JPS6361134U - - Google Patents
Info
- Publication number
- JPS6361134U JPS6361134U JP15589186U JP15589186U JPS6361134U JP S6361134 U JPS6361134 U JP S6361134U JP 15589186 U JP15589186 U JP 15589186U JP 15589186 U JP15589186 U JP 15589186U JP S6361134 U JPS6361134 U JP S6361134U
- Authority
- JP
- Japan
- Prior art keywords
- mounting hole
- pot
- template
- plunger
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案に係る半導体装置の樹脂封止装
置を示す断面図、第２図は従来の半導体装置の樹
脂封止装置を示す断面図である。
１……型板、４……ポツト取付孔、５……ロツ
ド挿通孔、８……プランジヤー、９……プランジ
ヤーヘツド、１０……プランジヤーロツド、２２
……シールリング。
FIG. 1 is a sectional view showing a resin sealing device for a semiconductor device according to the present invention, and FIG. 2 is a sectional view showing a conventional resin sealing device for a semiconductor device. 1... Template plate, 4... Pot mounting hole, 5... Rod insertion hole, 8... Plunger, 9... Plunger head, 10... Plunger rod, 22
……Seal ring.
Claims (1)
びこの取付孔の軸線と同一の軸線をもつロツド挿
通孔を有しその内部を型締め状態において真空排
気可能な下側の型板と、この型板のポツト取付孔
内に取り付けられプランジヤーのヘツドがその内
部を進退するトランスフアポツトとを備え、前記
型板のロツド挿通孔と前記プランジヤーのロツド
との間にシールリングを介装したことを特徴とす
る半導体装置の樹脂封止装置。 A lower mold plate having a pot mounting hole opening on the parting surface side and a rod insertion hole having the same axis as the axis of this mounting hole, the inside of which can be evacuated in a mold clamped state, and a pot of this template. A semiconductor comprising a transfer pot installed in a mounting hole and through which the head of the plunger advances and retreats, and a seal ring interposed between the rod insertion hole of the template and the rod of the plunger. Resin sealing device for equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15589186U JPS6361134U (en) | 1986-10-09 | 1986-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15589186U JPS6361134U (en) | 1986-10-09 | 1986-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6361134U true JPS6361134U (en) | 1988-04-22 |
Family
ID=31077003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15589186U Pending JPS6361134U (en) | 1986-10-09 | 1986-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6361134U (en) |
-
1986
- 1986-10-09 JP JP15589186U patent/JPS6361134U/ja active Pending
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