JPS6339976Y2 - - Google Patents
Info
- Publication number
- JPS6339976Y2 JPS6339976Y2 JP1983189492U JP18949283U JPS6339976Y2 JP S6339976 Y2 JPS6339976 Y2 JP S6339976Y2 JP 1983189492 U JP1983189492 U JP 1983189492U JP 18949283 U JP18949283 U JP 18949283U JP S6339976 Y2 JPS6339976 Y2 JP S6339976Y2
- Authority
- JP
- Japan
- Prior art keywords
- chassis
- heat
- heat dissipation
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、放熱フインが取り付けられる電子装
置箱体の構造に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to the structure of an electronic device box body to which heat dissipation fins are attached.
従来の電子装置箱体は、その平面図を第１図、
正面図を第２図に示すように、発熱部品２を放熱
フイン４に直接取付けて、その放熱フイン４をシ
ヤーシ１に固着してなる構造であつた。
The plan view of the conventional electronic device box is shown in Figure 1.
As shown in the front view in FIG. 2, the structure was such that the heat generating component 2 was directly attached to the heat radiation fin 4, and the heat radiation fin 4 was fixed to the chassis 1.
ところが、奥行長さＤにしめる放熱フイン４の
ヒレ部分の長さDfが不必要に長く、装置全体の
小型化をさまだげていた。
However, the length Df of the fin portion of the heat dissipation fin 4 that is included in the depth length D is unnecessarily long, which hinders miniaturization of the entire device.
本考案は、このような課題を解決し、奥行長さ
を減少できる構造を提供するものである。 The present invention solves these problems and provides a structure that can reduce the depth.
〔課題を解決するための手段〕
そこで本考案は、前記シヤーシを導電性を有し
熱伝導性に秀れた部材で構成し、前記シヤーシを
前記発熱する電子部品と前記放熱フインで挟み込
むように前記発熱する電子部品側からネジ止めし
てなるとともに、前記シヤーシの放熱フイン側に
電子器具が配置されるプリント基板を、前記放熱
フイン部分を切り欠いて前記シヤーシと略平行に
設置することにしたものである。[Means for Solving the Problems] Therefore, the present invention is such that the chassis is made of a member that is electrically conductive and has excellent thermal conductivity, and the chassis is sandwiched between the heat-generating electronic component and the heat dissipation fin. The printed circuit board, which is screwed from the side of the heat-generating electronic components and on which electronic equipment is placed on the heat-radiating fin side of the chassis, is installed approximately parallel to the chassis by cutting out the heat-radiating fin portion. It is something.
シヤーシを前記発熱する電子部品と前記放熱フ
インで挟み込むように前記発熱する電子部品側か
らネジ止めしてなることにより、シヤーシ自体が
放熱部材料として機能し、しかも、前記シヤーシ
の放熱フイン側に電子器具が配置されるプリント
基板を、前記放熱フイン部分を切り欠いて前記シ
ヤーシと略平行に設置したことにより、放熱フイ
ンの発熱により生じる空気の流れがプリント基盤
に沿つて対流するから、プリント基板とシヤーシ
の温度上昇を押えるように作用する。
By sandwiching the chassis between the heat-generating electronic component and the heat dissipation fin and screwing it from the heat-generating electronic component side, the chassis itself functions as a heat dissipation part material, and the heat dissipation fin side of the chassis has an electronic component. By cutting out the heat dissipation fin portion of the printed circuit board on which the device is placed and installing it approximately parallel to the chassis, the air flow generated by the heat generated by the heat dissipation fins convects along the printed circuit board. It acts to suppress the rise in chassis temperature.
したがつて、シヤーシに取り付けられる放熱フ
インは比較的小型のもので良いことになる。 Therefore, the heat dissipation fins attached to the chassis can be relatively small.
そのため、従来電子装置箱体の奥行面すべてを
放熱フインとしていた従来と異なり、上面（側
面）に小さなものを配置すれば良いことになるか
ら、奥行き長さを縮小することがてきる。 Therefore, unlike the conventional case in which the entire depth surface of the electronic device box body was used as a heat dissipation fin, it is only necessary to place a small one on the top surface (side surface), so the depth length can be reduced.
本考案の具体的実施例の平面図を第３図、正面
図を第４図に示して説明する。
A concrete embodiment of the present invention will be described with reference to a plan view shown in FIG. 3 and a front view shown in FIG. 4.
１は導電性がありしかも熱伝導性にすぐれたア
ルミ合金で構成されているシヤーシであり、これ
に伝導コンパウンド３が両面に塗布され、発熱部
品２側から、前記シヤーシ１を挟んで放熱フイン
４をネジ５でしめつけて取り付ける。 Reference numeral 1 denotes a chassis made of an aluminum alloy that is electrically conductive and has excellent thermal conductivity.A conductive compound 3 is applied to both sides of the chassis, and heat dissipation fins 4 are applied from the heat generating component 2 side with the chassis 1 in between. Tighten and attach with screw 5.
