JPS6339973Y2 - - Google Patents

Info

Publication number
JPS6339973Y2
JPS6339973Y2 JP1981191737U JP19173781U JPS6339973Y2 JP S6339973 Y2 JPS6339973 Y2 JP S6339973Y2 JP 1981191737 U JP1981191737 U JP 1981191737U JP 19173781 U JP19173781 U JP 19173781U JP S6339973 Y2 JPS6339973 Y2 JP S6339973Y2
Authority
JP
Japan
Prior art keywords
package
packages
separation
magazine
transferred
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981191737U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5897839U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981191737U priority Critical patent/JPS5897839U/ja
Publication of JPS5897839U publication Critical patent/JPS5897839U/ja
Application granted granted Critical
Publication of JPS6339973Y2 publication Critical patent/JPS6339973Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
JP1981191737U 1981-12-24 1981-12-24 ボンデイング装置におけるパツケ−ジ移送装置 Granted JPS5897839U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981191737U JPS5897839U (ja) 1981-12-24 1981-12-24 ボンデイング装置におけるパツケ−ジ移送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981191737U JPS5897839U (ja) 1981-12-24 1981-12-24 ボンデイング装置におけるパツケ−ジ移送装置

Publications (2)

Publication Number Publication Date
JPS5897839U JPS5897839U (ja) 1983-07-02
JPS6339973Y2 true JPS6339973Y2 (cs) 1988-10-19

Family

ID=30105184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981191737U Granted JPS5897839U (ja) 1981-12-24 1981-12-24 ボンデイング装置におけるパツケ−ジ移送装置

Country Status (1)

Country Link
JP (1) JPS5897839U (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5955025A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd ベ−ス付きリ−ドフレ−ムの搬送方法

Also Published As

Publication number Publication date
JPS5897839U (ja) 1983-07-02

Similar Documents

Publication Publication Date Title
US4725182A (en) Printed circuit board load-unload system and method
JPWO2015004797A1 (ja) フィーダ自動配膳制御装置および制御方法
US6547902B2 (en) Die bonding method and apparatus
US4479187A (en) Classifying apparatus with automatic removal device
JP2018153899A (ja) 部品供給システム
JP3149745B2 (ja) チップの実装装置および実装方法
US3499204A (en) Electrical control system for a chip positioning machine
TW393741B (en) An automated picking and placing method for IC packing processes of magazine covering plate
JP2890337B2 (ja) 板状部材の処理装置
JPS606095B2 (ja) 自動ワイヤボンデイング装置
JP3145790B2 (ja) ペレットボンディング方法
JPH01318297A (ja) 電子部品実装装置
JP7757017B2 (ja) 表面実装機及び表面実装方法
JPH0238443Y2 (cs)
JPS5897839U (ja) ボンデイング装置におけるパツケ−ジ移送装置
KR910007418B1 (ko) 칩 이송장치의 픽럽 방법
JP2589100B2 (ja) チップボンディング装置
JPS61217442A (ja) ウエ−ハ插入装置
JP3301432B2 (ja) 電子部品実装方法
JPH0516974B2 (cs)
JPS5897844A (ja) ダイ詰め換え装置
JPS6243198A (ja) 電子部品実装機の部品供給装置
JP3334224B2 (ja) 部品実装装置
JPS6057128U (ja) ダイボンディング装置
JPS62150900A (ja) 電子部品の装着装置