JPS635669B2 - - Google Patents
Info
- Publication number
- JPS635669B2 JPS635669B2 JP9843985A JP9843985A JPS635669B2 JP S635669 B2 JPS635669 B2 JP S635669B2 JP 9843985 A JP9843985 A JP 9843985A JP 9843985 A JP9843985 A JP 9843985A JP S635669 B2 JPS635669 B2 JP S635669B2
- Authority
- JP
- Japan
- Prior art keywords
- shelf board
- firing
- grooves
- tile
- accessory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010304 firing Methods 0.000 claims description 38
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000000919 ceramic Substances 0.000 claims description 14
- 239000011230 binding agent Substances 0.000 claims description 11
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 239000012784 inorganic fiber Substances 0.000 claims description 8
- 239000002075 main ingredient Substances 0.000 claims 1
- 239000000835 fiber Substances 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 6
- 239000011449 brick Substances 0.000 description 5
- 230000008602 contraction Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 241001122767 Theaceae Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- 239000008279 sol Substances 0.000 description 1
- 229910002076 stabilized zirconia Inorganic materials 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
Landscapes
- Furnace Charging Or Discharging (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はセラミツク製品、特に粘土質成形品で
ある茶碗、タイル、皿、カツプ等の焼成用として
用いられる棚板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a shelf board used for firing ceramic products, particularly clay molded products such as tea bowls, tiles, plates, and cups.
以下は、役物タイルを焼成する場合の実施例に
基づいて説明する。 The following will be described based on an example in which accessory tiles are fired.
第7図は、焼成炉の一例を示すスレツドキルン
1の部分縦断面図である。同図に示す如く、スレ
ツドキルン1は、焼成炉(図示せず)を貫通して
敷設された案内レール2,2上を台車3が摺動で
きるようになつている。台車3は、案内レール
2,2上にスライドプレート4,4を介して載置
された台板9と、該台板9上に敷並べられた耐火
断熱レンガ5とよりなる。このスレツドキルン1
でのタイルの焼成は、タイルが通常の平物タイル
6である場合には、前記耐火断熱レンガ5上にそ
のまま平物タイル6を載置し、炉内を通過させる
ことで行つている。またタイルが役物タイル7で
ある場合には、耐火断熱レンガ5上に棚板8を載
置し、該棚板8上に役物タイル7を載せて炉内を
通過させることで行つている。これは、役物タイ
ル7をそのまま耐火断熱レンガ5上に載置して焼
成すると、焼成時に軟化し、自重により変形する
ためである。
FIG. 7 is a partial vertical sectional view of a thread kiln 1 showing an example of a firing furnace. As shown in the figure, the thread kiln 1 is constructed such that a cart 3 can slide on guide rails 2, 2 which are laid through a kiln (not shown). The truck 3 consists of a base plate 9 placed on the guide rails 2, 2 via slide plates 4, 4, and fireproof insulation bricks 5 laid on the base plate 9. This thread kiln 1
When the tiles are ordinary flat tiles 6, the firing of the tiles is carried out by placing the flat tiles 6 as they are on the fireproof and insulating bricks 5 and passing them through a furnace. In addition, when the tiles are accessory tiles 7, a shelf board 8 is placed on the fireproof insulation brick 5, and the accessory tile 7 is placed on the shelf board 8 and passed through the furnace. . This is because if the accessory tile 7 is placed directly on the fireproof insulation brick 5 and fired, it will soften during firing and deform due to its own weight.
前記棚板8は、通常炭化珪素と窒化珪素及びア
ルミナ等の1種又は2種以上の混合物を主成分と
する耐熱原料の粉末を、板状に成形して高温で焼
成することにより製造している。また前記耐熱原
料の粉末にステンレス鋼繊維を容積率で0.5〜4
%混入して板状に成形し、焼成したものもある。
更には耐熱性無機繊維(一般にはセラミツクフア
イバー)を無機結合剤と共に成形し、軽量且つ耐
熱性に優れたものもある。 The shelf board 8 is usually manufactured by forming a powder of a heat-resistant raw material mainly composed of one or a mixture of two or more of silicon carbide, silicon nitride, alumina, etc. into a plate shape and firing it at a high temperature. There is. In addition, stainless steel fibers are added to the heat-resistant raw material powder at a volume ratio of 0.5 to 4.
