JPS6323345A - Lead frame with fuse - Google Patents
Lead frame with fuseInfo
- Publication number
- JPS6323345A JPS6323345A JP61168602A JP16860286A JPS6323345A JP S6323345 A JPS6323345 A JP S6323345A JP 61168602 A JP61168602 A JP 61168602A JP 16860286 A JP16860286 A JP 16860286A JP S6323345 A JPS6323345 A JP S6323345A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- terminal
- fuse
- ground
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
- H01H85/0415—Miniature fuses cartridge type
- H01H85/0417—Miniature fuses cartridge type with parallel side contacts
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Control Of Voltage And Current In General (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は産業用又は民生用電子回路に使用されるモール
ド形半導体集積回路装置のリードフレームに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame for a molded semiconductor integrated circuit device used in industrial or consumer electronic circuits.
従来、モールド形半導体集積回路装置のリードフレーム
は、第３図に示す様に、ペレット搭載部２及び一端がペ
レッ１−（８）上のパッド（９）とワイヤ（１０）で接
続され他端が外部電極端子３からなるリード端子４が同
一導電体材料にて一体に形成されていた。Conventionally, as shown in FIG. 3, the lead frame of a molded semiconductor integrated circuit device has a pellet mounting portion 2 and one end connected to a pad (9) on the pellet 1-(8) with a wire (10), and the other end connected to a pad (9) on the pellet 1-(8). The lead terminals 4 consisting of the external electrode terminals 3 were integrally formed of the same conductive material.
上述した従来のリードフレームを使用したモールド形半
導体集積回路装置は、ラッチアップ等により電源とグラ
ンド間に過電流が流れ、ベレッｌ−」二の電源及びグラ
ンドのパッドとそれらのリード端子とを接続しているワ
イヤ部１０が発熱する。In the molded semiconductor integrated circuit device using the conventional lead frame described above, an overcurrent flows between the power supply and ground due to latch-up, etc., and the power and ground pads of the bellows are connected to their lead terminals. The wire section 10 that is connected generates heat.
その温度は、モールド樹脂を炭化する温度具」二になり
、ワイヤ部１０を覆っているモールド樹脂が炭化され導
体に変わる。この場合、ワイヤは切れることなく電源電
流は流れ続け、しまいにはモールドが焼損する欠点をも
つ。The temperature reaches a temperature that carbonizes the mold resin, and the mold resin covering the wire portion 10 is carbonized and turned into a conductor. In this case, the wire does not break and the power supply current continues to flow, which has the disadvantage that the mold may eventually burn out.
本発明の目的は、このような欠点を除き、過電流を防止
したヒユーズ付リードフレーム構造を提供することにあ
る。An object of the present invention is to provide a lead frame structure with a fuse that eliminates such drawbacks and prevents overcurrent.
本発明の構成は、モールド形半導体集積回路装置に使用
されるリードフレームにおいて、一端がペレットの電源
パッドおよび接地パッドとそれぞれワイヤーで接続され
、他端が外部電源および外部接地とそれぞれ接続される
各リード端子の一部が、ヒユーズ回路となっていること
を特徴とする。The structure of the present invention is that in a lead frame used for a molded semiconductor integrated circuit device, one end is connected to the power supply pad and the ground pad of the pellet by wires, and the other end is connected to the external power supply and external ground, respectively. A part of the lead terminal is a fuse circuit.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示す平面図である。リード
フレーム１は、ペレット搭載部２と一端がベレット（８
）のパッド（９）とワイヤ（Ｉｎ＞とで接続され、他端
が外部電極端子３からなるリード端子４から構成される
。電源端子５は、外部電極端子３の中で外部電源と接続
する端子であり、又グランド端子６は、外部電極端子３
の中で外部グランドと接続する端子である。電源端子５
とグランド端子６をもつ各リード端子４の一部は、リー
ドフレーム１を形成する時に切れ目を入れておく。この
リードフレーム１の切れ目に高温はんだを流し、電源端
子５とリード端子４及びグランド端子６とリード端子４
を各々接続する。この高温はんだは、ヒユーズの働きを
する。FIG. 1 is a plan view showing one embodiment of the present invention. The lead frame 1 has a pellet loading section 2 and one end with a pellet (8
) is connected by a wire (In>) to a pad (9), and is composed of a lead terminal 4 whose other end is an external electrode terminal 3. A power terminal 5 is connected to an external power source within the external electrode terminal 3. terminal, and the ground terminal 6 is the external electrode terminal 3.
This is the terminal that connects to the external ground inside the device. Power terminal 5
A portion of each lead terminal 4 having a ground terminal 6 and a ground terminal 6 is cut when forming the lead frame 1. Pour high-temperature solder into the cuts in the lead frame 1, connect the power terminal 5 to the lead terminal 4, and connect the ground terminal 6 to the lead terminal 4.
Connect each. This high temperature solder acts as a fuse.
第２図（ａ＞は本実施例のリードフレームを使用したモ
ールド形半導体集積回路装置の透過斜視図、第２図（ｂ
）は第２図（ａ）のリードフレームを使用した時の電源
端子５及びグランド端子６からベレットまでの回路図を
示す。FIG. 2(a) is a transparent perspective view of a molded semiconductor integrated circuit device using the lead frame of this embodiment, FIG. 2(b)
) shows a circuit diagram from the power supply terminal 5 and the ground terminal 6 to the bellet when the lead frame of FIG. 2(a) is used.
モールド形半導体集積回路装置のモールド形成温度は１
．７０℃前後であるため、高温はんだの融点を２２０℃
前後のものを使用すればモールド形成時はんだ溶融は生
じない。The mold forming temperature of a molded semiconductor integrated circuit device is 1
．． Since the temperature is around 70℃, the melting point of high-temperature solder is 220℃.
