JPS6327042U - - Google Patents
Info
- Publication number
- JPS6327042U JPS6327042U JP12117486U JP12117486U JPS6327042U JP S6327042 U JPS6327042 U JP S6327042U JP 12117486 U JP12117486 U JP 12117486U JP 12117486 U JP12117486 U JP 12117486U JP S6327042 U JPS6327042 U JP S6327042U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- bonding
- bonding stage
- substrate
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims 1
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例を示す正面図、第２
図は第１図のボンデイングステージの動作を説明
するための正面図で、ａは高さの高い半導体素子
を、ｂは高さの低い半導体素子を搭載した状態を
示す図である。
１……ボンデイングステージ、２……ＸＹ軸テ
ーブル、３……Ｚ軸テーブル、４……カメラ、５
……ダイボンデイングアーム、６……基板、７，
８……半導体素子。
Figure 1 is a front view showing one embodiment of the present invention;
The figure is a front view for explaining the operation of the bonding stage shown in FIG. 1, in which "a" shows a state in which a high-height semiconductor element is mounted, and "b" shows a state in which a short-height semiconductor element is mounted. 1... Bonding stage, 2... XY-axis table, 3... Z-axis table, 4... Camera, 5
...Die bonding arm, 6...Substrate, 7,
8...Semiconductor element.
Claims (1)
前記基板上に載置する半導体素子を把持するダイ
ボンデイングアームと、前記半導体素子の位置決
めを行うため前記ボンデイングステージを平面内
で互に直角方向に移動させるＸＹ軸テーブルと、
前記半導体素子を拡大して観察する光学装置とを
備えるワイヤボンデイング装置において、前記ボ
ンデイングステージを前記ＸＹ軸テーブルの運動
面と垂直方向に運動させるＺ軸テーブルを備える
ことを特徴とするワイヤボンデイング装置。 A bonding stage for mounting a substrate on the upper surface, a die bonding arm for gripping a semiconductor element placed on the substrate, and an XY axis for moving the bonding stage in mutually orthogonal directions within a plane to position the semiconductor element. table and
and an optical device for magnifying and observing the semiconductor element, the wire bonding apparatus comprising a Z-axis table that moves the bonding stage in a direction perpendicular to a plane of movement of the XY-axis table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12117486U JPS6327042U (en) | 1986-08-06 | 1986-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12117486U JPS6327042U (en) | 1986-08-06 | 1986-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6327042U true JPS6327042U (en) | 1988-02-22 |
Family
ID=31010194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12117486U Pending JPS6327042U (en) | 1986-08-06 | 1986-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6327042U (en) |
-
1986
- 1986-08-06 JP JP12117486U patent/JPS6327042U/ja active Pending
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