JPS6322447B2 - - Google Patents
Info
- Publication number
- JPS6322447B2 JPS6322447B2 JP11029481A JP11029481A JPS6322447B2 JP S6322447 B2 JPS6322447 B2 JP S6322447B2 JP 11029481 A JP11029481 A JP 11029481A JP 11029481 A JP11029481 A JP 11029481A JP S6322447 B2 JPS6322447 B2 JP S6322447B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- resin
- coil
- water
- electric wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 5
- 230000004927 fusion Effects 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 3
- 229920003055 poly(ester-imide) Polymers 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- RLHGFJMGWQXPBW-UHFFFAOYSA-N 2-hydroxy-3-(1h-imidazol-5-ylmethyl)benzamide Chemical compound NC(=O)C1=CC=CC(CC=2NC=NC=2)=C1O RLHGFJMGWQXPBW-UHFFFAOYSA-N 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 150000003863 ammonium salts Chemical class 0.000 claims description 2
- 150000004985 diamines Chemical class 0.000 claims description 2
- 239000000178 monomer Substances 0.000 claims description 2
- 239000002243 precursor Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 239000003021 water soluble solvent Substances 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 9
- 239000000843 powder Substances 0.000 description 6
- SVYKKECYCPFKGB-UHFFFAOYSA-N N,N-dimethylcyclohexylamine Chemical compound CN(C)C1CCCCC1 SVYKKECYCPFKGB-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000007809 chemical reaction catalyst Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- IUKZOXDEQDVZSL-UHFFFAOYSA-N (2-methyl-1h-imidazol-5-yl)-phenylmethanone Chemical compound N1C(C)=NC=C1C(=O)C1=CC=CC=C1 IUKZOXDEQDVZSL-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 description 1
- 239000010754 BS 2869 Class F Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920000784 Nomex Polymers 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000013213 extrapolation Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000004763 nomex Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/06—Insulation of windings
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Insulating Of Coils (AREA)
- Organic Insulating Materials (AREA)
Description
本発明は高耐熱、高ヒートサイクル性に優れた
樹脂モールドコイルを得ることを目的とするもの
である。
従来のモールドコイルは、第１図、第２図に示
す如く、導体３の表面に絶縁皮膜４を施した電線
を巻回してなる素コイル１をモールド型に収納
後、モールド樹脂２を注入し加熱硬化して得てい
る。
従来のモールドコイルに用いる電線としては、
モールドコイルの耐熱区分がＢ種の場合には、そ
の絶縁層としてポリエステル樹脂、エポキシ樹脂
等を用い、さらにその耐熱区分がＦ種の場合には
ポリエステルイミド樹脂等を用いる。又、モール
ド樹脂２としては、ビスフエノール型エポキシ樹
脂（DGEBA）に硬化剤としてヘキサヒドロ無水
フタル酸（HHPA）を用い、さらにその反応触
媒としてベンジルジメチルアミン（BDMA）、ジ
メチルシクロヘキシルアミン（DMCA）、１―ベ
ンゾイル２―メチルイミダゾール（1B2MZ）等
の第３アミンを用い、又モールド樹脂２の熱膨張
係数をコイル導体に出来る限り近ずける為に、シ
リカ粉、アルミナ粉等の無機粉末を適量混入す
