JPS63222437A - Member of electric circuit - Google Patents

Abstract

PURPOSE:To obtain highly reliable connection, by providing an electrical connecting member between both circuit boards, and alloying and connecting the metal members of the electrical connecting member and the connecting parts of both circuit boards. CONSTITUTION:An electrical connecting member 125 is provided between both circuit boards 101 and 104. The member 125 has a plurality of metal members 107. One end of each member 107 is exposed to the side of the board 101. The other end of the member 107 is exposed to the side of the board 104. Each insulating body 111 has a hole, which is opened to the outside. A connecting part 102 of the board 101 and one end of the member 107 exposed to the side of the board 101 are made to be alloyed and connected. A connecting part 105 of the board 104 and the one end of the member 107 exposed to the side of the substrate 104 are made to be alloyed and connected. Thus the highly reliable connection is obtained.

Description

[Detailed description of the invention] [Industrial application field] TECHNICAL FIELD The present invention relates to electrical circuit members.

[Prior Art] Conventionally, the following techniques are known as techniques related to electric circuit members configured by electrically connecting electric circuit components.

■Wire bonding method.

FIGS. 13 and 14 show typical examples of semiconductor devices connected and sealed by the wire bonding method, and the wire bonding method will be explained below based on FIGS. 13 and 14.

In this method, the semiconductor element 4 is fixedly supported on the element mounting part 2 using Ag paste 3 or the like, and then the connection part 5 of the semiconductor element 4 and the desired connection part 6 of the lead frame l are connected with ultrafine material such as gold. This is a method of electrically connecting using metal wires 7.

After the connection, the semiconductor element 4 and the lead frame 1 are sealed using a resin 8 using a method such as a transfer molding method, and then the unnecessary portion of the lead frame 1 extending outside the resin-sealed portion is cut off. .

A semiconductor device 9 is made by bending it into a desired shape.

■T A B (Tape Automated Bo
FIG. 15 shows a typical example of a semiconductor device connected and sealed by the TAB method.

This method is an automatic bonding method using a tape carrier method. That is, to explain based on FIG. 15, after positioning the carrier film substrate 16 and the semiconductor element 4, the inner lead part 17 of the carrier film substrate 16 and the connecting part 5 of the semiconductor element 4 are connected by thermocompression bonding. This is the way to do it. After the connection, the semiconductor device 9 is sealed with resins 20 and 21.

■CCB (Controlled Co11apse
Bonding) law (for example, Special Publication Act 1977
(No. 6, Japanese Unexamined Patent Publication No. 60-57944) FIG. 16 shows a typical example of a semiconductor device connected and sealed by the CCB method. This method will be explained based on FIG. 16. Note that this method is also referred to as a clip chip bonding method.

Solder bumps 31 are provided in advance on the connection portion 5 of the semiconductor element 4,
A semiconductor element 4 provided with solder bumps 31 is positioned and mounted on one circuit board 32.

Thereafter, the semiconductor element 4 is connected to the circuit board 32 by heating and melting the solder, and the semiconductor device 9 is manufactured by sealing after washing with flux.

(2) The method shown in FIGS. 17 and 18, that is, an insulating film 71 made of polyimide or the like is formed on a portion of the first semiconductor element 4 other than the connection portion 5, and a metal material 7° made of Au or the like is formed on the connection portion 5. Then, the exposed surfaces 73 and 72 of the metal material 7o and the insulating film 71 are flattened. On the other hand, an insulating film 71'' made of polyimide or the like is formed on a portion of the second semiconductor element 4° other than the connection portion 5°, and a metal material 70′ made of Au or the like is provided on the connection portion 5′. material 70° and exposed surface 73° of insulating film 71', 7
Flatten 2'.

Thereafter, as shown in FIG. 18, the first semiconductor element 4 and the second semiconductor element 4' are positioned, and after positioning, the connection part 5 of the first semiconductor element 4 and the second The connecting portion 5° of the semiconductor element 4' is connected to metal materials 70, 70
Connect via '.

■The method shown in FIG. 19, that is, the first circuit substrate 75 and the second circuit substrate 75°
Anisotropic conduction in which conductive particles 79 are dispersed in an insulating material 77 during! After positioning the first circuit substrate 75 and the second circuit substrate 75° with the 1I78 interposed, pressure is applied or pressure and heat is applied to connect the connecting portion 76 of the first circuit substrate 75 and the second circuit substrate 75. This is a method of connecting the connecting portion 76' of the circuit board 75'.