There are also products that are mixed with 20% of the total amount of carbon dioxide, molded into a plate shape, and fired.
Furthermore, there are also products made of heat-resistant inorganic fibers (generally ceramic fibers) together with an inorganic binder, which are lightweight and have excellent heat resistance.
ところが、炭化珪素と窒化珪素及びアルミナ等
の1種又は2種以上の混合物を主成分とする棚板
8は、耐熱性が優れているとはいえず、焼成時に
亀裂を発生し、寿命が短いという欠点があつた。
また炭化珪素と窒化珪素及びアルミナ等の1種又
は2種以上の混合物を主成分とする耐熱原料の粉
末に、ステンレス鋼繊維を混入して焼成した棚板
8では、嵩密度が1.0g/cm3以上もあり、かなり
重いので取扱い作業が不便であり、運搬速度が大
型化する等の欠点があつた。また嵩密度が大きい
ために、蓄熱量が大きくなり、焼成時にタイル裏
面7b側の焼成熱を奪い、表面7a側との間に焼
けムラを発生させ、タイル自体に反りを発生させ
るという欠点あつた。更にまた耐熱性無機繊維を
主体とする混合物で製造した棚板8は、該棚板8
の表面はガラス化されるが、裏面はガラス化の程
度が小さいため、タイル焼成時にその表面8a側
と裏面8b側との熱膨張収縮する度合が大きく異
なり、反り等の大きな変形を生じ、これが軟化状
態の役物タイル7へ影響を及ぼして該役物タイル
7に反り等の変形を発生させるという欠点があつ
た。
However, the shelf board 8 whose main component is one or more mixtures of silicon carbide, silicon nitride, alumina, etc. cannot be said to have excellent heat resistance, cracks occur during firing, and the lifespan is short. There was a drawback.
In addition, the shelf board 8 which is made by mixing stainless steel fibers into heat-resistant raw material powder whose main component is one or more mixtures of silicon carbide, silicon nitride, alumina, etc., has a bulk density of 1.0 g/cm. 3 or more, it is quite heavy, making it inconvenient to handle, and has drawbacks such as increased transportation speed. In addition, since the bulk density is large, the amount of heat stored is large, and during firing, the firing heat is taken away from the back side of the tile 7b, causing uneven baking between the tile and the front side 7a, and causing warping of the tile itself. . Furthermore, the shelf board 8 manufactured from a mixture mainly composed of heat-resistant inorganic fibers is
Although the front surface of the tile is vitrified, the degree of vitrification of the back surface is small, so when the tile is fired, the degree of thermal expansion and contraction between the front surface 8a side and the back surface 8b side is greatly different, resulting in large deformations such as warping. This has the disadvantage that it affects the accessory tile 7 in a softened state, causing deformation such as warping of the accessory tile 7.
また従来の棚板8にあつては、その上面8aが
フラツトであるため、役物タイル7の裏面7bと
密着し、焼成熱が該裏面7bへ伝達され難いとい
う問題があつた。このため、役物タイル7の裏面
7aと裏面7bとの焼成温度が不均一となり、焼
けムラの発生原因となつていた。焼けムラは役物
タイル7に反り等の変形を生じさせるものであ
る。 Further, in the case of the conventional shelf board 8, since its upper surface 8a is flat, it comes into close contact with the back surface 7b of the accessory tile 7, and there is a problem in that firing heat is difficult to be transmitted to the back surface 7b. For this reason, the firing temperature between the back surface 7a and the back surface 7b of the accessory tile 7 was non-uniform, causing uneven baking. The uneven burning causes deformation such as warping in the accessory tile 7.