If the front and rear are used, solder melting will not occur during mold formation.
又、ラッチアップ等により電源とグランド間に過電流が
流れワイヤ１０が発熱した場合、約２２０℃ではんだが
溶断し、電源及びグランドは開放になり、電源グランド
間の電流を止めワイヤ１０の発熱を防ぐ。そのなめモー
ルドの炭化を防止出来モールド焼損を防ぐことが出来る
。In addition, if an overcurrent flows between the power supply and the ground due to latch-up and causes the wire 10 to generate heat, the solder melts at approximately 220°C, the power supply and the ground become open, and the current between the power supply and ground is stopped and the wire 10 generates heat. prevent. Carbonization of the lick mold can be prevented, and mold burnout can be prevented.
以上説明したように、本発明は、モールド形半導体集積
回路装置に使用するリードフレームの電源端子及びグラ
ンド端子をもつリード端子の一部にヒユーズ機能をもた
せることにより、モールド形半導体集積回路装置がラッ
チアップ等により過電流が電源とグランド間に流れた場
合、ヒユーズ・が溶断じ電源、グランド間が開放出来、
過電流によるモールド焼損の欠点を防ぐことができる効
果がある。As explained above, the present invention provides a fuse function to a part of the lead terminal having the power supply terminal and the ground terminal of the lead frame used in the molded semiconductor integrated circuit device, so that the molded semiconductor integrated circuit device can latch. If an overcurrent flows between the power supply and ground due to
This has the effect of preventing mold burnout caused by overcurrent.
第１図は本発明の一実施例のヒユーズ付リードフレーム
の平面図、第２図（ａ＞、（ｂ）は本実施例のリードフ
レームを用いて組立てたモールド形集積回路の透過斜視
図およびその回路図、第３図は従来のリードフレームの
一例の平面図である。
ｌ・・・リードフレーム、２・・・ペレット搭載部、３
・・・外部電極端子、４・・・リード端子、５・・・電
源端子、６・・・グランド端子、７・・・ヒユーズ、８
・・・ペレット、９・・・バ・ソド、１０・・・ワイヤ
。FIG. 1 is a plan view of a lead frame with a fuse according to an embodiment of the present invention, and FIGS. 2(a) and 2(b) are transparent perspective views of a molded integrated circuit assembled using the lead frame of this embodiment The circuit diagram, FIG. 3, is a plan view of an example of a conventional lead frame. 1. Lead frame, 2. Pellet mounting section, 3.
...External electrode terminal, 4...Lead terminal, 5...Power terminal, 6...Ground terminal, 7...Fuse, 8
...Pellet, 9...Bath, 10...Wire.
Claims (1)
ームにおいて、一端がペレットの電源パッドおよび接地
パッドとそれぞれワイヤーで接続され、他端が外部電源
および外部接地とそれぞれ接続される各リード端子の一
部が、ヒューズ回路となっていることを特徴とするヒュ
ーズ付リードフレーム。In a lead frame used in a molded semiconductor integrated circuit device, a portion of each lead terminal is connected at one end to the power supply pad and ground pad of the pellet with wires, and at the other end to an external power supply and external ground, respectively. A lead frame with a fuse, characterized by having a fuse circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61168602A JPS6323345A (en) | 1986-07-16 | 1986-07-16 | Lead frame with fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61168602A JPS6323345A (en) | 1986-07-16 | 1986-07-16 | Lead frame with fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6323345A true JPS6323345A (en) | 1988-01-30 |
Family
ID=15871099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61168602A Pending JPS6323345A (en) | 1986-07-16 | 1986-07-16 | Lead frame with fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6323345A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4868627B1 (en) * | 2011-08-26 | 2012-02-01 | 淳致 萬谷 | A kit consisting of PCa for forming a solid base rising part. |
-
1986
- 1986-07-16 JP JP61168602A patent/JPS6323345A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4868627B1 (en) * | 2011-08-26 | 2012-02-01 | 淳致 萬谷 | A kit consisting of PCa for forming a solid base rising part. |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4533896A (en) | Fuse for thick film device | |
| US4942308A (en) | Power transistor monolithic integrated structure | |
| GB1245610A (en) | Improvements in and relating to semiconductor devices | |
| JPS6323345A (en) | Lead frame with fuse | |
| EP0305993A2 (en) | Power semiconductor device having electrode structures | |
| JPS5919361A (en) | Semiconductor device | |
| JPS5911695A (en) | Hybrid integrated circuit device | |
| JPH0453147A (en) | Semiconductor integrated path | |
| US3806776A (en) | Improvement for connecting a two terminal electronical device to a case | |
| JPH04320364A (en) | Integrated circuit device and casing therefor | |
| JPS59229849A (en) | Power transistor | |
| JPH11273522A (en) | Current/thermal fuse | |
| JPH0648877Y2 (en) | Semiconductor device | |
| JPS61137333A (en) | Transistor | |
| JPH0627957Y2 (en) | Power transistor | |
| JPH02177354A (en) | Semiconductor element | |
| JPH0638350Y2 (en) | Temperature fuse | |
| JPS5838954U (en) | temperature fuse | |
| JPH01158741A (en) | Semiconductor device | |
| JPH05259211A (en) | Semiconductor device | |
| JPS61245437A (en) | Fuse | |
| JPS59214249A (en) | Composite type power transistor | |
| JPS6329564A (en) | Semiconductor device and lead frame | |
| JPS59225553A (en) | Semiconductor device | |
| JPH01133698A (en) | Solder |