る。
前述のような従来のモールドコイルを高温側
230℃、低温側−40℃のヒートサイクル試験を行
うと、数サイクルでモールド樹脂２にクラツクが
発生する。ところが、そのクラツクは、素コイル
電線の絶縁皮膜４にも伝播し、レヤーシヨートを
起こす原因となる。
本発明は前記従来のモールドコイルのように仮
にモールド樹脂層にクラツクが発生しても、それ
が電線の絶縁皮膜に伝播しないモールドコイルの
絶縁システムを提供するものである。
以下、本発明を第３図〜第６図を参照して説明
する。第３図、第４図は本発明にかかる低圧コイ
ル、高圧コイルを一体モールドしたコイルを示す
もので、アルミシートに層間絶縁材料として、ノ
ーメツクスやポリエチレンテレフタレート等の薄
葉材料を用いて巻回した低圧コイル１０と、特殊
絶縁層を形成した電線により構成される高圧コイ
ル１１をエアーダクト用スペーサーとセパレータ
ーを介して金型内に一体にして収納し、樹脂モー
ルドを行ない加熱硬化してモールド樹脂層１２を
得る。ここで、用いるモールド樹脂としては、主
剤としてビスフエノールＡ系エポキシ樹脂
（DGEBA）で常温（25℃）で液状のものを主成
分とする（耐クラツク性や耐熱性を改善する為に
高分子量のものや他の可撓性付与剤を若干混入す
る場合もある）ものを主剤とし、硬化剤としてメ
チルテトラヒドロ無水フタール酸（MeTHPA）、
メチルヘキサヒドロ無水フタール酸
（MeHHPA）、ヘキサヒドロ無水フタール酸
（HHPA）等の酸無水物硬化剤の一種又は数種を
混合したものを用いる。前述の酸無水物硬化剤は
充填材の混入が容易になり、かつ硬化物の耐熱特
性も向上し、熱エージングによる寸法変化が少な
い。
前記モールド樹脂の反応触媒としては、
BDMA、DMCA、1B2MZ、DMP―30等の第３
アミンを0.05〜3PHR混入する（主剤樹脂中に水
酸基を含むものが含まれる場合、触媒を用いなく
ても硬化は可能となる）。充填剤としては、シリ
カ粉、アルミナ粉、クレー、水和アルミナ等を適
量混入したものを用いる。前記充填剤がシリカ粉
で、そのシリカ純度が98％以上で、かつその硬化
物の熱膨張係数が40×10-6／℃以下になるように
約40VOL％混入したものは、後の実施例でも述
べるが、優れた耐熱、耐クラツク性能を有する。
第４図において、離型層１３は、低圧コイル１
０と高圧コイル１１が接する部分に埋設する。具
体的には、ポリエチレンテレフタレートにシリコ
ン系の離型剤を塗布したものやテフロン等もエポ
キシ樹脂との接着性が悪いものを用いる。この離
型層１３により低圧コイル１０と高圧コイル１１
に発生する複雑な応力はかなり緩和される。な
お、１４は高圧端子、１５は低圧コイル１１の立
上り線、１６はエアダクト、１７は溝部分を示
す。
第５図は高圧コイル部分の拡大断面図を示し、
第６図は高圧コイル１１を構成する電線の絶縁構
成を示すもので、１８は導体、１９は導体１８の
表面に形成した絶縁層で、１，２，３，４ブタン
テトラカルボン酸とジアミンとをモノマー単位と
して水溶性溶媒又はそれと水との共存下で反応を
進行させて得られる酸価残存率３〜30％のポリイ
ミド前駆体をアンモニウム塩を形成させて水溶化
して塗布焼付形成したものである。２０は電線皮
膜の耐コロナ性を向上させる為に塗布形成したイ
ソミド系のポリエステル樹脂層よりなる中間層で
ある。さらに２１はビスフエノールＡ系エポキシ
樹脂の平均分子量900以上の樹脂、例えばフエノ
キシ樹脂等で場合によつては硬化剤を適量混入し
たものを溶剤に溶解し塗布形成してなる。
なお、前述のような絶縁層の組合せは、一般常
識としては行なわれていない。即ち、エステルイ
ミド樹脂皮膜は、巻線時に損傷しやすいからであ
る。そして、損傷時に下層の皮膜にも悪い影響を
与える可能性がある。ところが、本発明に係る前
述のような組合せにおいては、従来問題にされて
いたようなことが起こらないことを確認した。即
ち、仮に中間層２０であるエステルイミド樹脂層
に大きな力が作用し、皮膜が損傷しても、下層の
特殊ポリイミド樹脂層は殆んど損傷を受けない。
即ち、通常の多重皮膜構成の絶縁電線において、
上層にクラツクが仮に発生した場合、それは速や
かに下層まで伝播して、絶縁皮膜としての機能を
失う。ところが本発明の構成では、仮にクラツク
が発生しても中間層と下層でスリツプして、クラ
ツクは中間層で止まり、絶縁皮膜の機能を失うこ
とがない。
次に本発明の一実施例を比較例とともに説明す
る。試料は、導体が2.1〜2.8φのアルミニウム電
線で、ツイストペアを作成し、その周囲を樹脂モ
ールド絶縁したもの、試験条件は加熱温度240℃、
220℃、ヒートサイクル条件は−40℃、チエツク
電圧は5KVで１分間印加、外挿法により20000時
間の温度を求めた結果を下表に示す。
The object of the present invention is to obtain a resin-molded coil that is excellent in high heat resistance and high heat cycle properties. As shown in FIGS. 1 and 2, a conventional molded coil is made by storing a bare coil 1 made by winding an electric wire with an insulating film 4 on the surface of a conductor 3 in a mold, and then injecting a molding resin 2. Obtained by heating and curing. The wires used for conventional molded coils are:
When the heat resistance classification of the molded coil is class B, polyester resin, epoxy resin, etc. are used as the insulating layer, and when the heat resistance classification is class F, polyester imide resin etc. are used as the insulating layer. In addition, as the mold resin 2, hexahydrophthalic anhydride (HHPA) is used as a curing agent in bisphenol type epoxy resin (DGEBA), and benzyldimethylamine (BDMA), dimethylcyclohexylamine (DMCA), and 1 are used as reaction catalysts. -Use a tertiary amine such as benzoyl 2-methylimidazole (1B2MZ), and mix in an appropriate amount of inorganic powder such as silica powder or alumina powder in order to make the thermal expansion coefficient of mold resin 2 as close as possible to that of the coil conductor. . Conventional molded coil as mentioned above on high temperature side
When a heat cycle test is performed at 230°C and a low temperature of -40°C, cracks occur in the mold resin 2 after several cycles. However, the cracks also propagate to the insulation film 4 of the bare coil electric wire, causing layer shorting. The present invention provides an insulation system for a molded coil in which even if a crack occurs in the molded resin layer, unlike the conventional molded coil, the crack will not propagate to the insulation coating of the wire. Hereinafter, the present invention will be explained with reference to FIGS. 3 to 6. Figures 3 and 4 show a coil in which a low-voltage coil and a high-voltage coil are integrally molded according to the present invention, and the low-voltage coil is wound around an aluminum sheet using a thin material such as Nomex or polyethylene terephthalate as an interlayer insulation material. The coil 10 and the high-voltage coil 11 composed of electric wires formed with a special insulating layer are housed together in a mold via an air duct spacer and a separator, and then resin molded and heated to harden to form a molded resin layer 12. get. The molding resin used here is a bisphenol A-based epoxy resin (DGEBA) that is liquid at room temperature (25°C) as the main component (high molecular weight is used to improve crack resistance and heat resistance). The main ingredient is methyltetrahydrophthalic anhydride (MeTHPA) as a hardening agent.
One or a mixture of acid anhydride curing agents such as methylhexahydrophthalic anhydride (MeHHPA) and hexahydrophthalic anhydride (HHPA) is used. The aforementioned acid anhydride curing agent facilitates the incorporation of fillers, improves the heat resistance properties of the cured product, and reduces dimensional changes due to thermal aging. As the reaction catalyst for the mold resin,
Third such as BDMA, DMCA, 1B2MZ, DMP-30, etc.
