JPS6365680A - Tunnel diode type semiconductor device - Google Patents

Tunnel diode type semiconductor device

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Publication number
JPS6365680A
JPS6365680A JP21020386A JP21020386A JPS6365680A JP S6365680 A JPS6365680 A JP S6365680A JP 21020386 A JP21020386 A JP 21020386A JP 21020386 A JP21020386 A JP 21020386A JP S6365680 A JPS6365680 A JP S6365680A
Authority
JP
Japan
Prior art keywords
layer
semiconductor layer
type
semiconductor
electron affinity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21020386A
Other languages
Japanese (ja)
Inventor
Akihiko Okamoto
明彦 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP21020386A priority Critical patent/JPS6365680A/en
Publication of JPS6365680A publication Critical patent/JPS6365680A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To increase a transmission probability of electrons and make it possible to increase the transmitted current by forming an impurity level in a forbidden band of semiconductor layer that could be an obstacle in forming quantum well. CONSTITUTION:An n-type GaAs substrate 1, an n-type Al0.3Ga0.7As layer 2 that is doped with Si at 5X10<17>cm<-3>, a layer 3 with high purity GaAs, a layer 4 with high purity Al0.3Ga0.7As, and an n-type GaAs layer 5 are used as the first, second, third, fourth and fifth semiconductor layers according to the order of describing above so as to perform the epitaxial growth. Gold, germanium, and nickel are processed by a deposition process and then are alloyed to form electrodes 6 and 7. A process of the epitaxial growth allows the n-type Al0.3Ga0.7 As layer 2 and the layer 4 with high purity Al0.3Ga0.7As to grow by 50 Angstrom and the layer with high purity GaAs to grow by 45 Angstrom respectively with a process of molecular beam epitaxy. Thus, electrons having an energy corresponding to an impurity energy level can increase each probability of existence and transmission in respective layers.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はトンネルダイオード型半導体装置に関し、特に
電子親和力が異なる半導体層、又は電子親和力と禁制帯
幅との和が異なる半導体層により形成される量子準位を
用いたトンネルダイオード型半導体装置に関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a tunnel diode type semiconductor device, and in particular is formed of semiconductor layers having different electron affinities or different sums of electron affinities and forbidden band widths. This invention relates to a tunnel diode type semiconductor device using quantum levels.

〔従来の技術〕[Conventional technology]

電子親和力が興なる半導体層、あるいは電子親和力と禁
制帯幅が異なる半導体層により形成される量子準位を用
いたトンネルダイオードはとくに低温において大きな負
性抵抗が得られることより近年ますます着目されている
ものである。この型のトンネルダイオードは、例えばヒ
化ガリウム(以下GaAs)層とこれより電子親和力の
小さい半導体層たとえばヒ化アルミニウムガリウム(以
下^I GaAs)層により形成される量子準位を透過
する電子を電極電圧で制御して動作する。
Tunnel diodes, which use quantum levels formed by semiconductor layers with high electron affinities or semiconductor layers with different electron affinities and forbidden band widths, have attracted increasing attention in recent years because of their ability to obtain large negative resistance, especially at low temperatures. It is something that exists. This type of tunnel diode uses a gallium arsenide (hereinafter referred to as GaAs) layer and a semiconductor layer having a lower electron affinity, such as an aluminum gallium arsenide (hereinafter referred to as ^I GaAs) layer. Operates by controlling voltage.

さてこのような半導体装置において、たとえば電子はG
aAs層及び障壁となるAl GaAs層を透過するが
、kl GaAs層中ではトンネル電流であり、一般に
アルミニウム組成が多いほどつまりGaAs層とAe 
GaAs層の価電子帯の不連続量を大きくするほど、又
AJ? GaAs層が厚いほど透過する確率がさがる。
Now, in such a semiconductor device, for example, electrons are
It passes through the aAs layer and the Al GaAs layer that acts as a barrier, but it is a tunnel current in the kl GaAs layer, and generally speaking, the higher the aluminum composition, the more the GaAs layer and the Al GaAs layer.
The larger the amount of discontinuity in the valence band of the GaAs layer, the more AJ? The thicker the GaAs layer, the lower the probability of transmission.