■The method shown in FIG. 20, that is, the first circuit substrate 75 and the second circuit substrate 75''
During this period, metals such as Fe and Cu are distributed in a certain direction in the insulating material 81! After positioning the first circuit base material 75 and the second circuit base material 75° by interposing the elastic connector 83 with a 182, pressure is applied to connect the connecting portion 76 of the first circuit base material 75 and the second circuit base material 75. This is a method of connecting the connecting portion 76' of the circuit board 75'.

[Problems to be Solved] The conventional bonding method described above has the following problems.

■ Wire bonding method ■ If the connection part 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the ultrafine metal wire 7 has an extremely small wire diameter, This makes it easier to contact the outer peripheral edge 11 of the element mounting portion 2 of the lead frame l. The ultra-fine metal wire 7 is attached to these outer peripheral edges 10 to 11.
It will short circuit if it comes into contact with. Furthermore, the length of the ultra-fine metal wire 7 has to be increased, and when the length is increased, the ultra-fine metal wire 7 becomes easily deformed during transfer molding.

Therefore, the connecting portion 5 of the semiconductor element 4 needs to be placed around the semiconductor element 4, and is subject to limitations in one circuit design.

■In the wire bonding method, in order to avoid contact between adjacent ultrafine metal wires 7, the pitch dimension of the connecting portions 5 on the semiconductor element 4 (distance between the centers of adjacent connecting portions ta) is required.
) and have no choice but to maintain a certain amount of distance, therefore,
When the size of the semiconductor element 4 is determined, the maximum number of connection portions 5 is also determined.

However, in the wire bonding method, this pitch dimension is usually as large as about 0.2 mm.

The number of connection parts 5 has to be reduced.

■The height h of the ultrafine metal wire 7 measured from the connection part 5 on the semiconductor element 4 is usually 0.2 to 0.4 mm, but it is 0.2 mm.
Since it is relatively difficult to make the device thinner than below, the device cannot be made thinner.

■Wire bonding takes time. In particular, when the number of connection points increases, the bonding time increases and production efficiency deteriorates.

■Some kind of 1f! If the transfer molding condition range is exceeded, the ultrafine metal wire 7 may be deformed or, in the worst case, may be cut.

Furthermore, in the connection portion 5 on the semiconductor element 4, since A that is not alloyed with the ultrafine metal wire 7 is exposed, An corrosion tends to occur, resulting in a decrease in reliability.

■TAB method■ If the connection part 5 of the semiconductor element 4 is designed to be inside the semiconductor element, the length of the inner lead part 17 of the carrier film substrate 16 becomes longer, and the inner lead part 17 becomes easily deformed. The inner lead portion may not be connected to the desired connection portion 5, or the inner lead portion 17 may come into contact with a portion of the semiconductor element 4 other than the connection portion 5. In order to avoid this, it is necessary to bring the connecting portion 5 of the semiconductor element 4 to the periphery above the semiconductor element 4, which is subject to design limitations.

■Even in the TAB method, the pitch dimension of the connection parts on the semiconductor element 4 must be approximately 0.09 to 0.15 mm.
Therefore, similar to the problem (2) of the wire bonding method, it is difficult to increase the number of connections.

(2) In order to prevent the inner lead portions 17 of the carrier film substrate 16 from coming into contact with portions other than the connection portions 5 of the semiconductor element 4, a desired connection shape of the inner lead portions 17 is required, which increases costs.

■In order to connect the connection part 5 of the semiconductor i-shaped element 4 and the inner lead part 17, gold bumps must be attached to the connection part of the semiconductor element 4 or the connection part of the inner lead part 17 of the semiconductor element, which increases the cost. .

■ CCB method ■ Solder bumps 31 must be formed on the connection portions 5 of the semiconductor element 4, which increases costs.

■If the amount of solder on a bump is large, bridges (a phenomenon in which adjacent solder bumps come into contact with each other) will occur between adjacent solder bumps.
On the other hand, if the amount is too small, the connecting portion 5 of the semiconductor element 4 and the connecting portion 33 of the substrate 32 will not be connected and electrical continuity will not be established. In other words, the reliability of the connection becomes low. Furthermore, there is a problem that the amount of solder and the solder shape of the connection affect the reliability of the connection (Technical data of the Brazing Technology Research Group, No. 017-'84, published by the Brazing Technology Research Group).

As described above, the amount of solder bumps 31 needs to be controlled because the amount of solder bumps affects the reliability of the connection.

(2) If the solder bumps 31 are present inside the semiconductor element 4, it becomes difficult to visually inspect whether or not the connection has been made well.

■Poor heat dissipation characteristics of semiconductor elements (reference material; Elect
ronic Packaging Technology
y l 987-1 (Vol, 3. No, 1) P, 6
6～71゜NIKKEI MICRODEVICI';
, May 1986, P. 97-108), therefore, great efforts are required to improve the heat dissipation characteristics.

