JPS6333908U - - Google Patents
Info
- Publication number
- JPS6333908U JPS6333908U JP12666386U JP12666386U JPS6333908U JP S6333908 U JPS6333908 U JP S6333908U JP 12666386 U JP12666386 U JP 12666386U JP 12666386 U JP12666386 U JP 12666386U JP S6333908 U JPS6333908 U JP S6333908U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- sectional
- temperature sensor
- view
- molds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 description 2
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Presses And Accessory Devices Thereof (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１図はこの考案による成形型の温度測定装置
の一実施例を示し、第１図ａは加圧成形中の断面
図、第１図ｂは成形完了時の断面図、第１図ｃは
型移動後の型開き時の断面図、第２図は第１図の
ものの要部の拡大断面図、第３図は従来のものの
一例を示し、第３図ａは加圧成形中の断面図、第
３図ｂは成形完了時の断面図、第３図ｃは型移動
後の型開き時の断面図である。
１，２１……上型、２，２２……下型、３，２
３……止め輪、４，２４……上型保持板、５，２
５……下型保持板、６，２６……キヤビテイ、７
，２７……上保護板、８，２８……上熱盤、９，
２９……下保護板、１０，３０……下熱盤、１１
，３１……型移動ローラ、１２，３２……温度セ
ンサ、１３，３３……温度計、１４ａ，１４ｂ，
３４……ケーブル、１５ａ，１５ｂ……接点ケー
ス、１６……ばね、１７……移動接点、１８……
固定接点、１９，３９……成形品。
Figure 1 shows an embodiment of the mold temperature measuring device according to this invention, Figure 1a is a cross-sectional view during pressure molding, Figure 1b is a cross-sectional view when molding is completed, and Figure 1c is a cross-sectional view when molding is completed. 2 is an enlarged sectional view of the main part of the one in Figure 1, Figure 3 shows an example of the conventional one, and Figure 3a is a sectional view during pressure molding. , FIG. 3b is a cross-sectional view when molding is completed, and FIG. 3c is a cross-sectional view when the mold is opened after the mold has been moved. 1, 21... Upper mold, 2, 22... Lower mold, 3, 2
3... Retaining ring, 4, 24... Upper die holding plate, 5, 2
5... Lower mold holding plate, 6, 26... Cavity, 7
, 27... Upper protection plate, 8, 28... Upper heating plate, 9,
29... Lower protection plate, 10, 30... Lower heating plate, 11
, 31... Mold moving roller, 12, 32... Temperature sensor, 13, 33... Thermometer, 14a, 14b,
34... Cable, 15a, 15b... Contact case, 16... Spring, 17... Moving contact, 18...
Fixed contact, 19, 39...molded product.
Claims (1)
になつた成形型において、前記型１に一体に設け
られた温度センサ１２と、前記型１，２とは別体
に設けられた温度計１３とを結ぶケーブル１４ａ
，１４ｂに、成形時にのみ相互接続される接点１
７，１８を設けたことを特徴とする成形型の温度
測定装置。 In a mold in which molds 1 and 2 are moved during molding and mold release, a temperature sensor 12 is provided integrally with the mold 1, and a temperature sensor 12 is provided separately from the molds 1 and 2. Cable 14a connecting with thermometer 13
, 14b, contacts 1 are interconnected only during molding.
7, 18.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12666386U JPS6333908U (en) | 1986-08-20 | 1986-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12666386U JPS6333908U (en) | 1986-08-20 | 1986-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6333908U true JPS6333908U (en) | 1988-03-04 |
Family
ID=31020682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12666386U Pending JPS6333908U (en) | 1986-08-20 | 1986-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6333908U (en) |
-
1986
- 1986-08-20 JP JP12666386U patent/JPS6333908U/ja active Pending