要するに、従来の棚板8はそれ自身の焼成時の
熱膨張収縮による変形の問題と取扱い上の問題及
び役物タイル7の表面7a及び7bとの間に焼け
ムラを発生させるという問題があり、役物タイル
7が反り等によつて変形する欠点があつた。 In short, the conventional shelf board 8 has problems with its own deformation due to thermal expansion and contraction during firing, problems with handling, and the problem of causing uneven baking between the surfaces 7a and 7b of the accessory tile 7. There was a drawback that the accessory tile 7 was deformed due to warping or the like.
本発明は従来の棚板の上記欠点に鑑みてこれを
改良除去したものであつて、セラミツク製品の表
面と裏面との焼成温度を可及的に均一にすること
ができ、且つ棚板自身に変形の生じないものを提
供せんとするものである。 The present invention improves and eliminates the above-mentioned drawbacks of conventional shelf boards, and makes it possible to make the firing temperature on the front and back surfaces of ceramic products as uniform as possible, and to make the shelf board itself as uniform as possible. The aim is to provide products that do not undergo deformation.
本発明の問題点を解決するための手段は、実質
的に耐熱性無機繊維と無機結合剤とからなり嵩密
度が0.2〜0.5g/cm3の繊維質成形板であつて、少
なくとも一つの表面にアルミナ、シリカ、アルミ
ナ−シリカ、ジルコニア等を主体とする無機コー
テイング剤を塗布すると共に複数の溝を設けてい
る。そして、前記溝の深さは前記溝形成面に垂直
な方向の繊維質成形板の寸法に対して5〜50%の
範囲とし、また溝全体の表面積は前記溝形成面の
表面積に対して1〜15%の範囲としている。
Means for solving the problems of the present invention is a fibrous molded plate consisting essentially of heat-resistant inorganic fibers and an inorganic binder and having a bulk density of 0.2 to 0.5 g/cm 3 , which has at least one surface. An inorganic coating agent mainly composed of alumina, silica, alumina-silica, zirconia, etc. is applied to the surface, and a plurality of grooves are provided. The depth of the groove is in the range of 5 to 50% of the dimension of the fibrous molded plate in the direction perpendicular to the groove forming surface, and the surface area of the entire groove is 1% to the surface area of the groove forming surface. The range is ~15%.
本発明の作用は、第1図乃至第6図の実施例で
明らかな如く、棚板10の表面10aに溝11を
形成することにより、焼成時に棚板10に発生す
る熱膨張収縮が溝11により分散され、棚板10
の反り等の変形が防止される。また棚板10は嵩
密度が低いことから取扱いが便利であり、更には
伝導率がよく、該棚板10の熱伝導を通じて役物
タイル15の裏面へ焼成熱が効率よく伝達され
る。しかも、前記溝11を通じて役物タイル15
の裏面15b側へ炉内雰囲気が効率よく伝達さ
れ、役物タイル15の表面15aと裏面15bと
の均一焼成が可能である。従つて、役物タイル1
5自体の焼けムラがなく、これに起因する反り等
の変形がない。
As is clear from the embodiments shown in FIGS. 1 to 6, the effect of the present invention is that by forming the grooves 11 on the surface 10a of the shelf board 10, the thermal expansion and contraction that occurs in the shelf board 10 during firing is absorbed by the grooves. distributed by the shelf board 10
deformation such as warpage is prevented. In addition, the shelf board 10 is convenient to handle because of its low bulk density, and has good conductivity, so that the firing heat is efficiently transferred to the back surface of the accessory tile 15 through heat conduction of the shelf board 10. Moreover, the accessory tile 15 is inserted through the groove 11.
The furnace atmosphere is efficiently transmitted to the back surface 15b side of the accessory tile 15, and uniform firing of the front surface 15a and back surface 15b of the accessory tile 15 is possible. Therefore, accessory tile 1
5 itself has no uneven burning, and there is no deformation such as warping caused by this.
以下に本発明の構成を図面に示す実施例に基づ
いて説明すると次の通りである。 The configuration of the present invention will be explained below based on the embodiments shown in the drawings.