■Technique shown in FIGS. 17 and 18■ Surface 72 of the insulator 71 and surface 73 of the metal material 70, as well as the exposed surface 72° of the insulator 1971" and the exposed surface 73' of the metal material 70' must be made flat. First, the number of man-hours required increases, leading to higher costs.

■Insulation [exposed surface 72 of 171 and exposed surface 73 of metal material 70]
Or insulation [171' exposed surface 72° and metal material 70''
If there is unevenness on the exposed surface 73°, the metal material 70 and the metal material 70
' will no longer connect, reducing reliability.

■Technology shown in Fig. 19■ After positioning, when applying pressure to connect the connecting portion 76 and the connecting portion 76°, it is difficult to apply constant pressure, so the connection state varies, and as a result, the connecting portion The variation in contact resistance value becomes large. Therefore, the reliability of the connection becomes poor.

In addition, when a large amount of current is passed, phenomena such as heat generation occur, so it is not suitable when a large amount of current is desired to be passed.

■Even if the pressure is kept constant, anisotropic conduction [7
The arrangement of the conductive particles 79 of No. 8 increases the variation in resistance value. Therefore, the reliability of the connection becomes poor. Also,
It is not suitable for connections that require large current capacity.

(2) If the pitch between adjacent connecting parts (the distance between the centers of adjacent connecting parts) is narrowed, the resistance value between adjacent connecting parts will decrease, which is not suitable for high-density connections.

(2) Since the resistance value changes due to variations in the protrusions 31hi of the connecting portions 76 and 76' of the circuit substrates 75 and 75', it is necessary to accurately suppress the amount of variation in hl.

(Furthermore, when an anisotropic conductive film is used to connect a semiconductor element and a circuit substrate, or to connect a first semiconductor element and a second semiconductor element, in addition to the drawbacks It is necessary to provide a bump at the connection part of the connector, which has the disadvantage of increasing costs.

■Technology shown in Figure 20 ■Pressure is required, and a pressure jig is required.

[Phase] Connection portion 76 between metal wire 82 of elastic connector 83 and first circuit board 75. Second circuit board 75'
Since the contact resistance with the connecting portion 76' changes depending on the pressing force and surface condition, the reliability of the connection is poor.

■Since the metal wire 82 of the elastic connector 83 is a rigid body, if the pressing force is large, the elastic connector 83
First circuit substrate 75. There is a high possibility that the surface of the second circuit board 75' will be damaged, and if the pressing force is small, the reliability of the connection will be poor.

■Furthermore, circuit board 75, 75° connection part 76.76'
The protrusion amount h2 of the metal wire 82 of the elastic connector 83 and the protrusion amount h3 of the metal wire 82 of the elastic connector 83 and their variations affect resistance value change and damage, so it is necessary to take measures to reduce the variation.

(2) Furthermore, when an elastic connector is used to connect a semiconductor element and a circuit substrate, or to connect a first semiconductor element and a second semiconductor element, the same drawbacks as in (2) to (@) occur.

The present invention solves all of the above-mentioned problems and proposes a new electrical circuit member that is high in density, highly reliable, and low in cost. High-density multiple connections can be obtained, and various characteristics such as heat can be improved.

(Margins below) [rl for solving the invention] The present invention provides a first electrical circuit component having a connecting portion and a second electrical circuit component having a connecting portion by electrically connecting both electric circuit components. In an electric circuit member configured by intervening an electric connection member for connection between the two and connecting the two electric circuit components at the connection part, the electric connection member is made of a plurality of metals or alloys. Electrically insulating the metal members from each other,
and one end of the metal member is exposed to the first electric component side, while the other end of the metal member is exposed to the second electric circuit component side, and is embedded in an insulator. and the insulator has at least one hole opening to the outside, and the connecting portion of the first electric circuit component and one end of the metal member exposed on the side of the first electric circuit component are connected by an alloy. or by alloying the connection part of the second electric circuit component and one end of the metal member exposed on the second electric circuit component side. The gist is in the circuit member.

Examples of the electric circuit components in the present invention include semiconductor elements, circuit boards such as resin circuit boards, ceramic boards, and metal boards (hereinafter sometimes simply referred to as circuit boards), lead frames, and the like. That is, any one of these components may be used as the first electrical circuit component, and any one of these components may be used as the second electrical circuit component.

The object of the present invention is a component having a connection part as an electric circuit component. Although the number of connection parts does not matter, the greater the number of connection parts, the more remarkable the effects of the present invention will be.

Further, although the location of the connection portion does not matter, the effect of the present invention becomes more pronounced as the connection portion is located inside the electric circuit component.

In the present invention, a first electrical circuit component and a second electrical circuit component are connected using an electrical connection member.

