JPS6359558A - Manufacture of thermal head - Google Patents
Manufacture of thermal headInfo
- Publication number
- JPS6359558A JPS6359558A JP20314186A JP20314186A JPS6359558A JP S6359558 A JPS6359558 A JP S6359558A JP 20314186 A JP20314186 A JP 20314186A JP 20314186 A JP20314186 A JP 20314186A JP S6359558 A JPS6359558 A JP S6359558A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- thermal head
- heat generating
- resistor
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、サーマルヘッドの製造方法に係り、特にダイ
レクトドライブ型のサーマルヘッドを製造するのに最適
なサーマルヘッドの製造方法に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a method for manufacturing a thermal head, and in particular, a method for manufacturing a thermal head that is optimal for manufacturing a direct drive type thermal head. Regarding.
（従来の技術）
一般に、感熱式あるいは熱転写式の記録装置に使用され
るサーマルヘッドは、第４図に示すように構成されてい
る。すなわち、基板（図示せず）上に列設された多数の
発熱抵抗体素子１・・・・・・と制御側（図示せず）と
をＩＣ（集積回路素子）２・・・・・・等から構成され
る駆動回路（ドライバー）３を介して接続し、制御側か
ら送出される信号に応じて駆動回路３が発熱抵抗体素子
１に駆動信号を選択的に印加し発熱させることより印字
を行なうものである。(Prior Art) Generally, a thermal head used in a thermal type or thermal transfer type recording apparatus is constructed as shown in FIG. That is, a large number of heating resistor elements 1 arranged in a row on a substrate (not shown) and a control side (not shown) are connected to an IC (integrated circuit element) 2... The drive circuit 3 selectively applies a drive signal to the heating resistor element 1 to generate heat according to the signal sent from the control side, thereby printing. This is what we do.
近年、このようなサーマルヘッドは、駆動の高速化、安
定化等を目的として、発熱抵抗体と駆動回路とを同一基
板上に形成したいわゆるダイレクトドライブ型のものが
採用されている。第５図にこのようなダイレクトドライ
ブ型サーマルヘッドの一例を示す。図中、符号４は多数
の発熱抵抗体素子５が形成された第１の基板であり、こ
の第１の基板４は駆動回路６が形成された第２の基板７
とこれらの底部に配置された基台８により合体されてい
る。In recent years, such thermal heads have been of the so-called direct drive type in which a heating resistor and a drive circuit are formed on the same substrate for the purpose of speeding up and stabilizing the drive. FIG. 5 shows an example of such a direct drive type thermal head. In the figure, reference numeral 4 denotes a first substrate on which a large number of heating resistor elements 5 are formed, and this first substrate 4 is connected to a second substrate 7 on which a drive circuit 6 is formed.
These are combined by a base 8 placed at the bottom.
上述した第２の基板７上には駆動回路６を溝成するＩＣ
９、プルアップ用の抵抗器１０等が導体パターン１１を
介して接続されており、これらの駆動回路６と第１の基
板４上に形成された発熱抵抗体素子５とはボンディング
ワイヤー１２等により接続されている。On the second substrate 7 mentioned above, there is an IC that forms the drive circuit 6.
9. A pull-up resistor 10 and the like are connected via a conductor pattern 11, and these drive circuits 6 and the heating resistor element 5 formed on the first substrate 4 are connected by a bonding wire 12 and the like. It is connected.