したがって透過する電流量を大きくするにはに!!Ga
As層をある程度薄くする必要があるが、量子準位を形
成するためにはある程度以上でなければならない。した
がって、Al GaAs層の厚さは50人程度である。
Therefore, to increase the amount of current that passes through! ! Ga
Although it is necessary to make the As layer thinner to some extent, it must be thinner than a certain level in order to form a quantum level. Therefore, the thickness of the AlGaAs layer is approximately 50 mm.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

このようにAe GaAs層を透過する電子はトンネル
現象でありその電子のエネルギーは^eGaAsの禁制
帯中に位置し、不純物の存在しないkl GaAs層で
は電子の存在できるエネルギー準位は存在しない、した
がって定常的にはそのエネルギー準位には電子は存在し
ないなめ、この層を電子が透過する割合が低くダイオー
ドの電流量が大きくできないという問題点があった。
In this way, electrons passing through the AeGaAs layer are a tunnel phenomenon, and the energy of the electrons is located in the forbidden band of ^eGaAs.In the kl GaAs layer where there are no impurities, there is no energy level where electrons can exist. Since there are no electrons at this energy level in a steady state, the rate at which electrons pass through this layer is low, and there is a problem in that the amount of current flowing through the diode cannot be increased.

本発明の目的は電流量の大きなトンネルダイオード型半
導体装置を提供することにある。
An object of the present invention is to provide a tunnel diode type semiconductor device with a large amount of current.

〔問題点を解決するための手段〕[Means for solving problems]

本発明第1のトンネルダイオード型半導体装置は、p型
の第1の半導体層にこれより電子親和力の小さい第2の
半導体層又は第1の絶縁体層が設けられ、さらに前記第
2の半導体層又は第1の絶縁体層上にこれより電子親和
力の小さい第3の半導体層が設けられ、さらに前記第3
の半導体層上にこれより電子親和力の小さい第4の半導
体層又は第2の絶縁体層が設けられ、さらに前記第4の
半導体層又は第2の絶縁体層上にこれより電子親和力の
大きいp型の第5の半導体層が設けられて少なくとも一
つの量子井戸を構成してなるトンネルダイオード型半導
体装置において、前記第1の半導体層と前記第5の半導
体層との間に印加される所定電圧において前記量子井戸
内の量子準位に一致する不純物準位を構成するn型不純
物が前記第2の半導体層又は第1の絶縁体層と前記第4
の半導体層又は第2の絶縁体層の少なくともいずれか一
つに含まれているという構成を有している。
In the first tunnel diode type semiconductor device of the present invention, a p-type first semiconductor layer is provided with a second semiconductor layer or a first insulator layer having a smaller electron affinity than the first semiconductor layer, and the second semiconductor layer Alternatively, a third semiconductor layer having a smaller electron affinity is provided on the first insulating layer, and further the third semiconductor layer has a lower electron affinity than the first insulating layer.
A fourth semiconductor layer or a second insulating layer having a smaller electron affinity is provided on the semiconductor layer, and a fourth semiconductor layer or a second insulating layer having a larger electron affinity than the fourth semiconductor layer or the second insulating layer is provided on the fourth semiconductor layer or the second insulating layer. In a tunnel diode type semiconductor device comprising at least one quantum well provided with a fifth semiconductor layer of the type, a predetermined voltage applied between the first semiconductor layer and the fifth semiconductor layer. In the method, an n-type impurity constituting an impurity level matching a quantum level in the quantum well is added to the second semiconductor layer or the first insulator layer and the fourth insulator layer.
It has a structure in which it is included in at least one of the semiconductor layer or the second insulator layer.

本発明第2のトンネルダイオード型半導体装置は、p型
の第1の半導体層上にこれより電子親和力と禁制帯幅の
和の大きい第2の半導体層又は第1の絶縁体層が設けら
れ、さらに前記第2の半導体層又は第1の絶縁体層上に
これより電子親和力と禁制帯幅の和の小さい第3の半導
体層が設けられ、さらに前記第3の半導体層上にこれよ
り電子親和力と禁制帯幅の和の大きい第4の半導体層又
は第2の絶縁体層が設けられ、さらに前記第4の半導体
層又は第2の絶縁体層上にこれより電子親和力と禁制帯
の和の小さいp型の第5の半導体層が設けられて少なく
とも一つの量子井戸を構成してなるトンネルダイオード
型半導体装置において、前記第1の半導体層と前記第5
の半導体層との間に印加される所定電圧において前記量
子井戸内の量子準位に一致する不純物準位を形成するn
型不純物が前記第2の半導体層又は第1の絶縁体層と前
記第4の半導体層又は第2の絶縁体層の少なくともいず
れかに含まれているという構成を有しているや 〔作用〕 第2の半導体層又は第1の絶縁体層と第4の半導体層又
は第2の絶縁体層の少なくともいずれか一方にn(又は
p)型不純物が含まれていてその不純物固有のエネルギ
ー準位が半導体層又は絶縁体層のエネルギー帯中に形成
され、この不純物エネルー準位に対応するエネルギーを
もつ電子はその層中の存在確率及び透過確率が増大する
In the second tunnel diode type semiconductor device of the present invention, a second semiconductor layer or a first insulating layer having a larger sum of electron affinity and forbidden band width is provided on the p-type first semiconductor layer, Further, a third semiconductor layer having a smaller sum of electron affinity and forbidden band width is provided on the second semiconductor layer or the first insulator layer, and furthermore, a third semiconductor layer with a smaller sum of electron affinity and forbidden band width is provided on the third semiconductor layer. A fourth semiconductor layer or a second insulating layer having a large sum of the electron affinity and the forbidden band width is provided on the fourth semiconductor layer or the second insulating layer. In a tunnel diode type semiconductor device in which a small p-type fifth semiconductor layer is provided to constitute at least one quantum well, the first semiconductor layer and the fifth semiconductor layer
forming an impurity level that matches the quantum level in the quantum well at a predetermined voltage applied between the semiconductor layer and the quantum well.
[Function] At least one of the second semiconductor layer or the first insulator layer and the fourth semiconductor layer or the second insulator layer contains an n (or p) type impurity, and the impurity has an energy level specific to the impurity. is formed in the energy band of the semiconductor layer or insulator layer, and the probability of the existence and transmission of electrons in the layer increases for electrons having energy corresponding to this impurity energy level.

