JPS6331494B2 - - Google Patents

Description

Claim 1 A(1) General formula general formula general formula general formula general formula or general formula (Each A and A' is independently a divalent hydrocarbyl group having 1 to 12 carbon atoms, -S
--, --S-S-,

【formula】 【formula】

【formula】 Or -O-; each B independently has the general formula

【formula】 is represented by; each B′ is independently a general formula

【formula】 is represented by; each B″ is independently a general formula

Each R is independently hydrogen or an alkyl group having 1 to 4 carbon atoms; each Q is independently hydrogen or a hydrocarbyl group having 1 to 10 carbon atoms; each
R' is independently hydrogen, a hydrocarbyl group or hydrocarbyloxy group having 1 to 10 carbon atoms, or a halogen; m is n-
1; m′ is n′-1; m″ is n″-1
each n, n' and n'' are independently from 0 to 3; q is from 0 to 4; each y is independently from 1 to 5 on average; y' is on average from 0 to 3; and z and z' are independently 0 to 3); (2)(a) at least one epoxy resin as defined in component (A-1); and (b) ) general formula

[Formula] or general formula (wherein A is as defined above; each Y is independently hydrogen, halogen, or a hydrocarbyl group having 1 to 10 carbon atoms; or
is a hydrocarbyloxy group; and n is 0
or 1), in which the ratio of phenolic hydroxy groups to epoxide groups is from 0.01:1 to 0.5:1.
Component (A-2-a) and component (A-2-b) are present in amounts such that (3) a mixture thereof; at least one of; and B general formula

[Formula] or general formula (wherein A, Y and n are as described above;
each X is independently a halogen; and component (A) and component (B) have a ratio of phenolic hydroxyl groups to epoxide groups of 0.7:1. A curable composition characterized in that it is present in an amount such that it is ~1.1:1. 2 further comprising (C), a catalytic amount of at least one catalyst for carrying out the reaction of component (A) and component (B); and (D), component (A), component (B), component (C) and Claim 1, characterized in that it contains 0 to 50% by weight of at least one solvent based on the total weight of component (D).
Compositions as described in Section. 3 Furthermore, the general formula; (wherein each R ¹ is independently hydrogen, a hydrocarbyl group having 1 to 10 carbon atoms, or a halogen, and R ² is a hydrocarbyl group having 1 to 10 carbon atoms) A composition according to claim 1, characterized in that it contains a stabilizer. 4 Component (A) is represented by the formula () or () [in the formula Q,
R and R' are hydrogen; q is 0.1 to 2 on average], and component (B) is a compound represented by formula (X) [wherein A is 1 to 6] a divalent hydrocarbyl group having carbon atoms; each X is bromine; and n is 1. 5 Component (A) has the formula () [wherein A' has 1 to 4 carbon atoms; and each R and R' is hydrogen]
is a component (A-1) represented by the formula (A-1), and the component (B) is a compound of the formula () [wherein A is a divalent hydrocarbyl group having 1 to 6 carbon atoms; each X is bromine; and n is 1]. The composition according to claim 1. 6 Component (A) is represented by the formula () or () [in the formula, each Q,
R and R′ are hydrogen; and component (B) is a divalent hydrocarbyl group having 1 to 6 carbon atoms; each X is bromine; and n
is 1]. The composition according to claim 1, wherein 7. Component (A) is a component (A-1) represented by the formula () [in which each Q and R' are hydrogen]; and component (B) is a component (A-1) represented by the formula () [in the formula, A is A composition according to claim 1, characterized in that it is a hydrocarbyl group having from 1 to 6 carbon atoms; each X is bromine; and n is 1. Description The present invention relates to a curing composition containing a polyglycidyl ether of a polyphenol and a halogenated bisphenol. Compositions containing glycidyl ethers of bisphenols and halogenated bisphenols have been used in the production of electrical laminates. However, this generally has drawbacks in one or more properties such as thermal properties, moisture resistance and high temperature mechanical strength. The present invention provides a curing composition that provides a curing composition that is improved in one or more properties selected from thermal stability, glass transition temperature, high-temperature mechanical strength, moisture resistance, chemical resistance, and stiffness. It is something. (A) (1) A divalent hydrocarbyl group in which each A and A' independently have from 1 to 12 carbon atoms;
-S-, -S-S-,

