JPS6338334U - - Google Patents
Info
- Publication number
- JPS6338334U JPS6338334U JP1986130952U JP13095286U JPS6338334U JP S6338334 U JPS6338334 U JP S6338334U JP 1986130952 U JP1986130952 U JP 1986130952U JP 13095286 U JP13095286 U JP 13095286U JP S6338334 U JPS6338334 U JP S6338334U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- integrated circuit
- conductive pattern
- circuit chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Die Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986130952U JPS6338334U (mo) | 1986-08-27 | 1986-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986130952U JPS6338334U (mo) | 1986-08-27 | 1986-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6338334U true JPS6338334U (mo) | 1988-03-11 |
Family
ID=31028945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986130952U Pending JPS6338334U (mo) | 1986-08-27 | 1986-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6338334U (mo) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01283883A (ja) * | 1988-05-10 | 1989-11-15 | Matsushita Electric Ind Co Ltd | 発光ダイオードおよびその電極の形成方法 |
| DE112017002421T5 (de) | 2016-05-12 | 2019-01-24 | Mitsubishi Electric Corporation | Halbleitereinheit und verfahren zum herstellen einer halbleitereinheit |
-
1986
- 1986-08-27 JP JP1986130952U patent/JPS6338334U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01283883A (ja) * | 1988-05-10 | 1989-11-15 | Matsushita Electric Ind Co Ltd | 発光ダイオードおよびその電極の形成方法 |
| DE112017002421T5 (de) | 2016-05-12 | 2019-01-24 | Mitsubishi Electric Corporation | Halbleitereinheit und verfahren zum herstellen einer halbleitereinheit |
| US10741413B2 (en) | 2016-05-12 | 2020-08-11 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing semiconductor device |