JPS6347114U - - Google Patents
Info
- Publication number
- JPS6347114U JPS6347114U JP14245086U JP14245086U JPS6347114U JP S6347114 U JPS6347114 U JP S6347114U JP 14245086 U JP14245086 U JP 14245086U JP 14245086 U JP14245086 U JP 14245086U JP S6347114 U JPS6347114 U JP S6347114U
- Authority
- JP
- Japan
- Prior art keywords
- ejector pin
- diameter
- support part
- head
- head part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案による一実施例のエジエクト機
構の側断面図、第２図は本考案による他の実施例
のエジエクト機構の側断面図、第３図は従来のエ
ジエクト機構の側断面図、である。
図において、１はエジエクタピン、１ａは頭部
、１ｂは支持部、２は収納部、３は樹脂だまり、
４は製品、５はモールド金型、１１はエジエクタ
ピン、１２はガイド孔、を示す。
FIG. 1 is a side sectional view of an eject mechanism according to one embodiment of the present invention, FIG. 2 is a side sectional view of another embodiment of the eject mechanism according to the present invention, and FIG. 3 is a side sectional view of a conventional eject mechanism. It is. In the figure, 1 is an ejector pin, 1a is a head, 1b is a support part, 2 is a storage part, 3 is a resin reservoir,
4 is a product, 5 is a mold, 11 is an ejector pin, and 12 is a guide hole.
Claims (1)
頭部を支持する支持部１ｂの径より大なるエジエ
クタピン１と、該エジエクタピン１の該頭部１ａ
を収納する収納部２と、該支持部１ｂをガイドす
るガイド孔１２とを有し、該収納部２の壁面に凹
部を設けて樹脂だまり３としたことを特徴とする
モールド金型。 An ejector pin 1 in which a diameter of a head part 1a that pushes up a molded product is larger than a diameter of a support part 1b that supports the head part, and the head part 1a of the ejector pin 1.
A molding die having a storage part 2 for storing the support part 1b, and a guide hole 12 for guiding the support part 1b, and a recessed part is provided in the wall surface of the storage part 2 to form a resin reservoir 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14245086U JPS6347114U (en) | 1986-09-16 | 1986-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14245086U JPS6347114U (en) | 1986-09-16 | 1986-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6347114U true JPS6347114U (en) | 1988-03-30 |
Family
ID=31051194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14245086U Pending JPS6347114U (en) | 1986-09-16 | 1986-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6347114U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02277608A (en) * | 1989-04-19 | 1990-11-14 | Nissei Plastics Ind Co | Mold and molding method with the same mold utilized therefor |
| JPH10180809A (en) * | 1996-12-24 | 1998-07-07 | Asahi Chem Ind Co Ltd | Die for gas jointly using injection molding |
-
1986
- 1986-09-16 JP JP14245086U patent/JPS6347114U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02277608A (en) * | 1989-04-19 | 1990-11-14 | Nissei Plastics Ind Co | Mold and molding method with the same mold utilized therefor |
| JPH10180809A (en) * | 1996-12-24 | 1998-07-07 | Asahi Chem Ind Co Ltd | Die for gas jointly using injection molding |
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