JPS63309A - Epoxy resin composition for sealing semiconductor - Google Patents

Abstract

PURPOSE:To obtain the title composition which can give a resin-sealed semiconductor device of improved reliability of moisture resistance, by incorporating therein a fluorocarbon-containing epoxy resin in addition to an epoxy resin as the principal component. CONSTITUTION:An epoxy resin composition formed by adding a fluorocarbon- containing epoxy resin to a resin composition containing an epoxy resin as the principal component. An example of a resin which is particularly useful among the fluorocarbon-containing epoxy resins is an epoxy resin of the formula 9wherein part of F atoms may be replaced by H atoms or halogen atoms). The epoxy resin of said formula can be advantageously used in an amount of 3-30wt%, based on the total weight of the composition. When this amount is below 3wt%, neither high-temperature electrical property nor moisture resistance can be improved, while when it is above 30wt%, the high-temperature electrical property and moisture resistance are impaired.

Description

[Detailed Description of the Invention] [Summary] Semiconductor devices and other electronic circuit components (hereinafter collectively referred to as “
Disclosed is an epoxy resin composition for encapsulating a semiconductor (referred to as "semiconductor"). The epoxy resin composition for encapsulation of the present invention is characterized in that it contains a fluorinated carbon-containing epoxy resin as one of its components. According to the present invention, it is possible to provide an electronic component that is highly reliable even after being left in a hot and humid state for a long time.

[Industrial application field]

The present invention relates to a composition for semiconductor encapsulation. More specifically, the present invention relates to an epoxy resin composition for semiconductor encapsulation, which contains at least an epoxy resin containing fluorinated carbon in addition to an epoxy resin as a main component. The encapsulating composition of the present invention can be advantageously used as a encapsulating resin in the field of semiconductor devices and electronic circuit components, where demands for higher density and higher reliability are strong.

[Conventional technology]

Conventionally, epoxy resin has been widely used as a sealing resin for sealing semiconductor devices such as ICs and LSIs and other electronic circuit components. This is because epoxy resins generally exhibit superior electrical, mechanical, and thermal properties when cured using curing agents such as amines, acid anhydrides, and phenolic resins. It is.

By the way, if electronic components sealed with resin are left in high temperature and high humidity conditions for a long period of time, water from the outside can enter the puff cage through the resin bulk and gaps between the resin, lead wires, and elements, causing damage to the elements. There is a problem in that the aluminum wiring and the aluminum in the bonding pad part corrode, causing wire breakage. As a countermeasure for such a problem, for example, there is a coupling agent treatment on the surface of the element. Camping agents include epoxysilane, methyltrimethoxysilane, 3-
Glycidoxyprobyltrimethoxysilane and the like are used. Alternatively, instead of this coupling agent treatment, efforts are being made to improve the purity of the raw material and reduce the stress of the resin.

[Problem that the invention seeks to solve]

However, the above-mentioned measures cannot be considered perfect in providing electronic components with high reliability even after being left in high temperature and high humidity conditions for a long time. Above all, the suppression of moisture permeable water and moisture absorption in the resin bulk cannot be said to be sufficient. Therefore, countermeasures against this problem have become a very important issue in improving the moisture resistance of resin-sealed semiconductor devices.

[Means for solving problems]

According to the present invention, the above-mentioned problems can be solved by an epoxy resin composition for semiconductor encapsulation having an epoxy resin as a main component and additionally containing a fluorocarbon-containing epoxy resin. .

The fluorinated carbon-containing epoxy resin used in the epoxy resin composition of the present invention is characterized in that it contains fluorinated carbon (
CF) n (in the formula, n is a natural number) and is not particularly limited as long as it provides the desired effect. An example of a particularly useful fluorinated carbon-containing epoxy resin is the following formula (): where F may be partially substituted with hydrogen or other halogen atoms. This formula (
The epoxy resin of 1) can be advantageously used in an amount of 3 to 30% by weight based on the total weight of the composition. If the amount of epoxy resin is less than 3% by weight, neither the high temperature electrical properties nor the moisture resistance will improve; if the amount of epoxy resin is 30% by weight, the high temperature electrical properties will not improve. , moisture resistance, etc. will be impaired.

The epoxy resin used in the present invention is commonly known and is not particularly limited. Examples of epoxy resins that can be advantageously used include glycidyl ether type epoxy resins, glycidyl ester type epoxy resins, linear aliphatic epoxy resins such as bisphenol A type epoxy resins, phenol-novolac type epoxy resins, and talesol-novolank type epoxy resins. Examples include epoxy resins having two or more epoxy groups in the molecule, such as cycloaliphatic epoxy resins, heterocyclic epoxy resins, and halogenated epoxy resins. These epoxy resins may be used alone or in combination of two or more. Moreover, these epoxy resins preferably have a chlorine ion content of 0.1% by weight or less. Among the above-mentioned epoxy resin groups, glycidyl ether type epoxy resins are particularly preferred, and when novolak type epoxy resins having an epoxy equivalent of 170 to 300 are used, the polymerization reaction can proceed easily and the most excellent properties can be obtained. be able to.

