JPS632305Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to a printed circuit board component removal tool used for removing electronic components fixed to a printed circuit board by soldering from the circuit board.

(b) Prior art and problems Generally, electronic components mounted on a printed circuit board are fixed as shown in Figure 1. FIG. 1 is an explanatory diagram of an electronic component mounting section.

The terminal 3 of the electronic component 2 is inserted into the through hole 4 provided at a predetermined location on the printed circuit board 1 from the mounting surface 1A, and the solder 5 is fused from the solder surface 1B side, thereby connecting the land 6 of the circuit board 1 and the terminal 3. are fixed to provide electrical continuity. When the electrical component 2 is fixed in this manner, a gap S is maintained between the electronic component 2 and the mounting surface 1A. It may be necessary to remove the electronic component 2 fixed in this way from the board 1 due to modification or failure.

When removal is required in this way, conventionally the second
The printed board component removal tool shown in the figure was used. FIG. 2 is a perspective view of a conventional printed board component removal tool.

A handle 12 is fixed to one side of the member 10, and a plurality of claws 11 that are rotated in the direction of arrow A are provided on the other side. Therefore, when the electronic component 2 is to be removed from the board 1, the claws 11 are first rotated to insert the tip into the above-mentioned gap S, and the electronic component 2 is held between the claws 11 from both sides. Next, the solder surface 1B is heated to melt the solder 5 bonded to the terminal 3, and the handle 12 is pulled in the direction of arrow F to remove it.

However, since such melting of the solder 5 is carried out by visual inspection, it is difficult to judge the melted state.Furthermore, if the solder 5 is not completely melted, there is a problem that the through hole 4 etc. may be damaged during tensioning. Was.

(c) Purpose of the invention The purpose of the invention is to melt the solder fused to the terminal so that it can be pulled out naturally from the through hole, and also to buffer the shock that occurs when pulling out, thereby achieving the above-mentioned effect. This is to provide a product with the problems removed.

(d) Structure of the invention The purpose of the invention is to provide a tool for removing parts from printed circuit boards, which includes a claw for holding an electronic component, a cylinder for driving a shaft to which the claw is engaged, and a tool for fixing the cylinder. and a base plate that supports the base plate at a predetermined interval from the mounting surface of the board, and
This is achieved by a printed circuit board component removal tool characterized in that the cylinder is provided with a spring that applies tension in a predetermined direction to the shaft and an air damper that buffers the impact caused by driving the shaft.

(d) Example of the invention The present invention will be explained in detail below with reference to FIG.
FIGS. 2A and 2B are explanatory diagrams showing an embodiment of a printed circuit board component removal tool according to the present invention.

A base foot 21 that comes into contact with the mounting surface 1A of the board 1 is fixed to one side of the base plate 22, and a shaft 2 is attached to the other side of the base plate 22.
A cylinder 23 that holds 7 in a slidable manner is fixed. At one end of the shaft 27 there is a member 2.
4 is locked, a flange 28 that is slid on the inner periphery of the cylinder 23 is fixed to the middle part, and a handle 27A is provided at the other end. Furthermore, member 24
is provided with a pawl 26 and a link mechanism 25, and the pawl 26
is formed to be rotated in the direction of arrow A by a link mechanism 25, a spring 29 is provided on one side of the flange 28, and the other side is exhausted by a valve 31 fixed to the exhaust hole 23A. An air space 30 is formed and configured.

Therefore, when the electronic component 2 fixed to the substrate 1 is removed, it is performed as shown in FIG. 3A. First, set the base foot 21 so that its tip is in contact with the mounting surface 1B of the board 1, and then push the handle 27A in the direction of arrow F.
to lower the shaft 27 and release the spring 2.
9 is compressed and the member 24 is lowered.
By lowering the member 24, the claw 26 is opened in the direction of arrow A and the tip of the claw 26 is inserted into the gap S. next,
The solder surface 1B is heated to melt the solder 5 fused to the terminal 3. As a result, when the solder 5 is melted, the shaft 27 is raised by the compressive force of the spring 29, and the electronic component 4 is lifted up as shown in FIG.
can be pulled out from the mounting surface 1A of the board 1 in the direction of arrow F. In such a drawer, when the terminal 3 is pulled out from the through hole, the load suddenly decreases, the shaft 27 slides in the direction of arrow _F2 , and the member 24 crashes against the base plate 22, damaging the electronic component 2 etc. that was pulled out. Sometimes I let it happen. Therefore, such a slide is designed so that the air filled in the air spacer 30 is buffered by the compression of the air that is gradually exhausted from the exhaust hole 23A via the valve 31.

With this configuration, there is no need to visually observe the melting of the solder 5 due to heating, and the melting of the solder 5 allows for natural extraction, which facilitates the work.

(f) Effect of the invention As explained above, the invention removes the soldered electronic component 2 from the mounting surface 1A of the board 1 by pulling the claw 26 through the shaft 27 using the compressive force of the spring 29. This is how it was done. As a result, the removal work can be performed more easily than before, and can be performed without damaging the electronic component 2 or the board 1, which has a great practical effect.

[Brief explanation of the drawing]

Figure 1 is an explanatory diagram of the electronic component mounting section, Figure 2 is a perspective view of a conventional printed board component removal tool, and Figure 3
Figures a and b are explanatory diagrams showing one embodiment of a printed board component removal tool according to the present invention. In the figure, 1 is a board, 2 is an electronic component, 3 is a terminal, 4 is a through hole, 5 is solder, 6 is a land,
10 and 24 are members, 11 and 26 are claws, 12 is a handle, 21 is a base foot, 22 is a base plate, 23 is a cylinder,
25 is a link mechanism, 27 is a shaft, 28 is a flange, 29 is a spring, 30 is an air spacer,
31 indicates a valve.

Claims (1)

[Scope of utility model registration request] A printed board component removal tool for removing an electronic component from a printed circuit board by melting solder on the electronic component mounted on the printed circuit board and pulling out a terminal of the electronic component from a through hole of the board, a claw that holds the electronic component;
The cylinder is provided with a cylinder that drives the shaft to which the claw is locked, a base plate to which the cylinder is fixed, and a base foot that supports the base plate at a predetermined interval from the mounting surface of the board. A printed circuit board component removal tool characterized in that a spring that applies tension in a predetermined direction to a shaft and an air damper that cushions the impact caused by driving the shaft are installed therein.