JPS636169U - - Google Patents
Info
- Publication number
- JPS636169U JPS636169U JP9844086U JP9844086U JPS636169U JP S636169 U JPS636169 U JP S636169U JP 9844086 U JP9844086 U JP 9844086U JP 9844086 U JP9844086 U JP 9844086U JP S636169 U JPS636169 U JP S636169U
- Authority
- JP
- Japan
- Prior art keywords
- tank
- boiling point
- solvent
- solder
- recovered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000009835 boiling Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係る半田槽を示す説明図、第
２図は同半田槽で半田付け処理するプリント基板
の説明図、第３〜６図は同プリント基板の電子部
品装着工程を示す説明図である。
１：槽、２：溶融半田、３：高沸点溶剤、４：
冷却槽。
Fig. 1 is an explanatory diagram showing a solder tank according to the present invention, Fig. 2 is an explanatory diagram of a printed circuit board to be soldered in the same solder tank, and Figs. 3 to 6 are an explanatory diagram showing the electronic component mounting process on the same printed circuit board It is a diagram. 1: Tank, 2: Molten solder, 3: High boiling point solvent, 4:
Cooling tank.
Claims (1)
ソ系高沸点溶剤を充填したことを特徴とする半田
槽。 (2) 上記高沸点溶剤が、槽上方に配置する冷却
槽で回収可能になつているところの実用新案登録
請求の範囲第１項記載の半田槽。[Scope of Claim for Utility Model Registration] (1) A solder tank characterized by being filled with a high-boiling point fluorine solvent as an upper layer of molten solder contained in the tank. (2) The soldering tank according to claim 1, wherein the high boiling point solvent can be recovered in a cooling tank disposed above the tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9844086U JPS636169U (en) | 1986-06-26 | 1986-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9844086U JPS636169U (en) | 1986-06-26 | 1986-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS636169U true JPS636169U (en) | 1988-01-16 |
Family
ID=30966374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9844086U Pending JPS636169U (en) | 1986-06-26 | 1986-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS636169U (en) |
-
1986
- 1986-06-26 JP JP9844086U patent/JPS636169U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS636169U (en) | ||
| JPH0787266B2 (en) | Soldering device | |
| JPH01238091A (en) | Printed board | |
| JPS63299855A (en) | Soldering method | |
| JPS63136352U (en) | ||
| JPS62114475U (en) | ||
| JPH0310568U (en) | ||
| JPS6018575U (en) | printed circuit board equipment | |
| JPS62135475U (en) | ||
| JPS6413101U (en) | ||
| JPS6316479U (en) | ||
| JPS5877081U (en) | Soldered structure | |
| JPS60116263U (en) | printed wiring board | |
| JPH0523568U (en) | Small module mounting device | |
| JPS61127667U (en) | ||
| JPS60172373U (en) | Component mounting structure for printed circuit board | |
| JPS58177969U (en) | printed wiring board | |
| JPH0215767U (en) | ||
| JPS63101174U (en) | ||
| JPS61183566U (en) | ||
| JPH0242471U (en) | ||
| JPH0240227B2 (en) | ||
| JPS63156126U (en) | ||
| JPS63100874U (en) | ||
| JPS5933273U (en) | Printed board |