Mix 0.05 to 3 PHR of amine (if the main resin contains a hydroxyl group, curing is possible without using a catalyst). As the filler, a suitable amount of silica powder, alumina powder, clay, hydrated alumina, etc. is used. When the filler is silica powder, the silica purity is 98% or more, and about 40 VOL% is mixed so that the thermal expansion coefficient of the cured product is 40 × 10 -6 /°C or less, the following example As mentioned above, it has excellent heat resistance and crack resistance. In FIG. 4, the mold release layer 13 is the low voltage coil 1.
0 and the high voltage coil 11 contact each other. Specifically, polyethylene terephthalate coated with a silicone-based mold release agent or Teflon, which has poor adhesion to epoxy resin, are used. This mold release layer 13 allows the low voltage coil 10 and the high voltage coil 11 to
The complex stresses that occur in the process are considerably alleviated. Note that 14 is a high voltage terminal, 15 is a rising line of the low voltage coil 11, 16 is an air duct, and 17 is a groove portion. Figure 5 shows an enlarged sectional view of the high voltage coil part.
FIG. 6 shows the insulation structure of the electric wires constituting the high-voltage coil 11. 18 is a conductor, 19 is an insulating layer formed on the surface of the conductor 18, and 1, 2, 3, 4 butane tetracarboxylic acid and diamine are used. A polyimide precursor with an acid value residual rate of 3 to 30% obtained by proceeding the reaction in the coexistence of a water-soluble solvent or water with water as a monomer unit is formed by forming an ammonium salt to make it water-soluble, and then coating and baking. be. Reference numeral 20 denotes an intermediate layer consisting of an isomide-based polyester resin layer coated to improve the corona resistance of the wire coating. Further, No. 21 is formed by dissolving a bisphenol A-based epoxy resin having an average molecular weight of 900 or more, such as a phenoxy resin, in which a suitable amount of a curing agent is mixed in a solvent, and coating the resin. Note that the combination of insulating layers as described above is not commonly used. That is, the esterimide resin film is easily damaged during winding. Furthermore, when damaged, the underlying film may also be adversely affected. However, it has been confirmed that the above-mentioned combination according to the present invention does not cause the problems that have been raised in the past. That is, even if a large force acts on the esterimide resin layer that is the intermediate layer 20 and damages the film, the special polyimide resin layer below will hardly be damaged.
That is, in an insulated wire with a normal multi-layer structure,
If a crack occurs in the upper layer, it quickly propagates to the lower layer and loses its function as an insulating film. However, in the structure of the present invention, even if a crack occurs, it will slip between the intermediate layer and the lower layer, and the crack will stop at the intermediate layer, so that the function of the insulating film will not be lost. Next, one embodiment of the present invention will be described together with a comparative example. The sample was a twisted pair of aluminum wire with a conductor of 2.1 to 2.8φ, and the surrounding area was insulated with a resin mold.The test conditions were a heating temperature of 240℃,
The temperature was 220°C, the heat cycle condition was -40°C, the check voltage was 5KV applied for 1 minute, and the temperature was determined by extrapolation for 20,000 hours. The results are shown in the table below.