〔実施例〕〔Example〕

次に、本発明の実施例について図面を参照して説明する
Next, embodiments of the present invention will be described with reference to the drawings.

第1図は本発明第1のトンネルダイオード型半導体装置
の一実施例の主要部を示すダイオードチップの断面図で
あるに の実施例は、第1の半導体層としてn型Ga^S基板1
、第2の半導体層としてSiを5X10”C11ドープ
したn型he 0−3caQ、7AS層2、第3の半導
体層として高純度GaAs層3、第4の半導体層として
高純度he O,3aa0.7AS層4、第5の半導体
層としてn型GaAs層を用い、エピタキシャル成長し
たものである。図において電極6.7は金、ゲルマニウ
ム、ニッケルを蒸着し合金化したものである。エピタキ
シャル成長法は分子線エピタキシャル法でn型Aj? 
0.3Gag、7A5層2、高純度A10−3GaO−
7AS層4をそれぞれ50人、高純度GaAs層を45
人成長させている。
FIG. 1 is a sectional view of a diode chip showing the main parts of an embodiment of a first tunnel diode type semiconductor device of the present invention. In this embodiment, an n-type Ga^S substrate 1 is used as a first semiconductor layer.
, an n-type he 0-3caQ,7AS layer 2 doped with Si 5X10''C11 as the second semiconductor layer, a high-purity GaAs layer 3 as the third semiconductor layer, and a high-purity heO,3aa0. 7AS layer 4, an n-type GaAs layer is used as the fifth semiconductor layer and is epitaxially grown. In the figure, the electrode 6.7 is made by depositing and alloying gold, germanium, and nickel. The epitaxial growth method uses molecular beams. N-type Aj by epitaxial method?
0.3Gag, 7A5 layer 2, high purity A10-3GaO-
50 people each for 7AS layer 4, 45 people for high purity GaAs layer
It makes people grow.

第2図はこの実施例のトンネルダイオードにおいて電極
7下における深さ方向の熱平衡状態でのエネルギーバン
ド状態図である。ここで第2.第3、第4の半導体層に
より量子井戸構造が形成されていて第3の半導体層中に
量子準位が形成されている。又、第2の半導体層にn型
不純物であるシリコンをドーピングし、このn型^e 
0−3aaO,7人s層2のエネルギーバンド中に不純
物準位8を形成している。
FIG. 2 is an energy band phase diagram in a thermal equilibrium state in the depth direction under the electrode 7 in the tunnel diode of this embodiment. Here's the second one. A quantum well structure is formed by the third and fourth semiconductor layers, and a quantum level is formed in the third semiconductor layer. Also, the second semiconductor layer is doped with silicon, which is an n-type impurity, and this n-type
0-3aaO, an impurity level 8 is formed in the energy band of the 7s layer 2.