The epoxy resin composition of the present invention includes, in addition to the above-described epoxy resin as the main component and the fluorinated carbon-containing epoxy resin as an additive, a curing agent, preferably a curing agent for epoxy resin having a phenolic hydroxyl group, and a curing accelerator. Advantageously and usually necessarily included. Useful curing agents include phenolic resins and polyhydric phenol compounds, specifically novolac-type phenolic resins such as phenol novolac resins and Talesol novolak resins, cresol-type phenolic resins, bisphenol A, and the like. Among these, novolak type phenol resin is most preferred since it undergoes a polymerization reaction with epoxy resin. Additionally, useful curing accelerators generally include tertiary amines, imidazoles, organic phosphine compounds, metal chelates a, and the like. Among these, organic phosphine compounds are most useful as curing accelerators. These curing accelerators can be used alone or in combination of two or more. These curing accelerators are used in a weight ratio of 0 to 100 parts by weight of the epoxy resin.
．． Advantageously, amounts in the range from 0.01 to 10.0 are used.

Furthermore, in the present invention, powders such as silica, alumina, titania calcium carbonate, aluminum silicate, zirconium silicate, glass, mica, and carbon, short fiber fillers, fatty acids, and waxes may be used depending on the purpose of use. Coupling agents such as epoxysilanes, aminosilanes, alkyl titanate compounds, and flame retardants such as antimony and phosphorus compounds and halogen-containing compounds can be added to the composition.

The resin composition for semiconductor encapsulation of the present invention contains the above-mentioned components,
Using common means such as rolls, kneaders, co-kneaders, etc.
It can be prepared by heating and kneading at a temperature of about 60 to 80°C. The composition thus obtained can be cured in a short time at temperatures of about 160-190°C.

〔Example〕

In order to confirm the effects of the present invention, the following four
Examples of species were carried out.

0-Taresol novolanc type epoxy resin (epoxy equivalent: 11200), novolak type phenol resin (hydroxyl equivalent: 103) as a hardening agent, silica powder as a filler, triphenylphosphine as a curing accelerator, red as a flame retardant. phosphorus, carbon black as a coloring agent, ester wax as a mold release agent, Hoechstwanx E (
(trade name) and epoxysilane as a camping agent were blended in the predetermined amounts shown in Table 1 below to obtain four types of blends.

Below is the blank space - Table 2 Ingredients Compounding amount (parts by weight) on the plate
Practical Pilgrimage ±1 High School Base Le Comparison Block Silica Powder 400
400 400 400 triphenylnesfine 2 2
2 2 red phosphorus 5
5 5 5 carbon black
1 1 1
1 epoxy silane 2 2
2 2 The above formulation was then heated at 70-80°C.
After heating and kneading with this roll for 7 to 8 minutes,
It was cooled and coarsely pulverized to obtain the desired resin composition for semiconductor encapsulation. Using each of the above resin compositions, a 256 Bisoto Dynamink RAM memory LSI (16 pins) was sealed using a transfer molding machine.

Molding conditions were 175°C, 2.5 minutes, 70kg/CrA.
Met. Next, the obtained LSI sealed product was subjected to a Pusher-Kutsker bias test (hereinafter referred to as PCT test). The PCT test is performed on LSI sealed products at 121°C.
It was placed in a PCT pot under atmospheric pressure and 100% RH (relative humidity), and after a predetermined standing time, it was taken out and the electrical continuity of the LSI was checked to see if there was any corrosion or breakage of the aluminum wiring on the device. The results shown in Table 2 below were obtained. In addition, in the case of this test, 100 test pieces were created for each sealed product. The numerical values in the table indicate the number of corrosion breaks in the aluminum wiring after the stated standing time.

The results in Table 2 above prove that the resin composition for semiconductor encapsulation according to the present invention has excellent moisture resistance.

〔Effect of the invention〕

According to the present invention, highly reliable electronic components can be obtained even after being left in high temperature and high humidity conditions for a long time.

Claims (1)

[Scope of Claims] 1. An epoxy resin composition for semiconductor encapsulation having an epoxy resin as a main component, which additionally contains a fluorocarbon-containing epoxy resin. 2. The fluorocarbon-containing epoxy resin has the following formula (I
), the epoxy resin composition according to claim 1. ▲There are mathematical formulas, chemical formulas, tables, etc.▼...(I) (In the formula, F may be partially substituted with hydrogen or other halogen atoms) 3. The fluorocarbon-containing epoxy resin is 3- Epoxy resin composition according to claim 2, in an amount of 30% by weight.