JPS6338335U - - Google Patents
Info
- Publication number
- JPS6338335U JPS6338335U JP11341387U JP11341387U JPS6338335U JP S6338335 U JPS6338335 U JP S6338335U JP 11341387 U JP11341387 U JP 11341387U JP 11341387 U JP11341387 U JP 11341387U JP S6338335 U JPS6338335 U JP S6338335U
- Authority
- JP
- Japan
- Prior art keywords
- grounding
- thin metal
- metallized
- metal wires
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 5
- 238000001465 metallisation Methods 0.000 description 2
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11341387U JPS6338335U (2) | 1987-07-23 | 1987-07-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11341387U JPS6338335U (2) | 1987-07-23 | 1987-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6338335U true JPS6338335U (2) | 1988-03-11 |
Family
ID=30995194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11341387U Pending JPS6338335U (2) | 1987-07-23 | 1987-07-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6338335U (2) |
-
1987
- 1987-07-23 JP JP11341387U patent/JPS6338335U/ja active Pending