このようなダイレクトドライブ型サーマルヘッドの￥Ａ
遣方法を第６図に基づいて説明する。まず、第１の基板
４上に厚膜法または薄膜法により導体パターン１１を形
成するとともに発熱抵抗体から厚膜法により発熱抵抗体
素子５を形成する（第６図−イ）。一方、第２の基板７
上には導体パターン１１を厚膜法または薄膜法により形
成する（第６図−口）。次に、アルミ板等の基台８上で
これら第１の基板４（の端面）と第２の基板７（の端面
）とを（互いに突合せ）接着剤により固着する（第６図
−ハ）。次に、ＩＣ９を第２の基板７上に接着剤により
実装しく第６図−二）、ＩＣ９のパッド部１３と第１の
基板４および第２の基板７上に形成された導体パターン
１１とをホンディングワイヤー１２により接続する（第
６図−ホ）。¥A of such a direct drive type thermal head
The method of transfer will be explained based on FIG. First, a conductor pattern 11 is formed on the first substrate 4 by a thick film method or a thin film method, and a heat generating resistor element 5 is formed from a heat generating resistor by a thick film method (FIG. 6-A). On the other hand, the second substrate 7
A conductor pattern 11 is formed thereon by a thick film method or a thin film method (FIG. 6 - opening). Next, the first substrate 4 (end surface) and the second substrate 7 (end surface) are (butted against each other) and fixed with adhesive on a base 8 such as an aluminum plate (FIG. 6-c). . Next, the IC 9 is mounted on the second substrate 7 with an adhesive (FIG. 6-2), and the pad portion 13 of the IC 9 and the conductive pattern 11 formed on the first substrate 4 and the second substrate 7 are connected. are connected by the honding wire 12 (FIG. 6-E).
しかる後、第２の基板７上に形成された所定の導体パタ
ーン１１間にチップ抵抗、抵抗アレイ等からなる抵抗器
１０を半田付は等により実装する（第６図−へ）。Thereafter, a resistor 10 consisting of a chip resistor, a resistor array, etc. is mounted between predetermined conductor patterns 11 formed on the second substrate 7 by soldering or the like (see FIG. 6).
（発明が解決しようとする問題点）
ところで、上述したサーマルヘッドの製造方法において
は、駆動回路用の抵抗器を半田付は等により実装するた
めの工程が必要とされ、また部品点数も多くなり、製造
コストに影響を与えている。(Problems to be Solved by the Invention) By the way, in the method for manufacturing the thermal head described above, a process for mounting the resistor for the drive circuit by soldering, etc. is required, and the number of parts is also increased. , which has an impact on manufacturing costs.
本発明は上記の難点を解決するためになされたもので、
工数の低減および部品点数の削減を図ることにより、製
造コストを低減させることができるサーマルヘッドの製
造方法を提供することを目的としている。The present invention has been made to solve the above-mentioned difficulties.
It is an object of the present invention to provide a method for manufacturing a thermal head that can reduce manufacturing costs by reducing the number of man-hours and the number of parts.
［発明の構成］
（問題点を解決するための手段〉
すなわち本発明のサーマルヘッドの製造方法は、発熱抵
抗体からなる発熱抵抗体素子と、少なくとも抵抗体素子
を有する駆動回路とが同一面上に形成されてなるサーマ
ルヘッドの製造方法において、前記発熱抵抗体素子形成
時に、前記駆動回路の抵抗体素子を前記発熱抵抗体で同
時に形成してなることを特徴としている。[Structure of the Invention] (Means for Solving the Problems) In other words, the method for manufacturing a thermal head of the present invention is such that a heating resistor element made of a heating resistor and a drive circuit having at least a resistor element are arranged on the same plane. In the method for manufacturing a thermal head formed by the above method, when forming the heat generating resistor element, a resistor element of the drive circuit is simultaneously formed using the heat generating resistor.
（作用）
本発明のサーマルヘッドの製造方法において、発熱抵抗
体素子形成時に、駆動回路の抵抗体素子を発熱抵抗体で
同時に形成することにより、抵抗器の実装工程および抵
抗器自体を省くことができる。このため工数の低減およ
び部品点数の削減を図ることができ、製造コストを低減
させることができる。(Function) In the thermal head manufacturing method of the present invention, by simultaneously forming the resistor element of the drive circuit with the heat generating resistor when forming the heat generating resistor element, the resistor mounting process and the resistor itself can be omitted. can. Therefore, it is possible to reduce the number of man-hours and the number of parts, and it is possible to reduce manufacturing costs.