【formula】 【formula】

[Formula] Or -O-; Preferably, each A
is a divalent hydrocarbyl group independently having 1 to 6 carbon atoms, and each A' is independently 1 to 6 carbon atoms.
is a divalent hydrocarbyl group having 4 carbon atoms; each B is of the general formula is represented by; each B′ is represented by the general formula is represented by; each B″ is the general formula each R is independently hydrogen or an alkyl group having 1 to 4 carbon atoms; each Q is independently hydrogen or a hydrocarbyl group having 1 to 10 carbon atoms; R′ is independently hydrogen, a hydrocarbyl group or hydrocarbyloxy group having 1 to 10 carbon atoms, or a halogen;
m is n-1; m′n′-1; m″ is
n″−1; each n, n′, and n″ are independently 0
-3; preferably n is 1; q is 0-4, preferably 0.1-2, more preferably
0.5 to 1.5; each y independently has an average of 1 to 5; y′ has an average of 0 to 3; and z and
z' is independently 0 to 3; formula (), (),
At least one epoxy resin represented by (), (), () or (); (2)(a) At least one epoxy resin represented by the formula () as defined in component (A-1); and (b) A is a divalent hydrocarbon group having 1 to 12 carbon atoms, -S-, -S-S-,

【formula】 【formula】

[Formula] or -O-; each y is independently hydrogen, halogen, or a hydrocarbyl group or hydrocarbyloxy group having 1 to 10 carbon atoms; and n is 0
or 1; and the ratio of phenolic hydroxyl groups to epoxide groups is
0.01:1 to 0.5:1, preferably 0.05:1 to
0.25:1, more preferably 0.1:1~
component (a) and (b) in such amounts as to be 0.2:1;
The expression () or () in which the component exists
at least one divalent phenol represented by; or (3) a mixture thereof; at least one of the following; and (B) A has 1 to 12 carbon atoms, preferably 1 to 6 carbon atoms. a divalent hydrocarbyl group having -S-,
-S-S-,

