JPS6365223U - - Google Patents
Info
- Publication number
- JPS6365223U JPS6365223U JP1986159750U JP15975086U JPS6365223U JP S6365223 U JPS6365223 U JP S6365223U JP 1986159750 U JP1986159750 U JP 1986159750U JP 15975086 U JP15975086 U JP 15975086U JP S6365223 U JPS6365223 U JP S6365223U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- melting point
- point metal
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986159750U JPS6365223U (2) | 1986-10-17 | 1986-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986159750U JPS6365223U (2) | 1986-10-17 | 1986-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6365223U true JPS6365223U (2) | 1988-04-30 |
Family
ID=31084476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986159750U Pending JPS6365223U (2) | 1986-10-17 | 1986-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6365223U (2) |
-
1986
- 1986-10-17 JP JP1986159750U patent/JPS6365223U/ja active Pending