JPS6329535A - Wire bonder - Google Patents

Abstract

PURPOSE:To obtain a perfect wire bonding state, in a thermocompressing bonding type wire bonder, by providing a local heater, which locally heats a wire bonding part, thereby using the conventional thermocompressing bonding and/or ultrasonic waves. CONSTITUTION:A driving part 8 is made to work on a lead frame 2, which is heated by a heat block 1 based on the data of a position recognizing part 7. A local heater 9 is operated only during bonding, and heat shortage on a chip 10 is replenished. Under this state, ball bonding is performed. Thereafter, a capillary 4 is moved to the side of the lead frame. The local heater 9 is operated again only during the bonding, and stitch bonding is performed. Thereafter, a wire 5 is fused and cut with a torch 6, and a ball part is formed. Then, for another electrode on the chip 10, the local heater 9 is operated only during the bonding, and heat shortage on the chip 10 is replenished. Under this state, the ball bonding is performed. Since the bonding is performed with the heat shortage at the bonding part being replenished, high quality wire bonding can be performed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire bonder for semiconductor devices.

[Conventional technology]

FIG. 2 is a schematic diagram of a conventional thermocompression type wire bonder. In the figure, l is a heat block part, 2 is a transistor lead frame with a chip attached to the heat block part 1, and 3 is a bonding arm. , 4 is a capillary set at the tip of the bonding arm 3, 5 is a wire set in the capillary 4, 6 is a torch for melting the wire 5, 7 is a wire bond position recognition unit, and 8 is a bonding head drive unit It is.

Next, the operation will be explained. The bonding head drive section 8 is operated to perform ball bonding on the chip 10 as programmed in advance based on the information of the wire bond position recognition section 7 on the transistor lead frame 2 heated by the heat block section 1, and then the capillary is placed on the chip 10. 4 is moved to the lead frame side and stitch bonding is performed, and then the wire 5 is cut by melting with a torch 6 to form a ball. Next, ball bond the other two electrodes on the chip 10, then move the cavity 4 to the other lead flannel side and perform stitch bonding.
Thereafter, the wire is melted again using the torch 6 to form a ball. This completes the wire bonding of one transistor.

[Problem that the invention seeks to solve]

Conventional thermocompression type wire bonders are constructed as described above, but in the case of chips using gold or silicon solder, bonding is difficult because heat dissipates easily in the case of semiconductor device frame materials with high thermal conductivity. This could not be used because the parts tend to run out of heat, so thermocompression bonding and ultrasonic waves were used in combination, but this also resulted in wire bonding problems and quality deterioration.

Further, in the case of chips using low melting point solder or epoxy resin solder, there is a problem that they cannot be used because they are heated and melted by the heat block l.

This invention was made to solve the above problems, and by using conventional thermocompression bonding or even ultrasonic waves, it is possible to obtain a perfect wire bonding state, and it is possible to obtain a perfect wire bonding condition without using solder or solder. The purpose of the present invention is to provide a wire bonder that can be used even for chips using epoxy resin solder.

[Means to solve the problem]

The wire bonder according to the present invention is a thermocompression type wire bonder that is provided with a local heating device that locally heats the wire bonding portion.

[For 1 item] In the present invention, since the above-mentioned local heating device is provided in the thermocompression type wire bonder, it is possible to compensate for the lack of heat in conventional thermocompression bonding and obtain a perfect wire bonding state. Further, even in chips using solder solder or epoxy resin solder, this thermocompression type wire bonder can be used by heating only the wire bonding part locally without heating by the heat block part.

〔Example〕

An embodiment of the present invention will be described below.

In FIG. 1, ■ is a heat block part, 2 is a transistor lead frame with a chip attached to the heat block part 1, 3 is a bonding arm, 4 is a capillary attached to the tip of the bonding arm 3, and 5 is a capillary attached to the tip of the bonding arm 3. is a wire set in the cavity 4, 6 is a torch for fusing the wire 5, 7 is a wire bond position recognition unit, 8 is a bonding head drive unit, and 9 is linked to the movement of the bonding head drive unit 8 in the X and Y directions. This is a local heating device designed to locally heat the bonding area. As this local heating device 9, for example, a laser beam device can be used.

Next, the operation will be explained. On the transistor lead frame 2 heated by the heat block section 1, the wire bonding hand drive section 8, which is programmed in advance based on the information of the wire bonding point ΔΔ section 7, is operated, and the local heating device 9 is operated only during bonding. While operating the chip 10 and making up for the lack of heat on the chip 10, ball bonding is performed.
After that, move capillary 4 to the lead frame side,
Again, the local heating device 9 is operated only during bonding to perform stitch bonding while compensating for the lack of heat on the lead frame side, and then the torch 6 fuses the wire 5 to form a pole portion. To shovel snow,
The local heating device 9 is operated only during bonding to perform ball bonding while compensating for the lack of heat on the chip IO, and then the capillary 4 is moved to the lead frame side, and the local heating device 9 is operated again only during bonding, and the lead frame is heated. Stitch bonding is performed while making up for the lack of heat on the side, and then the wire 5 is fused with a torch 6 to form a ball. As described above, since the bonding is performed while compensating for the lack of heat in the bonding part, a high quality wire bond can be obtained. Furthermore, if ultrasonic waves are also used, higher quality wire bonds can be obtained.

In addition, although the above example shows the case where bonding is performed in combination with thermocompression bonding, it can also be used for chips using solder solder or epoxy resin solder by turning off the heater in the heat block section or lowering the temperature. Applicable.

Further, in the above embodiment, the case of 1,000 knobs of transistors is shown, but the chip is not limited to this, and may include diodes, ICs, etc.
etc., and the present invention can be used as a wire bonder for any semiconductor device.

〔Effect of the invention〕

As described above, according to the present invention, a thermocompression type wire bonder is provided with a local heating device that locally heats the wire bonding part, so that the local heating and thermocompression bonding, or even ultrasonic waves, can be performed. By using together,
This has the effect of providing a high quality wire bonding state. Further, this thermocompression type wire bonder can be used for chips using semiconductor solder or epoxy resin solder.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing a wire bonder according to an embodiment of the present invention, and FIG. 2 is a schematic diagram showing a conventional thermocompression type wire bonder. 9...Local heating device. Note that the same reference numerals in the figures indicate the same or equivalent parts. Figure 1

Claims (2)

[Claims] (1) A wire bonder of thermocompression type, characterized in that it is equipped with a local heating device that locally heats a wire bonding part. (2) The wire bonder according to claim 1, wherein a laser beam device is used as the local heating device.