JPS6350129U - - Google Patents

Info

Publication number
JPS6350129U
JPS6350129U JP1986144644U JP14464486U JPS6350129U JP S6350129 U JPS6350129 U JP S6350129U JP 1986144644 U JP1986144644 U JP 1986144644U JP 14464486 U JP14464486 U JP 14464486U JP S6350129 U JPS6350129 U JP S6350129U
Authority
JP
Japan
Prior art keywords
spool
metal wire
wire
paid out
adjustment means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986144644U
Other languages
English (en)
Other versions
JPH0333060Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986144644U priority Critical patent/JPH0333060Y2/ja
Publication of JPS6350129U publication Critical patent/JPS6350129U/ja
Application granted granted Critical
Publication of JPH0333060Y2 publication Critical patent/JPH0333060Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Tension Adjustment In Filamentary Materials (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図および第２図は本考案装置要部の略示正
面図であり、第３図は従来装置の略示正面図であ
る。 ３……ワイヤ、５……キヤピラリ、６……スプ
ール、１５……永久磁石、１８，１９，２０……
張力調整手段。

Claims (1)

    【実用新案登録請求の範囲】
  1. スプールに巻回された金属ワイヤを繰り出し、
    二部材間を前記金属ワイヤにて電気的に接続する
    装置に於いて、前記スプールを浮上状態で回転自
    在に支持すると共にスプールの周方向に金属ワイ
    ヤを繰出し、該スプールにワイヤの繰出し張力調
    整手段を設けたことを特徴とするワイヤボンデイ
    ング装置。
JP1986144644U 1986-09-19 1986-09-19 Expired JPH0333060Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986144644U JPH0333060Y2 (ja) 1986-09-19 1986-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986144644U JPH0333060Y2 (ja) 1986-09-19 1986-09-19

Publications (2)

Publication Number Publication Date
JPS6350129U true JPS6350129U (ja) 1988-04-05
JPH0333060Y2 JPH0333060Y2 (ja) 1991-07-12

Family

ID=31055439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986144644U Expired JPH0333060Y2 (ja) 1986-09-19 1986-09-19

Country Status (1)

Country Link
JP (1) JPH0333060Y2 (ja)

Also Published As

Publication number Publication date
JPH0333060Y2 (ja) 1991-07-12

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