JPS63289896A - 高密度多層基板の製造法 - Google Patents

高密度多層基板の製造法

Info

Publication number
JPS63289896A
JPS63289896A JP12248687A JP12248687A JPS63289896A JP S63289896 A JPS63289896 A JP S63289896A JP 12248687 A JP12248687 A JP 12248687A JP 12248687 A JP12248687 A JP 12248687A JP S63289896 A JPS63289896 A JP S63289896A
Authority
JP
Japan
Prior art keywords
copper
conductor
weight
less
tio2
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12248687A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0552078B2 (2
Inventor
Kazuo Kondo
和夫 近藤
Asao Morikawa
森川　朝男
Hiroshi Iwata
浩 岩田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP12248687A priority Critical patent/JPS63289896A/ja
Priority to US07/133,817 priority patent/US4871608A/en
Priority to US07/196,408 priority patent/US4837408A/en
Publication of JPS63289896A publication Critical patent/JPS63289896A/ja
Publication of JPH0552078B2 publication Critical patent/JPH0552078B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP12248687A 1986-12-10 1987-05-21 高密度多層基板の製造法 Granted JPS63289896A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP12248687A JPS63289896A (ja) 1987-05-21 1987-05-21 高密度多層基板の製造法
US07/133,817 US4871608A (en) 1986-12-10 1987-12-10 High-density wiring multilayered substrate
US07/196,408 US4837408A (en) 1987-05-21 1988-05-20 High density multilayer wiring board and the manufacturing thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12248687A JPS63289896A (ja) 1987-05-21 1987-05-21 高密度多層基板の製造法

Publications (2)

Publication Number Publication Date
JPS63289896A true JPS63289896A (ja) 1988-11-28
JPH0552078B2 JPH0552078B2 (2) 1993-08-04

Family

ID=14837039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12248687A Granted JPS63289896A (ja) 1986-12-10 1987-05-21 高密度多層基板の製造法

Country Status (1)

Country Link
JP (1) JPS63289896A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5120473A (en) * 1987-10-12 1992-06-09 Ngk Spark Plug Co., Ltd. Metallizing composition for use with ceramics

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5120473A (en) * 1987-10-12 1992-06-09 Ngk Spark Plug Co., Ltd. Metallizing composition for use with ceramics

Also Published As

Publication number Publication date
JPH0552078B2 (2) 1993-08-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees