cooling fan and duct smaller. This makes it possible to reduce power consumption for cooling.
以下図面に示した実施例に基づいて本発明の詳細な説明
する。The present invention will be described in detail below based on embodiments shown in the drawings.
第１図は本実施例によるプリント板冷却方式の斜視図を
示し、図中において、第３図と同一部材には同一記号が
付しであるが、その他の１４はプリント板の主面を分割
して冷却風量を調整する仕切り板である。FIG. 1 shows a perspective view of the printed board cooling system according to this embodiment. In the figure, the same members as in FIG. This is a partition plate that adjusts the cooling air volume.
その仕切り板１４は、隣接して装着するプリント板との
間隔よりやや細い幅で冷却風をガイドする側壁１４−１
の一端に、風量調整片１４−２を側壁１４−１と直角と
なるように設けて、風！調整片１４−２の片面に冷却風
量を調整する複数本の切断用の溝１４−３を設けた合成
樹脂より成型したものである。The partition plate 14 has a side wall 14-1 that guides cooling air and has a width slightly narrower than the distance between adjacent printed boards.
An air volume adjustment piece 14-2 is provided at one end of the side wall 14-1 so as to be perpendicular to the side wall 14-1. The adjusting piece 14-2 is molded from synthetic resin and has a plurality of cutting grooves 14-3 provided on one side thereof to adjust the amount of cooling air.
上記部材を使用したプリント板の冷却方式は、コネクタ
１１−１を配設した基板１の主面に風量調整片１４−２
が冷却風の風上側となるように、複数の仕切り板１４を
冷却風の方向、即ち矢印方向と平行に配列して主面を複
数個の領域に分割し、各領域に実装される高発熱体２と
低発熱体３０発熱量に対応した冷却風量となるように、
それぞれの風量調整片１４−２を任意の溝１４−３で切
断する方式である。A method of cooling a printed board using the above-mentioned members is to install an air volume adjustment piece 14-1 on the main surface of the board 1 on which the connector 11-1 is arranged.
The main surface is divided into a plurality of regions by arranging a plurality of partition plates 14 parallel to the direction of the cooling wind, that is, the direction of the arrow, so that So that the cooling air volume corresponds to the calorific value of body 2 and low heat generating element 30,
This is a method in which each air volume adjustment piece 14-2 is cut at an arbitrary groove 14-3.
そして、上記プリント板の冷却方法は、第４図に示すよ
うに、ファン７を固着した排気用のダクト６−１とエヤ
ーフィルタ８を固着したダクト６−２を上下に配設たシ
ェルフに、上記方式で実装されたプリント板を挿入して
コネクタ１−１とバンクパネル５を結合すると、そのプ
リント板の基板ｌと仕切り板１４および隣接する基板１
とにより分割された風洞が形成され、それぞれの風洞は
各領域に実装された発熱体の冷却に必要な冷却風量が流
れるために全体の風量が最少限となって、冷却用のファ
ンとダクトの小型化が図れると共に冷却用の消費電力を
少なくすることできる。As shown in FIG. 4, the above-mentioned method of cooling the printed circuit board is as follows: As shown in FIG. When the printed board mounted in the above manner is inserted and the connector 1-1 and the bank panel 5 are connected, the board l of the printed board, the partition plate 14, and the adjacent board 1
A divided wind tunnel is formed, and each wind tunnel receives the amount of cooling air necessary to cool the heating elements mounted in each area, so the overall air volume is minimized, and the cooling fan and duct are used. The size can be reduced and power consumption for cooling can be reduced.
また、第２図に示すように、冷却風をガイドする側壁１
４−１の一端に複数本の切断用の溝１４−３を設けた風
量調整片１４−２を丁字形に形成した他の実施例におい
ても、上記と同様に全体の冷却風量が最少限となって、
冷却用ファンの小型化と消費電力を少なくすることでき
る。In addition, as shown in Fig. 2, a side wall 1 for guiding cooling air is provided.
Even in other embodiments in which the air volume adjustment piece 14-2 is formed into a T-shape with a plurality of cutting grooves 14-3 provided at one end of the 4-1, the overall cooling air volume is minimized in the same manner as described above. Become,
It is possible to downsize the cooling fan and reduce power consumption.