第1図は、棚板10の表面10a側に短辺方向
と平行な溝11を4個形成した場合の実施例を示
すものである。この棚板10は、役物タイル裏面
15bの焼成温度を可及的に表面15a側の焼成
温度と等しくするために、該役物タイル15の原
料及び溝11の形状を下記の如く選択している。
すなわち、耐熱性無機繊維と無機結合剤を主体と
し、その嵩密度を低く抑えてポーラスなものとし
ている。嵩密度の範囲は0.2〜0.5g/cm3が適当で
ある。耐熱性無機繊維としては、セラミツクフア
イバー、シリカフアイバー、アルミナ、ムライト
結晶質フアイバー等が適当であり、少なくとも一
種類が使用される。無機結合剤としては、シリカ
ゾル、アルミナゾル、ベントナイト、カオリン、
モンモリロナイト等の通常用いられるものが使用
可能である。
FIG. 1 shows an embodiment in which four grooves 11 parallel to the short side direction are formed on the surface 10a side of the shelf board 10. This shelf board 10 is made by selecting the raw material of the accessory tile 15 and the shape of the groove 11 as described below in order to make the firing temperature of the back surface 15b of the accessory tile as equal as possible to the firing temperature of the front surface 15a. There is.
That is, it is made mainly of heat-resistant inorganic fibers and an inorganic binder, and its bulk density is kept low to make it porous. The appropriate bulk density range is 0.2 to 0.5 g/cm 3 . Suitable heat-resistant inorganic fibers include ceramic fibers, silica fibers, alumina fibers, mullite crystal fibers, etc., and at least one of them is used. Inorganic binders include silica sol, alumina sol, bentonite, kaolin,
Commonly used materials such as montmorillonite can be used.
嵩密度を限定した理由は、これが0.2g/cm3未
満であると、棚板10自体の強度が弱くなり、重
量の比較的重たいタイルの載せ台としての使用に
耐え得ないからである。また嵩密度が0.5g/cm3
を越えると、棚板10自体の重量が重くなり過
ぎ、その取扱いに不便を生じ、更には棚板10自
体の蓄熱量が大きくなつて熱効率が悪くなるから
である。 The reason for limiting the bulk density is that if it is less than 0.2 g/cm 3 , the strength of the shelf board 10 itself becomes weak and cannot withstand use as a platform for placing relatively heavy tiles. Also, the bulk density is 0.5g/ cm3
If the weight exceeds this value, the weight of the shelf board 10 itself becomes too heavy, causing inconvenience in its handling, and furthermore, the amount of heat stored in the shelf board 10 itself increases, resulting in poor thermal efficiency.
嵩密度が前記範囲にあるときは、棚板10は強
度及び熱効率に優れたものとなり、また取扱いが
便利である。しかもポーラスなものであり、熱の
通りが良い。この結果、焼成時にあつて該棚板1
0から役物タイル15の裏面15b側への熱伝導
率が良くなり、前記タイル表裏面の焼成温度を可
及的に均一にする働きをする。 When the bulk density is within the above range, the shelf board 10 has excellent strength and thermal efficiency, and is convenient to handle. Moreover, it is porous and allows heat to pass through easily. As a result, during firing, the shelf board 1
Thermal conductivity from 0 to the back surface 15b side of the accessory tile 15 is improved, and the firing temperature on the front and back surfaces of the tile is made as uniform as possible.
また本実施例は、前記溝11の深さh棚板表面
10aの表面積に対する各溝11の表面積の総和
が占める割合を下記の如く限定している。すなわ
ち、該溝11の深さhを、棚板10の高さHに対
して5〜50%の範囲とし、好ましくは25〜40%の
範囲としている。5%未満であると、本発明の直
接目的とする焼成時の棚板10自体の熱膨張収縮
による変形を防止すること及び役物タイル15の
接続15aと裏面15bとの焼成温度の不均一を
なくす効果が得られないからである。このことに
ついては後述する。また前記深さhの割合が50%
を越えると、棚板10自体の強度が弱くなり、欠
けや割れ等が発生するからである。 Further, in this embodiment, the ratio of the depth h of the grooves 11 and the total surface area of each groove 11 to the surface area of the shelf surface 10a is limited as follows. That is, the depth h of the groove 11 is in the range of 5 to 50% of the height H of the shelf board 10, preferably in the range of 25 to 40%. If it is less than 5%, the direct objective of the present invention is to prevent deformation of the shelf board 10 itself due to thermal expansion and contraction during firing and to prevent uneven firing temperature between the connection 15a and the back surface 15b of the accessory tile 15. This is because the effect of eliminating it cannot be obtained. This will be discussed later. Also, the ratio of the depth h is 50%
This is because if it exceeds this, the strength of the shelf board 10 itself will be weakened and chips, cracks, etc. will occur.