【表】
PIW：ポリイミド樹脂層
EIW：イソミド系ポリエステルイミド樹脂層
融着層：平均分子量900以上のフエノールＡ系エ
ポキシ樹脂層（ここではフエノール樹脂
を使用）
上表より、比較例１〜３に示される如く、電線
単体をモールドしたものは耐熱性が低下する（モ
ールド無しの場合は５〜10℃高い）。また、モー
ルド樹脂のフイラー混入率にも大きく影響を受け
る。比較例４，５は本発明と同様の電線皮膜構成
で、フイラの混入率が少ない場合である。EIW
の下層にPIW，EIWの上層に融着層を形成する
ことによりEIWのみの場合に比べ、耐熱性が飛
躍的に向上する。これはモールド樹脂との相溶性
（化学的、機械的安定性）が非常に優れているこ
とを示す。
さらに、上述の絶縁皮膜構成の電線を40VOL
％、50VOL％のフイラーを混入したモールド樹
脂でモールドしたものが本発明１，２である。こ
れはPIW，EIW、融着層の特殊三層構造の絶縁
皮膜による優れた相溶性と、40VOL％以上のフ
イラーを含むモールド樹脂によりモールドしたこ
とにより、絶縁システムを構成する個々の材料間
に発生する熱応力を極小化することにより高い耐
熱性が得られたものである。
なお、実施例にはフイラーとしてシリカ純度
98.5％のものを用いたが、純度はなるべく高いも
のが良く、特にシリカ純度98％以上のものは特に
優れた特性を得ることができる。
又モールドコイルのモールド樹脂と電線との間
に作用する応力は、コイル構造により異なり、複
雑なコイル構造ほど前述の応力も複雑に作用し、
耐熱寿命を短かくする原因にもなるので、それに
適合した絶縁システムを採用することが要求され
るが、本発明は低圧コイルと高圧コイルを一体構
造したモールドコイルにおいても優れた耐熱耐ヒ
ートサイクル性を発揮するものである。これは前
にも述べた如くモールド樹脂の組成と電線の絶縁
皮膜の組成ならびに構成が非常に優れている為で
ある。なお、レヤー絶縁材料を用いないコイル
で、そのレヤー電圧が高くなると本発明に係るよ
うな性能を有する絶縁システムが強く要求され、
それに適用することにより大きな効果を発揮する
ものである。[Table] PIW: polyimide resin layer EIW: isomide-based polyesterimide resin layer Fusion layer: phenol A-based epoxy resin layer with an average molecular weight of 900 or more (phenol resin is used here) From the above table, Comparative Examples 1 to 3 show As shown in Figure 3, the heat resistance of a single molded electric wire is lower (5 to 10 degrees Celsius higher without a mold). It is also greatly affected by the percentage of filler mixed in the molding resin. Comparative Examples 4 and 5 have the same electric wire coating structure as the present invention, but have a small filler mixing rate. EIW
By forming a PIW layer on the bottom layer and a fusion layer on the top layer of EIW, heat resistance is dramatically improved compared to the case of EIW alone. This shows that the compatibility (chemical and mechanical stability) with the mold resin is very excellent. Furthermore, the electric wire with the above-mentioned insulation film structure is 40VOL
Inventions 1 and 2 are molded with a molding resin mixed with filler of 50VOL% and 50VOL%. This occurs between the individual materials that make up the insulation system due to the excellent compatibility of the insulation film with a special three-layer structure of PIW, EIW, and fusion layer, and because it is molded with a molding resin containing filler of 40VOL% or more. High heat resistance has been achieved by minimizing the thermal stress that occurs. In addition, in the examples, silica purity was used as a filler.
Although silica with a purity of 98.5% was used, it is better to have as high a purity as possible, and in particular, silica with a purity of 98% or more can provide particularly excellent properties. In addition, the stress that acts between the molded resin of the molded coil and the electric wire varies depending on the coil structure, and the more complex the coil structure, the more complex the stress that acts on it.
Since this can shorten the heat resistance life, it is necessary to adopt an insulation system that is compatible with this.However, the present invention provides excellent heat resistance and heat cycle resistance even in a molded coil that has an integrated structure of a low voltage coil and a high voltage coil. It is something that demonstrates the. This is because, as mentioned earlier, the composition of the molding resin and the composition and structure of the insulating film of the electric wire are very excellent. In addition, when the layer voltage increases in a coil that does not use layer insulation material, there is a strong demand for an insulation system having the performance according to the present invention.
By applying it, it can produce great effects.
第１図は従来のモールドコイルの断面図、第２
図は同要部の拡大断面図、第３図は本発明にかか
る低圧コイル、高圧コイルを一体モールドしたモ
ールドコイルの断面図、第４図は同平面図、第５
図は同モールドコイルにおける高圧コイルの断面
図、第６図は同高圧コイルに用いる電線の拡大断
面図である。
１２……モールド樹脂層、１８……導体、１９
……絶縁層、２０……中間層、２１……融着層。
Figure 1 is a cross-sectional view of a conventional molded coil, Figure 2 is a cross-sectional view of a conventional molded coil.