（実施例）
以下、本発明の実施例の詳細を図面に基づいて説明する
。(Example) Hereinafter, details of an example of the present invention will be described based on the drawings.
第１図は本発明の一実施例に係るサーマルヘッドの製造
方法を示す製造工程図であり、第２図はこの方法により
製造されたサーマルヘッドを示す一部斜視図である。FIG. 1 is a manufacturing process diagram showing a method for manufacturing a thermal head according to an embodiment of the present invention, and FIG. 2 is a partial perspective view showing a thermal head manufactured by this method.
これらの図に示すように、まずセラミック板等からなる
第１の基板１４上に厚膜法または薄膜法により導体パタ
ーン１５を形成するとともに、発熱抵抗体を用いて厚膜
法により発熱抵抗体素子１６・・・と駆動回路用の抵抗
体素子１７とを同時に形成する（第１図−イ）。As shown in these figures, first, a conductor pattern 15 is formed on a first substrate 14 made of a ceramic plate or the like by a thick film method or a thin film method, and a heat generating resistor element is formed by a thick film method using a heat generating resistor. 16... and the resistor element 17 for the drive circuit are formed at the same time (FIG. 1-A).
一方、第２の基板１８上には導体パターン１５ａ＠厚膜
法あるいは薄膜法により形成する（第１図−口）。On the other hand, a conductive pattern 15a is formed on the second substrate 18 by a thick film method or a thin film method (see FIG. 1).
次に、第１の基板１４と第２の基板１８とを合体する。Next, the first substrate 14 and the second substrate 18 are combined.
すなわち、アルミ板等の基台１９上で第１の基板１４（
の所定の端部）と第２の基板１８（の所定の端部）とを
（互いに突合せ）接着剤で固着する（第１図−ハ）。That is, the first substrate 14 (
(a predetermined end of) and the second substrate 18 (a predetermined end of) are (butted against each other) and fixed with an adhesive (FIG. 1-c).
しかる後、ＩＣ２０を第２の基板１８上に接着剤で実装
する（第１図−二）。この後、ＩＣ２０のパッド部２１
と第１の基板１４上に形成された導体パターン１５、第
２の基板１８上に形成された導体パターン１５ａとをボ
ンディングワイヤー２２により接続し、同様に第１の基
板１４上に形成された抵抗体素子１７に接続された各導
体パタ−ン１５と第２の基板１８上に形成された導体パ
ターン１５ａとをボンディングワイヤー２２により接続
する（第１図−ホ）。Thereafter, the IC 20 is mounted on the second substrate 18 with an adhesive (FIG. 1-2). After this, the pad portion 21 of the IC 20
A conductor pattern 15 formed on the first substrate 14 and a conductor pattern 15a formed on the second substrate 18 are connected by a bonding wire 22, and a resistor similarly formed on the first substrate 14 is connected. Each conductor pattern 15 connected to the body element 17 and the conductor pattern 15a formed on the second substrate 18 are connected by a bonding wire 22 (FIG. 1-E).
しかして上記した実施例によれば、発熱抵抗体素子１６
と抵抗体素子１７とが発熱抵抗体を用いて第１の基板１
４上へ同時に膜状に形成されているので、従来例に示し
たような抵抗器の半田付は等による実装工程を省くこと
ができ、工数の低減を図ることができるようになる。ま
た、抵抗器自体も不要なものとなるので、部品点数の削
減を図ることができるようになる。According to the embodiment described above, the heating resistor element 16
and the resistor element 17 are connected to the first substrate 1 using a heating resistor.
4 at the same time, the mounting process such as soldering of the resistor as shown in the conventional example can be omitted, and the number of man-hours can be reduced. Furthermore, since the resistor itself becomes unnecessary, the number of parts can be reduced.