以上説明したように本発明によれば極めて簡単な冷却方
式で冷却用部材が小さくなって、装置の小型が図れると
共にプリント板冷却用の消費電力が少なくなる等の利点
があり、著しい経済的および信鎖性向上の効果が期待で
き工業的には極めて有用なものである。As explained above, according to the present invention, the cooling member can be made small with an extremely simple cooling method, and the device can be downsized and the power consumption for cooling the printed circuit board can be reduced. It is expected to have the effect of improving reliability and is extremely useful industrially.
第１図は本発明の実施例によるプリント板冷却方式を示
す斜視図、
第２図は他の実施例の仕切り板を示す拡大斜視図、
第３図は従来のプリント板冷却方式を示す斜杉図、
第４図は従来の冷却方法を示す断面図である。
図において、
ｌは基板、
１−１はコネクタ、
２は高発熱体、
３は低発熱体、
１４．２４は仕切り板、
１４−１ 、２４−１は側壁、
１４−２．２４−２は風量調整片、
１４−３．２４−３は溝、
第２図
第３図
第４図Fig. 1 is a perspective view showing a printed board cooling system according to an embodiment of the present invention, Fig. 2 is an enlarged perspective view showing a partition plate of another embodiment, and Fig. 3 is a diagonal cedar showing a conventional printed board cooling system. FIG. 4 is a sectional view showing a conventional cooling method. In the figure, l is a board, 1-1 is a connector, 2 is a high heat generating element, 3 is a low heat generating element, 14.24 is a partition plate, 14-1 and 24-1 are side walls, 14-2.24-2 is a Air volume adjustment piece, 14-3.24-3 is groove, Fig. 2 Fig. 3 Fig. 4
Claims (1)
て、プリント配線基板（１）の主面に、該主面を分割す
る側壁（１４−１）と該側壁（１４−１）と交叉した風
量調整片（１４−２）を形成した少なくとも２個の仕切
り板（１４）を備え、 上記仕切り板（１４）により分割された各領域の上記電
子部品（２、３）の発熱量に応じて、該仕切り板（１４
）の該風量調整片（１４−２）を所定の位置で切断する
ことにより、各領域の冷却風量を調整してなることを特
徴とするプリント板冷却方式。[Claims] A method for cooling various electronic components mounted on a printed circuit board, which includes a main surface of a printed wiring board (1), a side wall (14-1) that divides the main surface, and a side wall (14-1) that divides the main surface. 1), and includes at least two partition plates (14) forming air volume adjustment pieces (14-2) that intersect with the above-mentioned electronic components (2, 3) in each area divided by the partition plates (14). Depending on the amount of heat generated, the partition plate (14
A printed board cooling method characterized in that the cooling air volume of each area is adjusted by cutting the air volume adjusting piece (14-2) of ) at a predetermined position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5576987A JPS63221699A (en) | 1987-03-10 | 1987-03-10 | Printed board cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5576987A JPS63221699A (en) | 1987-03-10 | 1987-03-10 | Printed board cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63221699A true JPS63221699A (en) | 1988-09-14 |
Family
ID=13008073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5576987A Pending JPS63221699A (en) | 1987-03-10 | 1987-03-10 | Printed board cooling system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63221699A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6226182B1 (en) | 1999-05-12 | 2001-05-01 | Matsushita Electric Industrial Co., Ltd. | Cooling structure of electronic appliance |
| US6888725B2 (en) | 2000-12-11 | 2005-05-03 | Fujitsu Limited | Electronics device unit |
| JP2019125611A (en) * | 2018-01-12 | 2019-07-25 | 株式会社三社電機製作所 | Electric apparatus |
| JP2020072242A (en) * | 2018-11-02 | 2020-05-07 | 三菱重工サーマルシステムズ株式会社 | Electrical component module and chilling unit |
-
1987
- 1987-03-10 JP JP5576987A patent/JPS63221699A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6226182B1 (en) | 1999-05-12 | 2001-05-01 | Matsushita Electric Industrial Co., Ltd. | Cooling structure of electronic appliance |
| US6888725B2 (en) | 2000-12-11 | 2005-05-03 | Fujitsu Limited | Electronics device unit |
| JP2019125611A (en) * | 2018-01-12 | 2019-07-25 | 株式会社三社電機製作所 | Electric apparatus |
| JP2020072242A (en) * | 2018-11-02 | 2020-05-07 | 三菱重工サーマルシステムズ株式会社 | Electrical component module and chilling unit |
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