JPS635647U - - Google Patents

Info

Publication number
JPS635647U
JPS635647U JP1986099507U JP9950786U JPS635647U JP S635647 U JPS635647 U JP S635647U JP 1986099507 U JP1986099507 U JP 1986099507U JP 9950786 U JP9950786 U JP 9950786U JP S635647 U JPS635647 U JP S635647U
Authority
JP
Japan
Prior art keywords
conductive layer
lead frame
mounting portion
element mounting
land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986099507U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986099507U priority Critical patent/JPS635647U/ja
Publication of JPS635647U publication Critical patent/JPS635647U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1986099507U 1986-06-27 1986-06-27 Pending JPS635647U (da)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986099507U JPS635647U (da) 1986-06-27 1986-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986099507U JPS635647U (da) 1986-06-27 1986-06-27

Publications (1)

Publication Number Publication Date
JPS635647U true JPS635647U (da) 1988-01-14

Family

ID=30968444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986099507U Pending JPS635647U (da) 1986-06-27 1986-06-27

Country Status (1)

Country Link
JP (1) JPS635647U (da)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555440A (ja) * 1991-08-29 1993-03-05 Hitachi Cable Ltd 樹脂封止型半導体装置
US7230320B2 (en) 2003-02-18 2007-06-12 Hitachi, Ltd. Electronic circuit device with reduced breaking and cracking

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5766655A (en) * 1980-10-09 1982-04-22 Mitsubishi Electric Corp Lead frame for semiconductor device
JPS59194443A (ja) * 1983-04-19 1984-11-05 Toshiba Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5766655A (en) * 1980-10-09 1982-04-22 Mitsubishi Electric Corp Lead frame for semiconductor device
JPS59194443A (ja) * 1983-04-19 1984-11-05 Toshiba Corp 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555440A (ja) * 1991-08-29 1993-03-05 Hitachi Cable Ltd 樹脂封止型半導体装置
US7230320B2 (en) 2003-02-18 2007-06-12 Hitachi, Ltd. Electronic circuit device with reduced breaking and cracking

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