さらに、プリント基板６，７は導電性のスタツ
ド８を介してシヤーシ１に固着する。 Furthermore, the printed circuit boards 6 and 7 are fixed to the chassis 1 via conductive studs 8.
プリント基板６は発熱部品２部分、プリント基
板７は放熱フイン４部分を切り欠いた形状になつ
ている。 The printed circuit board 6 has a shape in which the heat generating component 2 portion is cut out, and the printed circuit board 7 has a shape in which the heat radiation fin 4 portion is cut out.
このうちプリント基板７は、放熱フイン４の放
熱で生ずる空気の対流を利用して、プリント基板
７とシヤーシ１のすきまに空気の流れを生じさ
せ、プリント基板７自身と装置全体の温度上昇を
押える役割をもつている。 Among these, the printed circuit board 7 utilizes the air convection generated by the heat dissipation of the heat dissipation fins 4 to generate air flow in the gap between the printed circuit board 7 and the chassis 1, thereby suppressing the temperature rise of the printed circuit board 7 itself and the entire device. It has a role.
またプリント基板７上には、電子装置稼働時に
抵抗値等の調整を要する電子部品を、プリント基
板６上にはその必要のない電子部品を配置するよ
うにすれば良い。 Furthermore, electronic components that require adjustment of resistance values and the like during operation of the electronic device may be placed on the printed circuit board 7, and electronic components that do not require adjustment may be placed on the printed circuit board 6.
以上述べたように、本考案によれば、従来電子
装置の奥行面全面に取付けられていた放熱フイン
を、小型化した上で、上面（側面）に取付けられ
るようになるから、電子装置全体の奥行長さを縮
小でき、装置を小型にすることができるという大
きな効果がある。
As described above, according to the present invention, the heat dissipation fin, which was conventionally attached to the entire depth surface of an electronic device, can be miniaturized and attached to the top (side) surface, so that the entire depth of the electronic device can be reduced. This has the great effect of reducing the depth and making the device more compact.
第１図は従来例の平面図、第２図は従来例の正
面図、第３図は本考案の実施例の平面図、第４図
は本考案の実施例の正面図である。
１……シヤーシ、２……発熱部品、３……伝導
コンパウンド、４……放熱フイン、５……ネジ、
６，７……プリント基板、８……スタツド。
FIG. 1 is a plan view of the conventional example, FIG. 2 is a front view of the conventional example, FIG. 3 is a plan view of the embodiment of the present invention, and FIG. 4 is a front view of the embodiment of the present invention. 1... Chassis, 2... Heat generating parts, 3... Conductive compound, 4... Heat dissipation fins, 5... Screws,
6, 7...Printed circuit board, 8...Stud.
Claims (1)
保持するシヤーシとを備える電子装置において、 前記シヤーシを導電性を有し熱伝導性に秀れた
部材で構成し、前記シヤーシを前記発熱する電子
部品と前記放熱フインで挟み込むように前記発熱
する電子部品側からネジ止めしてなるとともに、 前記シヤーシの放熱フイン側に電子器具が配置
されるプリント基板を、前記放熱フイン部分を切
り欠いて前記シヤーシと略平行に設置したことを
特徴とする電子装置。[Utility Model Claim] An electronic device comprising a heat-generating electronic component, heat dissipation fins, and a chassis for holding them, wherein the chassis is made of a material having electrical conductivity and excellent thermal conductivity, and is screwed from the heat-generating electronic component side so as to sandwich the chassis between the heat-generating electronic component and the heat dissipation fins, and a printed circuit board on which an electronic device is arranged on the heat dissipation fin side of the chassis is installed approximately parallel to the chassis, with the heat dissipation fin portion cut out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18949283U JPS6096842U (en) | 1983-12-07 | 1983-12-07 | electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18949283U JPS6096842U (en) | 1983-12-07 | 1983-12-07 | electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6096842U JPS6096842U (en) | 1985-07-02 |
| JPS6339976Y2 true JPS6339976Y2 (en) | 1988-10-19 |
Family
ID=30408534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18949283U Granted JPS6096842U (en) | 1983-12-07 | 1983-12-07 | electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6096842U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4670611B2 (en) * | 2005-11-29 | 2011-04-13 | セイコーエプソン株式会社 | Robot controller |
| JP2013531389A (en) * | 2010-07-16 | 2013-08-01 | エンブレーション リミテッド | Apparatus and method for taking a thermal interface |
| JP2012227374A (en) * | 2011-04-20 | 2012-11-15 | Mitsubishi Electric Corp | Heat radiation structure of electronic apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4529537Y1 (en) * | 1966-11-15 | 1970-11-13 |
-
1983
- 1983-12-07 JP JP18949283U patent/JPS6096842U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6096842U (en) | 1985-07-02 |
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