JPS6355372U - - Google Patents
Info
- Publication number
- JPS6355372U JPS6355372U JP1986148818U JP14881886U JPS6355372U JP S6355372 U JPS6355372 U JP S6355372U JP 1986148818 U JP1986148818 U JP 1986148818U JP 14881886 U JP14881886 U JP 14881886U JP S6355372 U JPS6355372 U JP S6355372U
- Authority
- JP
- Japan
- Prior art keywords
- connecting part
- board
- soldered
- soldering part
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 239000011093 chipboard Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 239000000523 sample Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図は本考案のチエツク端子をハンダ付した
基板の側面図、第２図と第３図は本考案の一実施
例の正面図と側面図、第４図は電子部品を実装し
たチツプ基板の側面図、第５図は従来のチエツク
端子のハンダ付状態の側面図である。
１…ハンダ付部、２…接続部、３…小判孔、４
…基板。
Figure 1 is a side view of a board to which the check terminal of the present invention is soldered, Figures 2 and 3 are front and side views of an embodiment of the present invention, and Figure 4 is a chip board on which electronic components are mounted. FIG. 5 is a side view of a conventional check terminal in a soldered state. 1...Soldering part, 2...Connecting part, 3...Oval hole, 4
…substrate.
Claims (1)
ンダ付されるハンダ付部と、該ハンダ付部から上
方に延びてプローブ等の測定端子に接続し得るべ
く小孔が穿設されている接続部とを、導電体で一
体に形成したことを特徴とするチツプ基板用チエ
ツク端子。 The lower surface is flat, and has a soldering part that is placed on the conductive foil of the board and soldered thereto, and a small hole extending upward from the soldering part so that it can be connected to a measurement terminal such as a probe. A check terminal for a chip board, characterized in that a connecting part and a connecting part are integrally formed of a conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986148818U JPS6355372U (en) | 1986-09-30 | 1986-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986148818U JPS6355372U (en) | 1986-09-30 | 1986-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355372U true JPS6355372U (en) | 1988-04-13 |
Family
ID=31063443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986148818U Pending JPS6355372U (en) | 1986-09-30 | 1986-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355372U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4219969Y1 (en) * | 1964-08-31 | 1967-11-20 | ||
| JPS5332384B2 (en) * | 1974-05-11 | 1978-09-07 |
-
1986
- 1986-09-30 JP JP1986148818U patent/JPS6355372U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4219969Y1 (en) * | 1964-08-31 | 1967-11-20 | ||
| JPS5332384B2 (en) * | 1974-05-11 | 1978-09-07 |