なお、上述した実施例では、発熱抵抗体素子１６と駆動
回路とはそれぞれ異なった基板１４．１８上に形成され
るものであったが、本発明はこれに限定されることなく
、第３図に示すように、これらを同一の基板２３上へ形
成する場合においても同様に実施することができる。In the above embodiment, the heating resistor element 16 and the drive circuit were formed on different substrates 14 and 18, but the present invention is not limited to this, and as shown in FIG. As shown in FIG. 2, the same method can be applied even when these are formed on the same substrate 23.
［発明の効果］
以上説明したように本発明のサーマルヘッドの製造方法
によれば、工数の低減および部品点数の削減を図ること
ができるので、製造コストを低減させることができる。[Effects of the Invention] As explained above, according to the method of manufacturing a thermal head of the present invention, it is possible to reduce the number of man-hours and the number of parts, and therefore, it is possible to reduce manufacturing costs.
第１図は本発明の実施例のサーマルヘッドの製造方法を
説明するための製造工程図、第２図は第１図に示す方法
により製造されたサーマルヘッドを示す一部斜視図、第
３図は本発明の他の実施例を説明するためのサーマルヘ
ッドを示す一部斜視図、第４図はサーマルヘッドの構成
を示す回路図、第５図は従来のダイレクトドライブ型サ
ーマルヘッドを示す一部斜視図、第６図はその製造工程
図である。
１４・・・・・・・・・第１の基板
１５．１５ａ・・・・・・・・・導体パターン１６・・
・・・・・・・発熱抵抗体素子１７・・・・・・・・・
抵抗体素子
１８・・・・・・・・・第２の基板
１９・・・・・・・・・基台
２０・・・・・・・・・ＩＣ
第１ 図
第２図
５ａ
第３図FIG. 1 is a manufacturing process diagram for explaining a method for manufacturing a thermal head according to an embodiment of the present invention, FIG. 2 is a partial perspective view showing a thermal head manufactured by the method shown in FIG. 1, and FIG. 4 is a partial perspective view showing a thermal head for explaining another embodiment of the present invention, FIG. 4 is a circuit diagram showing the configuration of the thermal head, and FIG. 5 is a partial perspective view showing a conventional direct drive type thermal head. The perspective view and FIG. 6 are diagrams of the manufacturing process. 14......First substrate 15.15a...Conductor pattern 16...
...Heating resistor element 17...
Resistor element 18... Second substrate 19... Base 20... IC Fig. 1 Fig. 2 Fig. 5a Fig. 3
Claims (1)
も抵抗体素子を有する駆動回路とが同一面上に形成され
てなるサーマルヘッドの製造方法において、前記発熱抵
抗体素子形成時に、前記駆動回路の抵抗体素子を前記発
熱抵抗体で同時に形成してなることを特徴とするサーマ
ルヘッドの製造方法。(1) In a method for manufacturing a thermal head in which a heating resistor element made of a heating resistor and a drive circuit having at least a resistor element are formed on the same surface, when forming the heating resistor element, the drive circuit A method for manufacturing a thermal head, characterized in that a resistor element is formed simultaneously with the heating resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20314186A JPS6359558A (en) | 1986-08-29 | 1986-08-29 | Manufacture of thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20314186A JPS6359558A (en) | 1986-08-29 | 1986-08-29 | Manufacture of thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6359558A true JPS6359558A (en) | 1988-03-15 |
Family
ID=16469096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20314186A Pending JPS6359558A (en) | 1986-08-29 | 1986-08-29 | Manufacture of thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6359558A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009025866A (en) * | 2007-07-17 | 2009-02-05 | Nec Electronics Corp | Memory controller, bus system, integrated circuit and control method for integrated circuit |
-
1986
- 1986-08-29 JP JP20314186A patent/JPS6359558A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009025866A (en) * | 2007-07-17 | 2009-02-05 | Nec Electronics Corp | Memory controller, bus system, integrated circuit and control method for integrated circuit |
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