JPS6357752U - - Google Patents

Info

Publication number
JPS6357752U
JPS6357752U JP1986150983U JP15098386U JPS6357752U JP S6357752 U JPS6357752 U JP S6357752U JP 1986150983 U JP1986150983 U JP 1986150983U JP 15098386 U JP15098386 U JP 15098386U JP S6357752 U JPS6357752 U JP S6357752U
Authority
JP
Japan
Prior art keywords
plating layer
nickel plating
lead frame
lead
oxidation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986150983U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986150983U priority Critical patent/JPS6357752U/ja
Publication of JPS6357752U publication Critical patent/JPS6357752U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案を示すリードフレームの側断面
図、第２図は半導体装置中間構体を示す部分平面
図、第３図はメツキされたリードフレームを用い
た半導体装置の側断面図である。 １…リードフレーム、２…半導体ペレツト、３
…マウント部、４，４ａ，４ｂ，４ｃ…リード部
、１０…ニツケルメツキ層、１１…耐酸化ニツケ
ルメツキ層。 FIG. 1 is a side sectional view of a lead frame showing the present invention, FIG. 2 is a partial plan view showing an intermediate structure of a semiconductor device, and FIG. 3 is a side sectional view of a semiconductor device using a plated lead frame. 1...Lead frame, 2...Semiconductor pellet, 3
...Mount part, 4, 4a, 4b, 4c... Lead part, 10... Nickel plating layer, 11... Oxidation-resistant nickel plating layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレツトをマウントするマウント部と複
数本一組のリード部とを有し半導体ペレツトを含
む主要部が樹脂にてて被覆されるリードフレーム
において、上記マウント部にはニツケルメツキ層
、耐酸化ニツケルメツキ層を積層形成し、上記リ
ード部の少くとも樹脂から露出する部分には耐酸
化ニツケルメツキ層を形成しないようにしたこと
を特徴とするリードフレーム。 In a lead frame having a mount portion for mounting a semiconductor pellet and a set of multiple lead portions, the main portion including the semiconductor pellet is coated with resin, the mount portion is coated with a nickel plating layer and an oxidation-resistant nickel plating layer. 1. A lead frame characterized in that the lead frame is formed in a laminated manner, and an oxidation-resistant nickel plating layer is not formed on at least the portion of the lead portion exposed from the resin.
JP1986150983U 1986-09-30 1986-09-30 Pending JPS6357752U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986150983U JPS6357752U (en) 1986-09-30 1986-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986150983U JPS6357752U (en) 1986-09-30 1986-09-30

Publications (1)

Publication Number Publication Date
JPS6357752U true JPS6357752U (en) 1988-04-18

Family

ID=31067623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986150983U Pending JPS6357752U (en) 1986-09-30 1986-09-30

Country Status (1)

Country Link
JP (1) JPS6357752U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021070260A1 (en) * 2019-10-08 2021-04-15 トヨタ自動車株式会社 Semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57166058A (en) * 1981-04-07 1982-10-13 Hitachi Cable Ltd Lead frame for semiconductor
JPS60117761A (en) * 1983-11-30 1985-06-25 Toshiba Corp Lead frame for semiconductor device
JPS6310565B2 (en) * 1984-06-25 1988-03-08 Taamo Jugen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57166058A (en) * 1981-04-07 1982-10-13 Hitachi Cable Ltd Lead frame for semiconductor
JPS60117761A (en) * 1983-11-30 1985-06-25 Toshiba Corp Lead frame for semiconductor device
JPS6310565B2 (en) * 1984-06-25 1988-03-08 Taamo Jugen

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021070260A1 (en) * 2019-10-08 2021-04-15 トヨタ自動車株式会社 Semiconductor device
JPWO2021070260A1 (en) * 2019-10-08 2021-04-15

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