The electrical connection member according to the present invention is constructed by embedding a plurality of metal members in an insulator. The metal members are each insulated by an insulator, and one end of the metal member is exposed to the first electric circuit component side, and the other end is exposed to the second electric circuit component side. Furthermore, the insulator has at least one hole opening to its exterior.

Here, as the material of the metal member, gold is preferable, but any metal or alloy other than gold may also be used. For example, Cu, All, Sn.

Examples include metals or alloys such as Pb-3n.

Furthermore, the cross section of the metal member can be circular, square, or any other arbitrary shape.

Further, the thickness of the metal member is not particularly limited, and may be, for example, 20I1. mφ
It may be greater than or equal to 20 Bmφ.

Note that the exposed portion of the metal member may be on the same surface as the insulator, or it may be made to protrude from the surface of the insulator. It may be made into a shape.

Furthermore, the spacing between the metal members may be the same as the spacing between the connecting parts of the electrical circuit components, or may be narrower than that, and when the spacing is narrower, the spacing between the electrical circuit components and the electrical connecting members may be the same. It becomes possible to connect the electrical circuit component and the electrical connection member without requiring positioning.

Also, metal members do not need to be placed vertically in the insulator;
It may run obliquely from the first electric circuit component side toward the second electric circuit component side.

Further, the electrical connection member may be made of one layer or multiple layers of two or more layers.

The electrical connection member may have one or more holes, and the size, shape, and position of the hole should be such that the metal members buried in the insulator come into contact with each other and do not cause a short circuit. If it is within, it is optional.

The hole may penetrate from the first electric circuit component side to the second electric circuit component side, or may be closed. The opening direction of this hole may be parallel to or perpendicular to the direction in which the metal member is exposed.

The insulator of the electrical connection member is not particularly limited as long as it is an insulating material; for example, an insulating resin may be used;
When a resin is used, the type of resin is not limited and may be either a thermosetting resin or a thermoplastic resin. For example, polyimide resin, polyphenylene sulfide resin, polyethersulfone resin, polyetherimide resin, polysal 7one resin, silicone resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, phenol resin, urea resin,
Melamine resin, alkyd resin, epoxy resin, polyamideimide resin, polyproblene #7M resin, polyvinyl chloride resin, polystyrene resin and other resins can be used. Among these resins, it is more preferable to use a resin with good thermal conductivity because even if one circuit board has heat, the heat can be dissipated through the resin. By selecting a material that has the same or similar coefficient of thermal expansion as the substrate, it becomes possible to further prevent the reliability of the stirrup from decreasing due to thermal expansion and contraction.

In the present invention, the connection portion of the first electric circuit component and the first
connection by alloying one end of the metal member of the electrical connection member exposed on the side of the electrical circuit component, or
The connecting portion of the electrical circuit component and one end of the metal member of the electrical connection member exposed to the second electrical circuit component are connected by alloying. That is, in one aspect of the present invention, either the first electric circuit component or the second electric circuit component is alloyed.

In addition, as an alloying method, for example, after bringing the corresponding connection parts into contact, heating may be performed at an appropriate temperature.Heating causes diffusion of atoms in the connection part, and a solid solution or metal is formed on the surface of the connection part. A layer of intercalary compound is formed and the connections are alloyed. In addition, when Au is used for the metal member of the electrical connection member and An is used for the connection part of the electric circuit component, the heating temperature is preferably 200 to 350°C.

Note that any known method may be used for the connection without alloying. For example, the connection may be made by pressing the electrical circuit component and the electrical connection member.

[Function] Since the above-described electrical connection member is used in the present invention, Tl! It is also possible to arrange the connection parts of the surrounding parts inside, which makes it possible to increase the number of connection parts and thus to achieve higher density.

Furthermore, the mechanical connection member can be made thinner, and from this point of view as well, it is possible to make it thinner.

Furthermore, since the amount of metal members used for the electrical connection member is small, the cost is low even if expensive gold is used as the metal member.

Since one of the electrical circuit components is alloyed via the electrical connection member, there is no variation in contact resistance and the reliability of the connection is high.

In addition, since either the first electric circuit component or the second electric circuit component is alloyed and connected, quality deterioration due to alloying (for example,
When alloying by heating, li! % circuit components, such deterioration can be prevented by connecting the electrical circuit components by pressing, for example, without alloying them. Furthermore, depending on the application, there are cases where it is desired to make the electric circuit parts removable, and in such cases, the electric circuit parts can be connected by pressing, for example, without alloying them, and the electric circuit parts can be made removable. You can also do it.

