JPS6357744U - - Google Patents
Info
- Publication number
- JPS6357744U JPS6357744U JP15077386U JP15077386U JPS6357744U JP S6357744 U JPS6357744 U JP S6357744U JP 15077386 U JP15077386 U JP 15077386U JP 15077386 U JP15077386 U JP 15077386U JP S6357744 U JPS6357744 U JP S6357744U
- Authority
- JP
- Japan
- Prior art keywords
- tip
- probe needle
- electrode
- probe
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は、この考案に係るエツジセンサーの一
実施例の斜視図、第２図及び第３図は、その動作
を説明するための断面図、第４図は、従来のエツ
ジセンサーの一例を示す斜視図である。
１…プリント基板、２，３…プローブ針、２ａ
，３ａ…尖端、４…絶縁層、５…電極、６…リー
ド線、７…半導体ウエハ、２１，２２，２３…プ
ローブ針、２１ａ，２２ａ，２３ａ…尖端。
FIG. 1 is a perspective view of an embodiment of the edge sensor according to the invention, FIGS. 2 and 3 are sectional views for explaining its operation, and FIG. 4 is an example of a conventional edge sensor. FIG. 1... Printed circuit board, 2, 3... Probe needle, 2a
, 3a... Tip, 4... Insulating layer, 5... Electrode, 6... Lead wire, 7... Semiconductor wafer, 21, 22, 23... Probe needle, 21a, 22a, 23a... Tip.
Claims (1)
定の位置に向かつて延び、その表面に対向するよ
うに折れ曲がつた先端部を有する第１のプローブ
針と、上記第１のプローブ針における上記所定の
位置に向かつて延びた先端部に絶縁層を介して設
けられた電極と、上記電極と基板に形成されるプ
リント配線又は電極との間とを結合させる配線と
、上記第１のプローブ針に隣接してそれとほゞ平
行に延び、上記第１のプローブ針の尖端が半導体
ウエハの表面に接触の有無に対応して、その先端
が上記電極に接触／非接触となるように略水平方
向に折れ曲がつた先端部を有する第２のプローブ
針とを含むことを特徴とするプローブボード用エ
ツジセンサー。 ２ 上記絶縁層及び電極は、リング状に形成され
るものであることを特徴とする実用新案登録請求
の範囲第１項記載のプローブボード用エツジセン
サー。[Claims for Utility Model Registration] 1. A first probe needle that extends from the substrate toward a predetermined position on the surface of a semiconductor wafer to be measured and has a bent tip so as to face the surface; Wiring that connects an electrode provided at the tip of the first probe needle extending toward the predetermined position via an insulating layer, and the electrode and a printed wiring or electrode formed on a substrate; , extends adjacent to and substantially parallel to the first probe needle, and the tip of the first probe needle contacts/does not contact the electrode depending on whether or not the tip of the first probe needle contacts the surface of the semiconductor wafer. An edge sensor for a probe board, comprising: a second probe needle having a tip bent in a substantially horizontal direction so that the edge sensor is bent in a substantially horizontal direction. 2. The edge sensor for a probe board according to claim 1, wherein the insulating layer and the electrode are formed in a ring shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15077386U JPS6357744U (en) | 1986-10-01 | 1986-10-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15077386U JPS6357744U (en) | 1986-10-01 | 1986-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6357744U true JPS6357744U (en) | 1988-04-18 |
Family
ID=31067219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15077386U Pending JPS6357744U (en) | 1986-10-01 | 1986-10-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6357744U (en) |
-
1986
- 1986-10-01 JP JP15077386U patent/JPS6357744U/ja active Pending