更にまた本実施例の棚板10にあつては、その
全表面にアルミナ、シリカ、アルミナ−シリカ、
ジルコニア等を主体とする無機コーテイング剤1
2を塗布している。具体的なコーテイング剤12
としては、焼成アルミナ微粉、シリカ系のシリカ
ゾル、シリカ微粉末、アルミナ−シリカ系の合成
ムライト微粉、ジルコニア系のジルコニアゾル、
安定化ジルコニア微粉等の少なくとも1種類が適
当である。この無機コーテイング剤12を塗布す
ることにより繊維質成形板である棚板10の焼成
時の粉化の防止と、表面10aの離型性を向上さ
せるためである。 Furthermore, in the case of the shelf board 10 of this embodiment, alumina, silica, alumina-silica,
Inorganic coating agent 1 mainly composed of zirconia etc.
2 is applied. Specific coating agent 12
Examples include calcined alumina fine powder, silica-based silica sol, silica fine powder, alumina-silica-based synthetic mullite fine powder, zirconia-based zirconia sol,
At least one type of stabilized zirconia fine powder is suitable. By applying this inorganic coating agent 12, the shelf board 10, which is a fibrous molded board, is prevented from being powdered during firing, and the mold releasability of the surface 10a is improved.
棚板10の製造は、上述の材料の中から適宜の
材料を選択して公知の抄造法又はプレス法等で所
定形状に成形し、無機コーテイング剤12を塗布
した後、高温で焼成する。この場合、必要に応じ
て有機結合剤(澱粉、ラテツクス、アクリル樹脂
等)、有機繊維(パルプ等)及び増粘剤(CMC、
アルギン酸ソーダ等)を添加する。有機結合剤
は、成形時から焼成時までの保形性を確保するた
めのものである。尚、この有機結合剤は、焼成時
の高温度領域で消失する。有機結合剤の消失後は
無機結合剤が耐熱性無機繊維を結合することにな
る。 The shelf board 10 is manufactured by selecting an appropriate material from the above-mentioned materials, molding it into a predetermined shape by a known papermaking method or pressing method, applying an inorganic coating agent 12, and then firing it at a high temperature. In this case, organic binders (starch, latex, acrylic resin, etc.), organic fibers (pulp, etc.) and thickeners (CMC,
(sodium alginate, etc.). The organic binder is used to ensure shape retention from the time of molding to the time of firing. Note that this organic binder disappears in the high temperature range during firing. After the organic binder disappears, the inorganic binder binds the heat-resistant inorganic fibers.
このようにして製造された棚板10の使用方法
は、第2図に示す如く、役物タイル15を載置し
て焼成に備える。この載置状態は従来と変わると
ころはない。而して、この第2図に示す状態の棚
板10をスレツドキルン1における台車3上に載
置(第7図参照)して役物タイル15を焼成する
と、棚板10の表面10a側は炉内雰囲気に曝さ
れており、その裏面10b側は耐火断熱レンガ5
と接合しているので、表面10a側と裏面10b
側との間に温度差を生じる。このため、表面a側
が裏面10b側に比較してより多く収縮し、変形
しようとする。然しながら、本棚板10にあつて
は、各溝11により表面10a側の収縮が分断さ
れ、更には第3図に示す如く、各溝11のそれぞ
れの間隔が増えることによつて前記収縮を吸収緩
和するようになる。従つて、棚板10の表面10
a側全体が収縮する度合は従来の場合に比較して
著しく減少し、表面10aの平坦度は殆ど変わら
ない。つまり、この棚板10にあつては、棚板1
0自体の焼成時の変形を防止することが可能であ
り、軟化状態の役物タイル15に反り等の変形を
与えることがない。 The method of using the shelf board 10 manufactured in this manner is as shown in FIG. 2, in which accessory tiles 15 are placed thereon and the shelf board 10 is prepared for firing. This placement condition is no different from the conventional one. When the shelf board 10 in the state shown in FIG. 2 is placed on the cart 3 in the thread kiln 1 (see FIG. 7) and the accessory tile 15 is fired, the surface 10a side of the shelf board 10 is It is exposed to the internal atmosphere, and the back side 10b is covered with fireproof insulation brick 5.
