JPS6365223U - - Google Patents

Info

Publication number
JPS6365223U
JPS6365223U JP1986159750U JP15975086U JPS6365223U JP S6365223 U JPS6365223 U JP S6365223U JP 1986159750 U JP1986159750 U JP 1986159750U JP 15975086 U JP15975086 U JP 15975086U JP S6365223 U JPS6365223 U JP S6365223U
Authority
JP
Japan
Prior art keywords
chip
substrate
melting point
point metal
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986159750U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986159750U priority Critical patent/JPS6365223U/ja
Publication of JPS6365223U publication Critical patent/JPS6365223U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Die Bonding (AREA)
JP1986159750U 1986-10-17 1986-10-17 Pending JPS6365223U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986159750U JPS6365223U (fr) 1986-10-17 1986-10-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986159750U JPS6365223U (fr) 1986-10-17 1986-10-17

Publications (1)

Publication Number Publication Date
JPS6365223U true JPS6365223U (fr) 1988-04-30

Family

ID=31084476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986159750U Pending JPS6365223U (fr) 1986-10-17 1986-10-17

Country Status (1)

Country Link
JP (1) JPS6365223U (fr)

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