Furthermore, in the present invention, since the holes are present in the insulator of the electrical connection member, even if heat is applied to the electrical circuit member or the electrical connection member (during the assembly process or during product reliability testing) (heat may be applied to the electrical circuit member), the hole relieves thermal stress, thereby preventing disconnection of electrical connection members that may occur due to thermal stress, or disconnection or contact between electrical connection members and electrical circuit members. It is possible to prevent defects, and it is possible to prevent poor conduction or difficulty in conduction caused by poor contact.

[Example] (First Example) A first example of the present invention will be described based on FIGS. 1 and 2.

In this embodiment, a circuit board 101, which is a first electric circuit component having a connection part 102, and a second circuit board 101 having a connection part 105 are used.
The circuit board 104, which is an electric circuit component of the circuit board 101,
In an electric circuit component structure configured by connecting at connecting portions 102 and 105 of 104.

The electrical connection member 125 electrically insulates the plurality of metal members 107 made of metal or alloy from each other, and connects one end of the metal member 107 to the first circuit board 101. On the other hand, the metal member 107 is embedded in an insulator 111 with the other end exposed to the second circuit board 104 side, and the insulator 111 is embedded in the insulator 111. It has a hole (not shown in FIG. 1) that opens to the outside, and connects the connecting portion 102 of the first circuit board 101 and one end of the metal member 107 exposed on the first circuit board 101 side. or the second circuit board 10
The connection is made by alloying the connecting portion 105 of No. 4 and one end of the metal member 107 exposed on the second circuit board 104 side.

This example will be explained in more detail below.

First, the electrical connection member 125 will be explained while explaining one manufacturing example of the electrical connection member 125.

FIG. 2 shows one manufacturing example.

First, as shown in FIG. 2(a), metal wires 121 made of a metal such as gold or an alloy with a diameter of 20 pm are wired at a pitch of 40.
After wrapping, the rod 12 is wrapped between the metal wires 121 so as not to touch the metal wires 121.
After that, the metal wire 121 and rod 127 are embedded in a resin 123 such as polyimide, and after embedding, the resin 123 is hardened. The cured resin 123 becomes an insulator. After curing, the rod 127 is removed. Thereafter, the electrical connection member 12 is cut into slices at the position of the one-dot line 124.
Create 5. Furthermore, after the rod 127 is removed, a hole 120 is formed at that position.

The electrical connection member 125 created in this way is
Shown in Figures (b) and (C).

In the electrical connection member 125 created in this way,
The metal wire 121 constitutes the metal member 107, and the resin 123 constitutes the insulator l11.

The rod 127 may be the same metal wire as the metal wire 121, or may be made of any other material.The rod 127 may be inserted or wound around the rod 122.Furthermore, the rod 127 may be cut into slices. You can remove it later.

In this electrical connection member 125, metal wires 121 serving as metal members are electrically insulated from each other by resin 123. Further, one end of the metal wire 121 is exposed to the circuit board 101 side, and the other end is exposed to the circuit board 104 side. These exposed portions become connection portions 108 and 109 with circuit boards 101 and 104, respectively.

Next, the first circuit board 101. electrical connection member 125,
The circuit boards 101 and 104 used in this example have a large number of connection parts 102 and 105 therein, as shown in FIG.

Note that the connection portion 102 of the first circuit board 101 is connected to the connection portion 105 of the second circuit board 104 and the electrical connection member 12.
Metal is exposed at positions corresponding to the connection parts 108 and 109 of No. 5.

Connecting portion 102 of first circuit board 101 and connecting portion 108 of electrical connecting member 125, or
Connection part 1 between the connection part 105 of 04 and the electrical connection member 125
After positioning, one of them is alloyed and connected, and the other is connected by another method.

Here, the first circuit board lot, electrical connection member 1
25. There are the following two methods for connecting the second circuit board 104, and either method may be used.

■After positioning the first circuit board 101 and the electrical connection member 125, 'the connection part 10 of the first circuit board 101
2 and the connecting portion 108 of the electrical connecting member 125 are alloyed and connected, the second circuit board 104 is positioned, and the connecting portion 105 of the second circuit board 104 and the electrical connecting member 12 are alloyed and connected.
A method of connecting by pressing the connection part 109 of No. 5.

■ After positioning the second circuit board 104 and the electrical connection member 125, and after alloying and connecting the connection part 105 of the second circuit board 104 and the connection part 109 of the electrical connection member 125, The first circuit board 101 is positioned, and the first circuit board 101 is connected to the vL connecting portion 102 of the electrical connection member 125.
A method in which the connection is made by pressing the connection part 108 of the

When the connectivity of the connection portions of the electrical circuit members produced as described above was examined, the connections were found to be highly reliable.

In addition, no conduction failure or difficulty occurred due to heating.