Since it is joined to the front side 10a and the back side 10b
This creates a temperature difference between the two sides. Therefore, the front surface a side tends to contract and deform more than the back surface 10b side. However, in the case of the bookshelf board 10, the shrinkage on the surface 10a side is separated by each groove 11, and as shown in FIG. 3, the shrinkage is absorbed and alleviated by increasing the distance between each groove 11. I come to do it. Therefore, the surface 10 of the shelf board 10
The degree of shrinkage of the entire a-side is significantly reduced compared to the conventional case, and the flatness of the surface 10a remains almost unchanged. In other words, for this shelf board 10, the shelf board 1
It is possible to prevent the 0 itself from being deformed during firing, and the softened accessory tile 15 is not subjected to deformation such as warping.
また前記溝11は、第4図に示す如く、炉内雰
囲気を直接役物タイル15の裏面15b側へ案内
する通路として作用し、焼成時のタイル表面15
a及び15bの焼成温度を可及的に均一にする。
つまり、役物タイル15の表面15a側と裏面1
5b側との焼けムラを防止することが可能であ
る。 Further, as shown in FIG. 4, the groove 11 acts as a passageway that directly guides the atmosphere inside the furnace to the back surface 15b side of the accessory tile 15.
Make the firing temperatures of a and 15b as uniform as possible.
In other words, the front side 15a side and the back side 1 of the accessory tile 15
It is possible to prevent uneven burning with the 5b side.
このように本実施例にあつては、溝11を設け
ることで棚板10自体の変形を防止し、また役物
タイル15の表離面の焼成温度を可及的に均一に
することで焼けムラに起因するタイル自体の変形
をも防止している。 As described above, in this embodiment, the grooves 11 are provided to prevent the shelf board 10 itself from deforming, and the baking temperature on the outer surface of the accessory tile 15 is made as uniform as possible to prevent baking. It also prevents deformation of the tile itself due to unevenness.
ところで、溝11の形状は上述の実施例に限定
されるものではなく、第5図及び第6図に示す形
状のものがあつてもよい。第5図の図a乃至図h
はそれぞれ異なる溝11の形状を示す棚板10の
平面図、第6図の図a乃至図hは第5図の図a乃
至図hに対応する棚板10の縦断面図である。次
にこれらの棚板10の製造方法について説明す
る。先ず耐熱性無機繊維としてのセラミツクフア
イバー(商品名:イビウール)を85wt%準備し、
これに無機結合剤としてのシリカゾルを10wt%
混合する。次いで、該混合物を抄造法により大き
さ80mm×40mm×30mmで嵩密度が0.3g/cm3の棚板
10を成形し、その表面10a側に無機コーテイ
ング剤12としてのシリカゾルを刷毛塗りする。
そして、シリカゾルの乾燥後に市販の帯ノコで幅
1.5mm、深さ10mmの溝11を成形し、1300〜1400
℃の温度で焼成した。棚板表面10aの表面積に
対する全ての溝11の表面積の総和は、第5図の
図cに示す実施例では10%であり、第5図の図d
では6.5%であつた。このようにして製造された
セラミツク焼成用の棚板10を使用して役物タイ
ル15を1200℃で焼成した実験では、棚板10自
体に反り等の変形は全く見られなかつた。また表
面10a側は、無機コーテイング剤12により硬
化し、繊維質の粉状物は全く生成されなかつた。
一方、役物タイル15にも反り等の変形は現れな
かつた。このことからも、棚板10の優秀性が明
らかである。 By the way, the shape of the groove 11 is not limited to the above-mentioned embodiment, and may have the shape shown in FIGS. 5 and 6. Figures a to h in Figure 5
6 are plan views of the shelf board 10 showing different shapes of the grooves 11, and FIGS. 6A to 6H are longitudinal sectional views of the shelf board 10 corresponding to FIGS. 5A to 5H. Next, a method of manufacturing these shelf boards 10 will be explained. First, 85wt% of ceramic fiber (trade name: Ibiwool) as a heat-resistant inorganic fiber was prepared.