【formula】 【formula】

[Formula] or -O-; each X is halogen, preferably bromine; each Y is independently hydrogen, halogen, or a hydrocarbyl or hydrocarbyloxy group having 1 to 10 carbon atoms; and at least one halogenated dihydric phenol represented by formula () or (), where n is 0 or 1; and component (A) and component (B) have a ratio of phenolic hydroxyl groups to epoxide groups. 0.7:1
1.1:1, preferably 0.85:1 to 1:1, more preferably 0.9:1 to 0.95-1. The composition further comprises, optionally, (C) a catalytic amount of at least one catalyst for carrying out the reaction of components (A) and (B); and (D) (A), (B), (C). and (D) 0 to 0 based on the total weight of component
50% by weight, preferably 10-45% by weight, more preferably 30-40% by weight of at least one solvent; The invention further relates to materials impregnated with the aforementioned compositions and laminates made therefrom. General formula () General formula () General formula () General formula () General formula () General formula () General formula () General formula () General formula () General formula () Particularly suitable epoxy resins that may be used herein are:
For example, triglycidyl ether of tris(hydroxyphenyl)methane, polymeric homologs thereof, divalent phenol-modified tris epoxides, phenol-formaldehyde epoxy-novolac resins, cresol-formaldehyde epoxy novolac resins, resorcinol-formaldehyde epoxy novolac resins, lac resins, phenol-glyoxal epoxy novolac resins, and mixtures thereof. Particularly suitable dihydric phenols and halogenated dihydric phenols are, for example, bisphenol A, tetrabromobisphenol A, bisphenol S, tetrabromobisphenol S, bisphenol, tetrabromobisphenol, tetrabromodihydroxybenzophenone. , resorcinol, tetrabromoresorcinol and mixtures thereof. Multifunctional phenolic compounds having an average of more than two functional groups can be used in the present invention, if desired, in conjunction with diphenolic compounds to improve the curing properties of the composition. Particularly suitable polyfunctional phenolic compounds are, for example, phenol formaldehyde condensates with an average functional number of 3 to 8;
These are a phenol hydroxybenzaldehyde condensate having an average number of functional groups of 3 to 7, and a cresol-formaldehyde condensate having an average number of functional groups of 3 to 8. Suitable catalysts for carrying out the reaction of epoxy resins with phenolic hydroxy-containing compounds are, for example, US Pat. No. 3306872; 3341580;
3379684; 3477990; 3547881; 3637590;
3843605; 3948855; 3956237; 4048141;
4093650; 4131633; 4132706; 4171420;
4177216; 4302574; 4320222; 4358578;
4366295; and 4389520; Suitable catalysts are quaternary phosphonium compounds and quaternary ammonium compounds, such as ethyltriphenylphosphonium chloride, ethyltriphenylphosphonium bromide, ethyltriphenylphosphonium iodide, ethyltriphenylphosphonium acetate, ethyltriphenylphosphonium diacetate (ethyltriphenylphosphonium diacetate) triphenylphosphonium acetate/acetic acid complex),
Ethyl triphenylphosphonium tetrahaloborate, tetrabutylphosphonium chloride,
Tetrabutylphosphonium acetate, tetrabutylphosphonium diacetate (tetrabutylphosphonium acetate/acetic acid complex), tetrabutylphosphonium tetrahaloborate,
Butyl triphenylphosphonium tetrabromobisphenate, butyl triphenylphosphonium bisphenate, butyl triphenyl phosphonium bicarbonate, benzyl trimethyl ammonium chloride, benzyl trimethyl ammonium hydroxide, benzyl trimethyl ammonium tetrahaloboreate, tetramethyl ammonium hydroxy tetrabutylammonium hydroxide, tetrabutylammonium tetrahaloborate, and mixtures thereof. Although any suitable amount of catalyst may be used, suitable amounts are based on the weight of the reactants:
0.001 to 10% by weight, more preferably 0.05%
~5% by weight. Other suitable catalysts are tertiary amines, such as triethylamine, tripropylamine, tributylamine, 2-methylimidazole, benzyldimethylamine and mixtures thereof. Further suitable catalysts are ammonium compounds, such as triethylammonium chloride, triethylammonium bromide, triethylammonium iodide, triethylammonium tetrahaloborate, tributyl-ammonium chloride, tributylammonium bromide, tributylammonium iodide, tributylammonium tetrahaloborate, N,N'-dimethyl-1,2-diaminoethane-tetrahaloborate complex, and mixtures thereof. Further suitable catalysts include, for example, fluorocarbons, fluoroarsenics, etc. with suitable non-nucleic acids.
tertiary and quaternary ammonium, phosphonium and arsenic adducts or complexes with fluoroantimonics, fluorophosphorics, perchlorics, perbromics, periodics, and mixtures thereof. Suitable solvents that can be used here are, for example, ketones, alcohols, glycol ethers and amides, such as acetone, methyl ethyl ketone, methanol, propylene glycol monomethyl ether and dimethyl formamide. The compositions of the present invention may further contain stabilizers, pigments, dyes, mold release agents, flow control agents, reinforcing agents, fillers, flame retardants, rubber modifiers, surfactants, accelerators, if desired.
It can contain reaction diluents and mixtures thereof. Suitable stabilizers that can be used here are, for example, those represented by the following general formula. (wherein each R ¹ is independently hydrogen, a hydrocarbyl group having 1 to 10 carbon atoms, or a halogen, and R ² is a hydrocarbyl group having 1 to 10 carbon atoms). Particularly suitable stabilizers are, for example, methyl p-toluenesulfonate, ethyl p-toluenesulfonate, methylchlorobenzenesulfonate, and mixtures thereof. A preferred stabilizer is methyl p
-Toluene sulfonate. The stabilizer may be used in any suitable stabilizing amount, but preferred amounts are from 0.001 to 10% by weight, based on the weight of the epoxy resin component, and more preferably
It is 0.01 to 2% by weight. The compositions of the present invention are suitable for applications such as permeable substrates, as well as coatings, adhesives, molding,
It is suitable as an electronic capsule and also as a container. Suitable substrates that can be used here are, for example, woven, matte or non-woven fibers or filaments of glass, carbon, graphite, synthetic fibers, quartz and mixtures thereof. The impregnated substrate can be cured using conditions known in the literature. Structural or electrical laminates or composites are made from one or more layers of cured substrates or combination substrates. Electrical laminates typically have at least one outer layer of electrically conductive material.
The preferred conductive material is copper. The following examples illustrate the invention, but are not intended to limit its scope in any way. Measuring Breaking Strength (G _1c ) The method for measuring G _1c (breaking strength or “critical strain energy release rate”) is the same for positive materials.
Based on ASTM E-399. This is primarily about metals. The simple tension test is now widely used and is described in J. Mater. Sci. Vol. 16, 2657, 1981. Each test piece is approximately 1″ (25.4mm) thick from a regular 1/8″ (3.175mm) thick flat molding.
Cut it into square pieces. I cut a dovetail notch about 1/4" (6.25mm) deep in the center of one end. I then inserted a razor blade into the notch and tapped it lightly to create a slight crack. Next, I cut an ASTM E-
Drill two holes near the ant groove as described in 399,
The test piece was pinned to the Instron tester. Then sample at 0.02inch/min