(Second example) FIG. 3 shows a second embodiment.

In this example, a circuit board 51 is used as a first electric circuit component having a connection part 52, and a semiconductor element 4 having a large number of connection parts 5 therein is used as a second electric circuit component.

Alloying was performed between the connection portion 5 of the semiconductor element 4 and the connection portion 54 of the electrical connection member 125 having the hole 120.

Note that as the electrical connection member 125 having the hole 120, one having a size corresponding to the semiconductor element 4 was used.

After alloying and connecting, a lead frame 55 was connected to the lower surface of the circuit board 51.

Other points are similar to the first embodiment.

In this example as well, the connections were made with high reliability. In addition, no conduction failure or difficulty occurred due to heating.

(Third example) FIG. 4 shows a third embodiment.

In this example, the first electric circuit component is the semiconductor element 4, and the second electric circuit component is the circuit board 51.

Note that after connection, the lead frame 1 is placed on the top surface of the circuit board 51.
were connected and sealed with a sealant 63.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability. In addition, no conduction failure or difficulty occurred due to heating.

(Fourth example) FIG. 5 shows a fourth embodiment.

In this example, the first electric circuit component is a semiconductor element 4',
This is an example in which the second electric circuit component is the semiconductor element 4. In this example, an electrical connection member having a size corresponding to the semiconductor element 4 is used, and the lead frame 1 is connected to the first electrical connection member 125. It is connected to the metal member exposed on the semiconductor element 4' side.

The rest is the same as the third embodiment.

In this example as well, the connection section was connected with high reliability. In addition, heating may also cause poor conduction or difficulty in Ts.
No symptoms occurred.

(Fifth example) FIG. 6 shows a fifth embodiment.

The fifth embodiment is a circuit board lot in which parts other than the connecting portions are covered with insulating films 103 and 108 as the first electric circuit component and the second electric circuit component.

This is an example in which 104 is used.

Further, as an electrical connection member, one shown in FIG. 7 was used. That is, in the electrical connection member 125 having the hole 120 shown in FIG. 7, the exposed portion of the metal member 107 protrudes from the surface of the resin insulator 111. Such electrical connection member 125 may be created, for example, by the following method.

First, by the method described in the first embodiment, as shown in FIG. 2(b),
After preparing the electrical connection member shown in (c), both surfaces of this electrical connection member may be etched until the metal wire 121 protrudes from the polyimide resin 123 by about 1107z.

In this embodiment, the amount of protrusion of the metal wire 121 was set to 10 gm, but any amount may be used.

Furthermore, the method for making the metal wire 121 protrude is not limited to etching, and other chemical or mechanical methods may be used.

Other points are similar to the first embodiment.

Note that the protruding portion and the electrical connection member 125 are connected to the metal wire 121.
A bump 150 as shown in FIG. 8 may be formed by inserting the metal wire 121 into a mold having four parts and crushing the protrusion 126 of the metal wire 121.

In this case, the metal wire 121 is less likely to fall off than the insulator 111.

Note that in this example as well, the metal wire 121 constitutes the metal member 107, and furthermore, the resin 123 constitutes the insulator 111.

Note that the bumps may be created by melting the protrusions with heat, or any other method may be used.

In this example as well, the connection section was connected with high reliability. Moreover, no conduction failure or difficulty occurred even when heated. (Sixth Example) A sixth example is shown in FIG. 9.

In this example, a semiconductor element 4 is used as the first electrical circuit component, and a lead frame 1 is used as the second electrical component.

Other points are similar to the fifth embodiment.

In this example as well, the connection section was connected with high reliability. In addition, no conduction failure occurred due to heating.

(Seventh Example) FIG. 10 shows a seventh embodiment.

In this example, the electrical connection member 125 is different from the electrical connection member shown in the fifth embodiment. That is, in the electrical connection member 125 of this example, the pitch between the metal members is narrower than that shown in the fifth example. That is, in this example, the pitch between the metal members 107 is set to be narrower than the interval between the first circuit board connecting portions.

That is, in the fifth embodiment, the first circuit board 101 and the second
An electrical connection member 125 is located at the connection position with the circuit board 104.
Since the connection position of the first circuit board l was arranged, it was necessary to position the electrical connection member 125.
Although it is necessary to position O1 and the second circuit board 104, positioning with the electrical connection member 125 becomes unnecessary.

Therefore, the first circuit board 101 and the second circuit board 10
It is also possible to connect without positioning by selecting appropriate values for the connection dimensions (dll, pH) of No. 4 and the connection dimensions (d12.P12) of the electrical connection member.

In this example as well, the connection section was connected with high reliability. In addition, no conduction failure or difficulty occurred due to heating.

