JPS6322764U - - Google Patents
Info
- Publication number
- JPS6322764U JPS6322764U JP11532086U JP11532086U JPS6322764U JP S6322764 U JPS6322764 U JP S6322764U JP 11532086 U JP11532086 U JP 11532086U JP 11532086 U JP11532086 U JP 11532086U JP S6322764 U JPS6322764 U JP S6322764U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- board
- groove
- wiring pattern
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図及び第２図は本考案の一実施例を示すも
ので、第１図は印刷配線基板の要部の斜視図、第
２図は印刷配線基板を本体に取り付けた状態を示
す要部の縦断面図で、第３図は他の実施例を示す
第１図相当図である。
図中、１は本体、２は印刷配線基板、３は盤体
、４は印刷配線パターンである。
Figures 1 and 2 show an embodiment of the present invention, with Figure 1 being a perspective view of the main parts of the printed wiring board, and Figure 2 showing the main parts of the printed wiring board attached to the main body. FIG. 3 is a longitudinal sectional view corresponding to FIG. 1 showing another embodiment. In the figure, 1 is a main body, 2 is a printed wiring board, 3 is a board, and 4 is a printed wiring pattern.
Claims (1)
と、この盤体に形成され前記電子部品等を接続す
る印刷配線パターンとを具備するものに於いて、
前記盤体に折曲自在な溝部を形成すると共に、こ
の溝部の裏面側に前記印刷配線パターンを折曲自
在に形成したことを特徴とする電子機器等の印刷
配線基板。 ２ 溝部の裏面側の印刷配線パターンを蛇行させ
たことを特徴とする実用新案登録請求の範囲第１
項に記載の電子機器等の印刷配線基板。 ３ 溝部の裏面側の印刷配線パターンを幅広に形
成したことを特徴とする実用新案登録請求の範囲
第１項に記載の電子機器等の印刷配線基板。[Scope of Claim for Utility Model Registration] 1. A product comprising a board installed inside the main body and on which electronic parts, etc. are arranged, and a printed wiring pattern formed on the board and connecting the electronic parts, etc. ,
A printed wiring board for an electronic device or the like, characterized in that a bendable groove is formed in the board, and the printed wiring pattern is bendably formed on the back side of the groove. 2 Claim No. 1 for Utility Model Registration characterized by a meandering printed wiring pattern on the back side of the groove
Printed wiring boards for electronic devices, etc. described in 2. 3. The printed wiring board for electronic equipment, etc. as set forth in claim 1 of the utility model registration claim, characterized in that the printed wiring pattern on the back side of the groove is formed wide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11532086U JPS6322764U (en) | 1986-07-29 | 1986-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11532086U JPS6322764U (en) | 1986-07-29 | 1986-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322764U true JPS6322764U (en) | 1988-02-15 |
Family
ID=30998858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11532086U Pending JPS6322764U (en) | 1986-07-29 | 1986-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6322764U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996010326A1 (en) * | 1994-09-27 | 1996-04-04 | Seiko Epson Corporation | Printed wiring board, method of producing the same and electronic devices |
| JP2002289984A (en) * | 2001-03-26 | 2002-10-04 | Olympus Optical Co Ltd | Double-sided flexible substrate and camera having the same |
| WO2005088736A1 (en) * | 2004-03-17 | 2005-09-22 | Japan Gore-Tex Inc. | Production method of circuit board for light emitting body, precursor of circuit board for light emitting body, circuit board for light emitting body, and light emitting body |
| JP2007081237A (en) * | 2005-09-15 | 2007-03-29 | Japan Gore Tex Inc | Circuit board, thin film solar cell, and manufacturing method thereof |
| JP2015157164A (en) * | 2015-06-08 | 2015-09-03 | 京楽産業．株式会社 | Game machine |
-
1986
- 1986-07-29 JP JP11532086U patent/JPS6322764U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996010326A1 (en) * | 1994-09-27 | 1996-04-04 | Seiko Epson Corporation | Printed wiring board, method of producing the same and electronic devices |
| US6121988A (en) * | 1994-09-27 | 2000-09-19 | Seiko Epson Corporation | Printed wiring board and its manufacturing method, and electronic apparatus |
| JP2002289984A (en) * | 2001-03-26 | 2002-10-04 | Olympus Optical Co Ltd | Double-sided flexible substrate and camera having the same |
| WO2005088736A1 (en) * | 2004-03-17 | 2005-09-22 | Japan Gore-Tex Inc. | Production method of circuit board for light emitting body, precursor of circuit board for light emitting body, circuit board for light emitting body, and light emitting body |
| CN100459191C (en) * | 2004-03-17 | 2009-02-04 | 日本奥亚特克斯股份有限公司 | Method for producing circuit board for luminous body, circuit board precursor for luminous body, circuit board for luminous body, and luminous body |
| JP2007081237A (en) * | 2005-09-15 | 2007-03-29 | Japan Gore Tex Inc | Circuit board, thin film solar cell, and manufacturing method thereof |
| JP2015157164A (en) * | 2015-06-08 | 2015-09-03 | 京楽産業．株式会社 | Game machine |