The test speed (0.0085 min/sec) was increased to measure the force required to enlarge the opening of a crack that had been pre-tightened. This force, along with the desired sample size and actual pre-crack length, was used in the formula described in ASTM-E-399 to calculate the "stress increase factor" Q. Then, the G _1c value was calculated from the tensile module and Poisson's ratio of this material. This is typically ergs/cm ² ×
Expressed in 10 ⁶ or KJ/m ² . A comparison of typical G _1c values for various plastics and metals can be found at
Lee, L.H., “Physicochemical Aspects of
Polymer Surfaces”, KLMittal, ed. Plenum
Press, New York, NY, 1983. Tg was measured by differential scanning calorimetry using a calibrated Dupont Instrument (Model No. 912 with 1090 controller). The sample was placed under a nitrogen atmosphere.
Measurement was performed at a heating rate of 10°C/min (0.1667°C/sec). Coefficient of thermal expansion (CTE) calibrated Dupont
Measured using a Thermal Mechanical Analyzer (Model No. 943 with 1090 controller). Degradability is Dupont Thermal Gravinetric
Analyzer (with Dupont 1090 controller)
Model No. 951). Dynamic mechanical strength is Dupont Dynamic
Measured using Mechanical Analyzer (Model No. 982 with Dupont 1090 controller). In the Examples and Comparative Examples, the following components were used. Epoxy resin A is a polyglycidyl ether of a phenol-hydroxybenz-aldehyde condensate with an EEW of 220 and an average functionality of 3.5. Epoxy resin B is a polyglycidyl ether of a phenol-hydroxybenz-aldehyde condensate with an EEW of 162 and an average functional group number of 3.2. Epoxy resin C is a modified epoxy resin having an EEW of 215, which is obtained by modifying epoxy resin B with tetrabromobisphenol A. Epoxy resin D is a polyglycidyl ether of a phenol-hydroxybenz-aldehyde condensate having an EEW of 204 and an average number of functional groups of 3 to 4. Epoxy resin E is a modified epoxy resin obtained by modifying epoxy resin B with tetrabromobisphenol A and has an EEW of 239. Epoxy resin F is dimethylphenol-hydroxybenz- with an EEW of 185 and an average number of functional groups of 3.
It is a polyglycidyl ether of an aldehyde condensate. Epoxy resin G is a polyglydisyl ether of dimethylphenol-dimethylbenz-aldehyde condensate with an EEW of 189 and an average number of functional groups of 3. Epoxy resin H has an average functional group number of 3.6.
It is a phenol-formaldehyde epoxy novolak resin with an EEW of 178. Epoxy resin has an average number of functional groups of 5 or 6.
It is a phenol-formaldehyde epoxy novolak resin with an EEW of 203. Epoxy resin J has an average number of functional groups of 3.5, EEW
It is a brominated phenol formaldehyde epoxy novolac resin with a total bromine content of 285 and a total bromine% of 36. Epoxy resin K has an average number of functional groups of 3.5 and EEW
211 is a cresol-formaldehyde epoxy novolak resin. Epoxy resin L has an average number of functional groups of 5, EEW
211 is a cresol-formaldehyde epoxy novolak resin. Epoxy resin M has an average number of functional groups of 7.5, EEW
210 is a cresol-formaldehyde epoxy novolac resin. Epoxy resin N has an average number of functional groups of 4.2, EEW
is a phenol/glyoxal epoxy novolak resin with 231. Example 1 Tetrabromobisphenol A (TBBPA)
56.87g (0.209 equivalent) and 50g of epoxy resin A
(0.227 equivalent) at 150℃, TBBPA
was completely dissolved (about 180 seconds). Then, 0.214 g of a 70% methanol solution of tetrabutylphosphonium acetate/acetic acid complex was added and stirred. The solution was then degassed. The resulting mixture was then treated with Fluoroglide mold release agent and poured into an aluminum mold preheated to about 175°C. The molds were fixed at 1/8″ (3.175mm) intervals.Then, the filled molds were placed in an oven at 200℃ for 2 hours (7200 seconds).
I put it in. After cooling the molded product to room temperature, it was taken out and its physical properties were measured. The results are shown below. G _1c =. 51KJ/m ² Tg=180℃ The thermal expansion coefficient at lower temperature than 100℃ is 65ppm/
℃． Example 2 A Varnish formulation 2917 g (9.944 equivalents) of the 75% Tris epoxide solution in methyl ethyl ketone used in Example 1; 60
%TBBPA in methyl ethyl ketone solution 4048g
(8.929 equivalents); 2-methylimidazole 3.3g;
and 200g of acetone. No. 75〓 (23.9℃) of the above mixture.
The viscosity of 2Zahn cups was 21 seconds. B Pre-impregnated Substrate Preparation A Burlington style 7628 glass cloth with a 1617 finish was first coated with the varnish formulation of Example 2-A.
19.5 feet (5.9 m) was permeated at 10 feet (50.8 mm/sec) in a 26 foot (7.9 m) forced-air upright treatment vessel heated to 350 °C (176.7 °C). The gel time was 73 seconds at 171°C.The resin content of the impregnated glass cloth produced was 47% by weight. C. Manufacture of laminate The impregnated substrate described above was used to coat both sides. (no copper) and one side copper coated 0.062″ (1.57mm) thick laminate was pressed. Then 12inch x
Eight layers of 12 inches (304.8 mm x 304.8 mm) were pressed into a laminate shape. The copper foil is 1 ounce zinc oxide treated material. Laminate press is 350
(176.7°C) at 500 psi (3.45 MPa) for 1 hour (3600 seconds) in a preheated Wabash press. I did not do any post-Kyuua. The properties of the uncoated laminate are shown below. 1 Tg=280℃ 2 Dynamic decomposition temperature is 314℃ (3℃/min, 0.05
(operated at °C/sec). 3 The decomposition stability at 250℃; 60 minutes (3600 seconds) is
Good. 4 Z-axis thermal expansion coefficient is 46.7 (ppm/℃
(α ₁ )). 5 Maintains original dynamic elasticity up to 157℃. 6 Relative moisture resistance is 32″ x 4″ (50.8 x 101.6
mm) uncoated laminate piece to 15psi (103PKa)
Measured by placing in a pressurized pot with a vapor pressure of 2 hours (7200 seconds). After 2 hours, take it out, dry the surface, and place it in melting wax at 500㎓ (260℃) for 20 minutes.
Dipped for seconds. Delamination blisters were then examined on both sides of the three specimens. The results were expressed as the number of sides without bulges divided by the total number of sides. The score was 6/6, giving a 100% pass. Copper peeling strength of coated laminate is 4 to 4.81
b/in. (700-841N/m). Example 3 A Varnish formulation A varnish formulation was made from the following. 75% epoxy resin C methyl ethyl ketone solution
2532g (8.833 equivalents); 60% TBBPA methyl ethyl ketone solution
3808g (8.40 equivalents); Ethyltriphenylphosphonium acetate
8.55g; No. 75〓 (23.9℃) of the above mixture.
The viscosity of the 2Zahn Cup was 20 seconds. B. Pre-impregnated Substrate Preparation A Burlington style 7628 glass fabric with a 1617 finish was first coated with the varnish formulation of Example 3-A.
19.5 feet (5.9 m) were infiltrated at 10 feet/min (50.8 mm/sec) in a 26 foot (7.9 m) total length forced draft upright processor heated to 350° (176.7°C).
The gel time of the resin contained in the impregnated glass cloth is 171℃
It took 97 seconds. The resin content of the resulting impregnated glass cloth was 44.4% by weight. C. Preparation of Laminates Laminates with uncoated sides and copper coating on one side were made in the same manner as described in Example 2-C. The properties of the uncoated laminate are shown below. 1 Tg=184°C 2 Relative moisture resistance was measured in the same manner as described in Example 2, Section 6. The results were 8/8 for 4 test pieces, a perfect 100% pass. Copper peeling strength of coated laminate is 4.8 ~
It was 5.61 b/in. (841 to 981 N/m). Examples 4 to 16 This example was carried out in the same manner as Example 1 using the ingredients and conditions shown in Table 1. The properties of the product are shown in Table 1.