(Eighth Example) FIG. 11 shows an electrical connection member used in the eighth example.

FIG. 11(a) is a perspective view of the electrical connection member, FIG.
b) is a sectional view of the electrical connection member.

An example of making such an electrical connection member will be described below.

First, three electrical connection members 128, 129, and 130 having holes 120 are prepared using the manufacturing method shown in the first embodiment.

The position of the metal wire 121 in the first sheet 128 is at the nilth row of m rows,
It is displaced from the center by ma and nb. The position of the metal wire 121 in the second sheet 129 is in the mth row and nth column, and is displaced from the center by mac and nbc. The position of the third metal wire 121 is in the min column and is displaced from the center by mad and nbd. a.

The values of b, c, and d are such that the upper and lower metals 121 are electrically conductive, but the left and right sides are not electrically conductive with each other. The three electrical connection members are positioned and laminated using a method such as thermocompression bonding to create the electrical connection member 125.

In addition, in this example, the positions of the metals of the electrical connection members were selected according to rules such as m rows and n columns, but the upper and lower metals are conductive, and there is no electrical conduction to the left and right sides. It can be random if you do this.

In addition, although this example describes the case where three layers are laminated, two
Any number of layers may be used as long as the electrical connection member of this example is laminated using a thermocompression bonding method. 7th
A protrusion may be provided as shown in the figure, or a bump 150 may be provided as shown in FIG.

In this example as well, the connection section was connected with high reliability. In addition, no conduction failure or difficulty occurred due to heating.

(Ninth Example) FIG. 12 shows an electrical connection member used in the ninth example.

FIG. 12 (&) is a cross-sectional view of the electrical connection member during manufacture;
FIG. 12(b) is a perspective view of the electrical connection member,
Figure (c) is the above sectional view.

First, metal wire guide plates 131 and 132 are prepared. Then, the metal wire 121 and the rod 127 are passed through desired holes 133 and 134 made in the metal wire guide plates 131 and 132, and stretched to a desired tension. After that, the metal wire guide plate 131.
, 132 and harden the resin 123. After that, the rod 127 is removed. After that, the guide plate is removed and the electrical connection member 125 is created. After removing the rod 127, a hole 120 is formed at that position. Note that the rod 127 may be made of the same metal wire as the metal wire 121 described above, or may be made of any other material.

Further, the rod 127 may be removed after removing the guide plate, or the electrical connection member of this example may be processed to form the seventh
A protrusion may be provided as shown in the figure, or a bump 150 may be provided as shown in FIG.

The first circuit component and the second electric circuit component of the wooden embodiment are:
Each of them is one of circuit base materials such as a semiconductor element, a circuit board, and a lead frame.

In this example as well, the connection section was connected with high reliability. In addition, no conduction failure or difficulty occurred due to heating.

[Effects of the Invention] Since the present invention is configured as described above, the following numerous effects can be obtained.

1. Highly reliable connections between semiconductor elements and circuit substrates such as circuit boards and lead frames can be obtained. Therefore, the conventionally used wire bonding method, TAB
It becomes possible to replace the CCB method.

2. According to the present invention, the connection parts of electric circuit components can be placed in any position (especially inside), which enables more multi-point connections than the wire bonding method or TAB method, and is suitable for connection with a large number of bins. This is the method.

Furthermore, due to the presence of an insulating material between adjacent metals of the electrical connection member, there is no electrical conduction between the adjacent metals.
More multi-point connections are possible than with the CB method.

3. ``W!'' Since the amount of metal members used in the gas connection member is tiny compared to the conventional one, even if an expensive metal such as gold is used for the metal member, it will be cheaper than the conventional one.

4. High-density semiconductor devices and the like can be obtained.

5. One of the electric circuit components can be detachably attached. In addition, it is possible to connect electrical circuit parts whose quality would otherwise deteriorate when alloyed without causing deterioration.

6. By selecting a material with good thermal conductivity as the electrical insulating material of the electrical connection member, heat dissipation from the electric circuit components becomes good, and a semiconductor device with good heat dissipation can be obtained.

7. Even if heat is applied to electrical circuit members or electrical connection members, the holes can alleviate thermal stress and prevent disconnection and poor contact of metal members that can occur due to thermal stress. . Note that this effect is remarkable when there is a difference in coefficient of thermal expansion between the first electric circuit component and the second electric circuit component.

Of course, a highly reliable semiconductor device can be obtained by selecting a material having the same or similar coefficient of thermal expansion as the semiconductor element and the circuit substrate as the electrically insulating material of the electrical connection member.