The figure is an enlarged cross-sectional view of the main parts, FIG. 3 is a cross-sectional view of a molded coil in which a low-voltage coil and a high-voltage coil according to the present invention are integrally molded, FIG. 4 is a plan view of the same, and FIG.
The figure is a cross-sectional view of a high-voltage coil in the molded coil, and FIG. 6 is an enlarged cross-sectional view of an electric wire used in the high-voltage coil. 12...Mold resin layer, 18...Conductor, 19
... Insulating layer, 20 ... Intermediate layer, 21 ... Fusion layer.
Claims (1)
ルボン酸とジアミンとをモノマー単位として、水
溶性溶媒もしくはそれと水との共存下で反応を進
行せしめて得られる酸価残存率３〜30％のポリイ
ミド前駆体をアンモニウム塩を形成させて水溶化
したものを塗付焼付して絶縁層を形成し、その上
層にイソミド系のポリエステルイミド樹脂層を形
成し、さらにその上層に融着層として平均分子量
が900以上のビスフエノールＡ系エポキシ樹脂を
溶剤に溶解しそれを塗布形成して電線を作成し、
この電線を巻回してなる素コイルの周囲を、ビス
フエノールＡ系エポキシ樹脂を主成分とする主剤
と、メチルテトラヒドロ無水フタール酸、メチル
ヘキサヒドロ無水フタール酸、ヘキサヒドロ無水
フタール酸より選ばれた１種又は数種類を混合し
たものを硬化剤の主成分とし、さらにシリカを主
成分とする充填剤を硬化物の熱膨張係数が40×
10-6／℃以下になるように40VOL％以上混入し
てなるモールド樹脂によりモールドしてなる樹脂
モールドコイル。1 An acid value residual rate of 3 to 30% obtained by reacting 1,2,3,4-butanetetracarboxylic acid and diamine as monomer units on the surface of a conductor in a water-soluble solvent or in the coexistence of it and water. An insulating layer is formed by coating and baking a polyimide precursor made by forming ammonium salt into water, forming an isomide-based polyesterimide resin layer on top of this, and then forming an average adhesive layer on top of that as a fusion layer. Bisphenol A-based epoxy resin with a molecular weight of 900 or more is dissolved in a solvent and applied to form an electric wire,
The base coil formed by winding this electric wire is surrounded by a main agent mainly composed of bisphenol A-based epoxy resin and one type selected from methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, and hexahydrophthalic anhydride. Or, a mixture of several types is used as the main component of the curing agent, and a filler whose main component is silica is added so that the thermal expansion coefficient of the cured product is 40 ×
A resin molded coil made by molding with a molding resin containing 40VOL% or more so that the temperature is below 10 -6 /℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56110294A JPS5810807A (en) | 1981-07-14 | 1981-07-14 | Resin mold coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56110294A JPS5810807A (en) | 1981-07-14 | 1981-07-14 | Resin mold coil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5810807A JPS5810807A (en) | 1983-01-21 |
| JPS6322447B2 true JPS6322447B2 (en) | 1988-05-12 |
Family
ID=14532043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56110294A Granted JPS5810807A (en) | 1981-07-14 | 1981-07-14 | Resin mold coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5810807A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2522588B2 (en) * | 1990-06-23 | 1996-08-07 | 株式会社日立製作所 | Epoxy resin composition for linear coil ground coil and ground coil molded with the composition |
| US8802230B2 (en) * | 2009-12-18 | 2014-08-12 | GM Global Technology Operations LLC | Electrically-insulative coating, coating system and method |
-
1981
- 1981-07-14 JP JP56110294A patent/JPS5810807A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5810807A (en) | 1983-01-21 |
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