【table】

【table】

[Table] 3 After mixing the transparent resin, it was poured into a small aluminum mold for curing.
Example 17 A blended composition was prepared consisting of 100 g (0.4545 g equivalent) of epoxy resin A, 114 g (0.41829 g eq.) tetrabromobisphenol A, and 110 g methyl ethyl ketone. The stability of this resin solution at 25°C and 50°C was measured. This stability is related to the change in % epoxide over time. Additionally, methyl-p-toluenesulfonate was added to the solution to examine its effect on the stability of the resin system. The results are shown in Table 2. Table 2 Stability at 25℃ (without stabilizer) Time Epoxide % 0 6.3 2 days (172800 seconds) 6.2 27 days (2332800 seconds) 6.0 90 days (7776000 seconds) 5.6 Stability at 50℃ (without stabilizer) Time Epoxide% 0 6.3 2 days (172800 seconds) 6.1 27 days (2332800 seconds) 4.8 90 days (7776000 seconds) Gelation stability at 50℃ (stabilizer ^* added) Time Epoxide% 0 6.3 2 days (172800 seconds ) 6.2 27 days (2332800 seconds) 6.1 90 days (7776000 seconds) 5.6 240 days (20736000 seconds) 4.9 * Add 0.1 g of methyl-p-toluenesulfonate to 40 g of resin.