Add 10wt% of silica sol as an inorganic binder to this.
Mix. Next, a shelf board 10 having a size of 80 mm x 40 mm x 30 mm and a bulk density of 0.3 g/cm 3 is formed from the mixture by a paper-forming method, and silica sol as an inorganic coating agent 12 is brush-coated on the surface 10a side of the shelf board 10.
After drying the silica sol, use a commercially available band saw to cut the width.
Form a groove 11 of 1.5mm and 10mm deep, 1300~1400
Calcined at a temperature of ℃. The sum of the surface areas of all the grooves 11 with respect to the surface area of the shelf surface 10a is 10% in the embodiment shown in FIG. 5 c, and in the embodiment shown in FIG.
It was 6.5%. In an experiment in which accessory tiles 15 were fired at 1200° C. using the ceramic shelf board 10 manufactured in this manner, no deformation such as warping was observed in the shelf board 10 itself. Further, the surface 10a side was hardened by the inorganic coating agent 12, and no fibrous powder was generated at all.
On the other hand, no deformation such as warping appeared in the accessory tile 15 either. From this as well, the superiority of the shelf board 10 is clear.
ところで、本発明は上記実施例に限定されるも
のではなく、適宜に変更が可能である。例えば、
溝11は棚板10の強度が許す範囲内においてそ
の側面及び裏面等へ形成してもよい。また上述の
実施例は、役物タイル焼成用の棚板について説明
したが、その他のセラミツク製品の焼成用として
使用できることは言うまでもない。 By the way, the present invention is not limited to the above embodiments, and can be modified as appropriate. for example,
The grooves 11 may be formed on the side and back surfaces of the shelf board 10 as long as the strength of the shelf board 10 allows. Further, in the above embodiment, a shelf board for firing accessory tiles has been described, but it goes without saying that the shelf board can be used for firing other ceramic products.
以上説明したように本発明にあつては、棚板表
面に溝を形成することにより、焼成時の棚板表裏
面の熱膨張収縮差を吸収緩和することができ、反
り等の変形を防止することができる。このため、
棚板がセラミツク焼成物に変形を与える等の悪影
響は全くない。また棚板表面の溝を通して炉内雰
囲気がセラミツク焼成物の裏面へ導入され、該溝
へ導入された炉内雰囲気及び棚板自体の熱伝導を
通じてセラミツク焼成物の裏面を加熱焼成するこ
とができるので、セラミツク焼成物表裏面の焼成
温度を可及的に均一にすることが可能である。従
つて、焼けムラの発生が皆無となり、優れた品質
のセラミツク製品を焼成できる。更には本発明の
棚板は嵩密度が低く、軽量であるため取扱いが非
常に便利であり、運搬装置の小型化が可能であ
る。更にまた棚板の少なくとも1つの表面に、無
機コーテイング剤を塗布しており、棚板が焼成時
に粉化するのを防止することができ、長寿命化が
可能である。
As explained above, in the present invention, by forming grooves on the surface of the shelf board, the difference in thermal expansion and contraction between the front and back surfaces of the shelf board during firing can be absorbed and alleviated, thereby preventing deformation such as warping. be able to. For this reason,
The shelf board does not have any adverse effects such as deforming the ceramic fired product. In addition, the furnace atmosphere is introduced to the back side of the ceramic fired product through the grooves on the surface of the shelf board, and the back side of the ceramic fired product can be heated and fired through the heat conduction of the furnace atmosphere introduced into the grooves and the shelf board itself. , it is possible to make the firing temperature on the front and back surfaces of the ceramic fired product as uniform as possible. Therefore, there is no occurrence of uneven firing, and ceramic products of excellent quality can be fired. Furthermore, since the shelf board of the present invention has a low bulk density and is lightweight, it is very convenient to handle, and it is possible to downsize the transportation device. Furthermore, an inorganic coating agent is applied to at least one surface of the shelf board, so that it is possible to prevent the shelf board from turning into powder during firing, and the life of the shelf board can be extended.
