JPS6336037U - - Google Patents
Info
- Publication number
- JPS6336037U JPS6336037U JP12866286U JP12866286U JPS6336037U JP S6336037 U JPS6336037 U JP S6336037U JP 12866286 U JP12866286 U JP 12866286U JP 12866286 U JP12866286 U JP 12866286U JP S6336037 U JPS6336037 U JP S6336037U
- Authority
- JP
- Japan
- Prior art keywords
- high frequency
- chips
- frequency
- mounting part
- application electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
Description
図面はこの考案の一実施例を示す構成例である
。
図において、１はウエハ、２は載置部、３は高
周波印加用電極、４は高周波電源である。
The drawings show an example of the configuration of one embodiment of this invention. In the figure, 1 is a wafer, 2 is a mounting section, 3 is a high frequency application electrode, and 4 is a high frequency power source.
補正 昭６２．３．２３
図面の簡単な説明を次のように補正する。
明細書第５頁１３〜１４行の「図面は……であ
る。」を、下記のように補正する。
「第１図はこの考案の一実施例を示す半導体装
置の製造装置の全体の構成図である。」Amendment: March 23, 1982: The brief description of the drawing is amended as follows. The phrase "The drawings are..." on page 5, lines 13-14 of the specification is amended as follows. ``FIG. 1 is an overall configuration diagram of a semiconductor device manufacturing apparatus showing an embodiment of this invention.''
Claims (1)
施したウエハを載置し高周波加熱では発熱しない
材質からなる載置部と、この載置部を対向面間に
配置した高周波印加用電極とを備え、この高周波
印加用電極に高周波を印加して前記ウエハを高周
波加熱して乾燥させる高周波電源とを備えたこと
を特徴とする半導体装置の製造装置。 After the dicing step of separating the chips into chips, the cleaned wafer is placed on a mounting part made of a material that does not generate heat during high-frequency heating, and a high-frequency application electrode with this mounting part arranged between opposing surfaces. A semiconductor device manufacturing apparatus comprising: a high frequency power source that applies high frequency to the high frequency application electrode to heat and dry the wafer at high frequency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12866286U JPS6336037U (en) | 1986-08-22 | 1986-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12866286U JPS6336037U (en) | 1986-08-22 | 1986-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6336037U true JPS6336037U (en) | 1988-03-08 |
Family
ID=31024530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12866286U Pending JPS6336037U (en) | 1986-08-22 | 1986-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6336037U (en) |
-
1986
- 1986-08-22 JP JP12866286U patent/JPS6336037U/ja active Pending