JPS6322735U - - Google Patents
Info
- Publication number
- JPS6322735U JPS6322735U JP1986115293U JP11529386U JPS6322735U JP S6322735 U JPS6322735 U JP S6322735U JP 1986115293 U JP1986115293 U JP 1986115293U JP 11529386 U JP11529386 U JP 11529386U JP S6322735 U JPS6322735 U JP S6322735U
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- utility
- sealing
- model
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の実施例を示す半導体封止部材
の斜視図、第２図は第１図の断面図、第３図は熱
溶融前の配置状態を示す要部断面図、第４図は熱
溶融後の封止状態を示す要部断面図であり、第５
図は従来の封止状態を示す要部断面図である。
Ａ……封止部材、１……樹脂材、２……フイル
ム層。
Fig. 1 is a perspective view of a semiconductor sealing member showing an embodiment of the present invention, Fig. 2 is a sectional view of Fig. 1, Fig. 3 is a sectional view of main parts showing the arrangement state before thermal melting, and Fig. 4 5 is a sectional view of a main part showing a sealed state after heat melting;
The figure is a sectional view of a main part showing a conventional sealed state. A ... Sealing member, 1... Resin material, 2... Film layer.
Claims (1)
熱溶融時の流出を防止するフイルム層と、 からなることを特徴とする半導体封止部材。[Scope of Claim for Utility Model Registration] The utility model is characterized by comprising: a resin material for sealing a semiconductor element; and a film layer attached to the outer periphery of the resin material to prevent the resin material from flowing out during thermal melting. Semiconductor sealing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986115293U JPS6322735U (en) | 1986-07-29 | 1986-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986115293U JPS6322735U (en) | 1986-07-29 | 1986-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322735U true JPS6322735U (en) | 1988-02-15 |
Family
ID=30998805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986115293U Pending JPS6322735U (en) | 1986-07-29 | 1986-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6322735U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0310545U (en) * | 1989-06-16 | 1991-01-31 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59193034A (en) * | 1983-04-15 | 1984-11-01 | Matsushita Electric Ind Co Ltd | Semiconductor element sealing pellet |
-
1986
- 1986-07-29 JP JP1986115293U patent/JPS6322735U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59193034A (en) * | 1983-04-15 | 1984-11-01 | Matsushita Electric Ind Co Ltd | Semiconductor element sealing pellet |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0310545U (en) * | 1989-06-16 | 1991-01-31 |