By embedding or laminating other substances in the insulator of the electrical connection member, an electrical circuit member with good heat dissipation, low stress, and shielding efficiency can be obtained.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a first embodiment. Figure 1(a)
2 shows the state before connection, and FIG. 2(b) shows the state after connection. FIG. 2 is a diagram for explaining an example of a manufacturing method of the electrical connection member used in the first embodiment. , Figure 2(a)
2(b) is a perspective view, and FIG. 2(c) is a sectional view. FIG. 3 shows a second embodiment, with FIG. 3(a) being a perspective view and FIG. 3(b) being a sectional view. FIG. 4 is a sectional view showing the third embodiment. 5th @ is a sectional view showing the fourth embodiment. FIG. 6 shows the fifth embodiment, FIG. 6(L) is a sectional view showing the state before connection, and FIG. 6(b) is a sectional view showing the state after connection. FIGS. 7 and 8 also show the fifth embodiment, with FIGS. 7(a) and 8(a) being perspective views, and FIGS. 7(b) and 8(b) being sectional views. It is. 9 shows a sixth embodiment, FIG. 9(a) is a perspective view showing the state before connection, and FIG. 9(b) is a sectional view showing the state after connection. FIG. 10 is a sectional view showing the seventh embodiment,
Figure 1θ (a) shows the state before connection, Figure 1θ (b)
11 shows the electrical connection member according to the eighth embodiment, and FIG. 11(a) is a perspective view,
FIG. 11(b) is a sectional view. FIG. 12 shows an example of manufacturing an electrical connection member according to the ninth embodiment, and FIG.
) and (c) are cross-sectional views, and FIG. 12(b) is a perspective view. 13 to 20 show conventional examples, and the first
4 are cross-sectional views, and FIG. 14 is a plan perspective view. 1. φ lead frame, 2. Element mounting part of lead frame, 3. Silver paste, 4, 4゛... Semiconductor element, 5
, 5'... Connecting part of semiconductor element, 6 - Connecting part of lead frame, 7-- Microfine metal wire, 3 e e resin, 9...
Semiconductor device, 10th outer periphery of conductor element, 11...
Outer periphery of element mounting part of lead frame, l x5...
Carrier film substrate, 17...Inner lead portion of carrier film substrate, 20...Resin, 21...Resin, 3
1. Solder bump, 32. Board connection, 54. Connection portion of electrical connection member, 55ΦΦ lead frame, 63. Sealing material, 70°70'.. Metal material.
71.71'...Insulating film, 72, 72'...Exposed surface of insulating film, 73.73''...Exposed surface of metal material, 75
,75°...Circuit base material, 76.76'...Connection part of circuit base material, 77...Insulating material of anisotropic conductive film, 78...
Anisotropic conductive film, 79... Conductive particles, 81... Insulating material of elastic connector, 82-- Metal wire of elastic connector, 83... Elastic connector, 101...
Circuit board, 102 - connection part, 103... insulating film 210
6... Insulating film, 104... Circuit board, 105-... Connection part, 107 Metal member, 108... Connection part % 109... Connection part, 111 - φ insulator, 120... Hole, 121@-metal wire , 122 - rod, 123 - φ resin, 124 - φ dotted line, 125 - electrical connection member, 126 - protrusion, 127
・φ rod, 128, 129, 130... electrical connection member,
131,132...Metal wire guide plate, 133,134...
Hole, 150/fist bump. Figure 1 (a) Figure 1 (b) Figure 2 (c) Figure 3 (a) Figure 3 (b) Figure 4 Figure 5 5 4 1δ Figure 6 (a) Figure 6 (b ) Figure 7 (a) Figure 7 (b) Figure 10 (a) Figure 10 (b) Figure 11 (a) Figure 11 (b) Figure 12 (a)! 21 Figure 13 Figure 14 Figure 15 Figure 16 Figure 17 Old figure

Claims (1)

[Claims] 1. An electrical connection member for electrically connecting a first electric circuit component having a connecting portion and a second electric circuit component having a connecting portion to both of them. In an electric circuit member constructed by intervening between the two electric circuit parts and connecting them at the connecting part, the electric connecting member connects a plurality of metal members made of metal or an alloy to each other. electrically isolated,
and one end of the metal member is exposed to the first electric component side, while the other end of the metal member is exposed to the second electric circuit component side, and is embedded in an insulator. and the insulator has at least one hole opening to the outside, and the connecting portion of the first electric circuit component and one end of the metal member exposed on the side of the first electric circuit component are connected by an alloy. An electric circuit characterized in that the connection is made by alloying the connecting portion of the second electric circuit component and one end of the metal member exposed on the side of the second electric circuit component. Element. 2. The electric circuit member according to claim 1, wherein the first electric circuit component and the second electric circuit component are each one of a semiconductor element, a circuit substrate such as a circuit board, or a lead frame.