JPS6322723U - - Google Patents
Info
- Publication number
- JPS6322723U JPS6322723U JP11620486U JP11620486U JPS6322723U JP S6322723 U JPS6322723 U JP S6322723U JP 11620486 U JP11620486 U JP 11620486U JP 11620486 U JP11620486 U JP 11620486U JP S6322723 U JPS6322723 U JP S6322723U
- Authority
- JP
- Japan
- Prior art keywords
- shape
- component
- circuit board
- lead terminal
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
- 239000013078 crystal Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案を適用した水晶振動子の一実施
例を示側面図であり、第２図Ａ、第２図Ｂ、第２
図Ｃおよび第２図Ｄは上記実施例の水晶振動子の
製造過程を順番に示す説明図である。第３図は従
来より水晶振動子のリード端子の折り曲げに使用
されている治具を示す斜視図であり、第４図およ
び第４図Ｂは上記治具によるリード端子の折り曲
げ方法を示す説明図である。
１……リード端子、２……目印、１０……水晶
振動子、１１……ハーメチツクシール部、１４…
…容器。
FIG. 1 is a side view showing an embodiment of a crystal resonator to which the present invention is applied, and FIGS. 2A, 2B, and 2
FIG. C and FIG. 2D are explanatory diagrams sequentially showing the manufacturing process of the crystal resonator of the above embodiment. FIG. 3 is a perspective view showing a jig conventionally used for bending lead terminals of crystal resonators, and FIGS. 4 and 4B are explanatory diagrams showing a method of bending lead terminals using the jig. It is. 1...Lead terminal, 2...Mark, 10...Crystal resonator, 11...Hermetic seal portion, 14...
…container.
Claims (1)
て回路基板に実装される電子部品において、 回路基板への実装形状を記憶させるとともに、
その折曲部分に目印を形成した形状記憶合金にて
形成したリード端子を備え、 上記リード端子を直線形状に伸ばして部品本体
に取り付けた後、加熱処理により上記実装形状に
変形させて成る電子部品。[Scope of claim for utility model registration] Electronic components that are mounted on a circuit board by bending lead terminals derived from the main body of the component, which memorize the mounting shape on the circuit board, and
An electronic component comprising a lead terminal made of a shape memory alloy with a mark formed on the bent part, the lead terminal being stretched into a straight shape, attached to the component body, and then transformed into the mounting shape by heat treatment. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11620486U JPS6322723U (en) | 1986-07-29 | 1986-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11620486U JPS6322723U (en) | 1986-07-29 | 1986-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322723U true JPS6322723U (en) | 1988-02-15 |
Family
ID=31000576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11620486U Pending JPS6322723U (en) | 1986-07-29 | 1986-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6322723U (en) |
-
1986
- 1986-07-29 JP JP11620486U patent/JPS6322723U/ja active Pending
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