第1図乃至第6図は役物タイルを焼成する棚板
に適用した本発明の実施例を示すものであり、第
1図は溝を形成した棚板を示す斜視図、第2図は
該棚板に役物タイルを載置した状態を示す斜視
図、第3図は焼成時の棚板の熱変形を示す側面
図、第4図は焼成時の炉内雰囲気が溝を通じて役
物タイル裏面へ導入される状態を示す斜視図、第
5図の図a乃至図hはそれぞれ溝の形状を変形し
た実施例を示す棚板の平面図で、第6図の図a乃
至図hは第5図の図a乃至図hに対応する棚板の
縦断面図、第7図はスレツドキルンの縦断面図で
ある。
15……セラミツク製品(役物タイル)、10
……棚板、11……溝。
1 to 6 show an embodiment of the present invention applied to a shelf board for firing accessory tiles, FIG. 1 is a perspective view showing a shelf board with grooves formed, and FIG. 2 is a perspective view showing a shelf board with grooves formed therein. Figure 3 is a side view showing the thermal deformation of the shelf board during firing. Figure 4 is a perspective view showing the state in which the accessory tile is placed on the shelf board. Figure 4 is a side view showing the thermal deformation of the shelf board during firing. Figures a to h in Figure 5 are plan views of shelf boards showing embodiments in which the shape of the grooves has been modified, and Figures a to h in Figure 6 are perspective views showing the state in which the grooves are introduced. FIG. 7 is a longitudinal sectional view of the thread kiln, and FIG. 7 is a longitudinal sectional view of the shelf board corresponding to FIGS. 15... Ceramic products (accessory tiles), 10
...Shelf board, 11...groove.
Claims (1)
なり嵩密度が0.2〜0.5g/cm3の繊維質成形板であ
つて、少なくとも一つの表面にアルミナ、シリ
カ、アルミナ−シリカ、ジルコニア等を主体とす
る無機コーテイング剤を塗布すると共に複数の溝
を設けてなり、該溝の深さは前記溝形成面に垂直
な方向の繊維質成形板の寸法に対して5〜50%の
範囲であり、また溝全体の表面積は前記溝形成面
の表面積に対して1〜15%の範囲であることを特
徴とするセラミツク焼成用棚板。1 A fibrous molded plate consisting essentially of heat-resistant inorganic fibers and an inorganic binder and having a bulk density of 0.2 to 0.5 g/cm 3 , with at least one surface coated with alumina, silica, alumina-silica, zirconia, etc. A plurality of grooves are provided along with applying an inorganic coating agent as the main ingredient, and the depth of the grooves is in the range of 5 to 50% of the dimension of the fibrous molded plate in the direction perpendicular to the groove forming surface. and a shelf board for ceramic firing, characterized in that the surface area of the entire groove is in the range of 1 to 15% of the surface area of the groove forming surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9843985A JPS61256183A (en) | 1985-05-09 | 1985-05-09 | Shelf plate for baking ceramic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9843985A JPS61256183A (en) | 1985-05-09 | 1985-05-09 | Shelf plate for baking ceramic |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61256183A JPS61256183A (en) | 1986-11-13 |
| JPS635669B2 true JPS635669B2 (en) | 1988-02-04 |
Family
ID=14219807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9843985A Granted JPS61256183A (en) | 1985-05-09 | 1985-05-09 | Shelf plate for baking ceramic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61256183A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0275778U (en) * | 1988-11-29 | 1990-06-11 |
-
1985
- 1985-05-09 JP JP9843985A patent/JPS61256183A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0275778U (en) * | 1988-11-29 | 1990-06-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61256183A (en) | 1986-11-13 |
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