次に、電極6を正、電極7を負として電圧を約0.2ボ
ルト印加する。第3図はこのときのエネルギーバンド状
態図である。電圧を印加することにより第5の半導体層
であるn型GaAsN3の価電子帯と第3の半導体層で
ある高純度GaAs層3の量子準位9、さらに半導体層
中の不純物準位8がほぼ同一エネルギー準位となる。こ
のような状態においてn型GaAs層5より注入された
電子は高純度^e o、5Gao、7As層4を透過し
て高純度GaAs層3にする。そして量子準位9及び不
純物準位8はほぼ同一準位を形成しておりこの準位を介
してnfiGa^S基板1に達する。一方従来の構造つ
まり第2の半導体層に不純物準位が存在しない場合筒3
の半導体層に達した電子の一部は透過するが一部は反射
してしまう。したがって本発明の場合はど共鳴した電圧
における電流量は得られない。
Next, a voltage of about 0.2 volts is applied with electrode 6 being positive and electrode 7 being negative. FIG. 3 is an energy band phase diagram at this time. By applying a voltage, the valence band of n-type GaAsN3, which is the fifth semiconductor layer, the quantum level 9 of the high-purity GaAs layer 3, which is the third semiconductor layer, and the impurity level 8 in the semiconductor layer are approximately They have the same energy level. In such a state, electrons injected from the n-type GaAs layer 5 pass through the high purity ^eo, 5Gao, 7As layer 4 to form the high purity GaAs layer 3. The quantum level 9 and the impurity level 8 form almost the same level, and reach the nfiGa^S substrate 1 via this level. On the other hand, in the conventional structure, that is, when there is no impurity level in the second semiconductor layer, the cylinder 3
Some of the electrons that reach the semiconductor layer are transmitted, but some are reflected. Therefore, in the case of the present invention, it is not possible to obtain the amount of current at a resonant voltage.

第4図は本発明第2のトンネルダイオード型半導体装置
の一実施例の主要部を示すダイオードチップの断面図で
ある。
FIG. 4 is a sectional view of a diode chip showing the main part of an embodiment of the second tunnel diode type semiconductor device of the present invention.

この実施例は第1の半導体層としてp型GaAs基板1
1、第2の半導体層としてCdを5X1017cm’ド
ープしたp型^e O,5Gao、tAS層12、第3
の半導体層として高純度GaAs層13、第4の半導体
層として高純度AI!o、5Gao、sAs層14、第
5の半導体層としてn型GaAs層15を用いる。電極
16.17は金、亜鉛、二・ソケルを蒸着し合金化した
ものを使う。
In this embodiment, a p-type GaAs substrate 1 is used as the first semiconductor layer.
1. p-type ^e O, 5Gao doped with Cd at 5X1017 cm' as the second semiconductor layer, tAS layer 12, third
A high-purity GaAs layer 13 is used as the semiconductor layer, and a high-purity AI layer is used as the fourth semiconductor layer. An n-type GaAs layer 15 is used as the sAs layer 14 and the fifth semiconductor layer. The electrodes 16 and 17 are made of vapor-deposited alloys of gold, zinc, and dichloromethane.

第5図はこの実施例において電極17下における深さ方
向の熱平衡状態でのエネルギーバンド状態図であり、p
型kl 0−5aaO15人S層12中に不純物準位1
8、高純度GaAs層13中に量子準位19が形成され
ている。
FIG. 5 is an energy band phase diagram in a thermal equilibrium state in the depth direction under the electrode 17 in this embodiment, and p
Type kl 0-5aaO15 Impurity level 1 in S layer 12
8. A quantum level 19 is formed in the high purity GaAs layer 13.

正孔のトンネル現象も電子の場合と同様量子準位及び不
純物準位が印加電圧によってほぼ同一準位となった場合
に共鳴トンネル現象がおこり、不純物準位が存在しない
従来構造のものに比較してその透過確率が増大し、共鳴
電流量を多くとることが可能となる。
Similar to the case of electrons, hole tunneling occurs when the quantum level and impurity level become almost the same level due to the applied voltage, and resonant tunneling occurs. This increases the transmission probability, making it possible to obtain a large amount of resonant current.

なお、第2の半導体層の代りに第1の絶縁層、第4の半
導体層の代りに第2の絶縁層をもちいても、これらの絶
縁層がトンネル電流を通す程度の厚さである限り以上の
議論はそのままあてはまる。
Note that even if the first insulating layer is used instead of the second semiconductor layer and the second insulating layer is used instead of the fourth semiconductor layer, as long as these insulating layers have a thickness that allows tunneling current to pass through. The above discussion still applies.

〔発明の効果〕〔Effect of the invention〕

以上の説明から明らかなように本発明は量子井戸を形成
するための障壁となる半導体層の禁制帯中に不純物準位
を形成することにより電子の透過確率を増大させしたが
って透過する電流量を増大することが可能となるという
利点がありトンネルダイオード型半導体装置の電流駆動
能力を増大することができ、従来のものに比較して半導
体素子の性能向上を達成することができる効果は著しい
As is clear from the above explanation, the present invention increases the probability of electron transmission by forming an impurity level in the forbidden band of the semiconductor layer that serves as a barrier for forming a quantum well, thereby increasing the amount of current transmitted. This has the advantage that the current driving capability of the tunnel diode type semiconductor device can be increased, and the performance of the semiconductor element can be significantly improved compared to the conventional device.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の第1のトンネルダイオード型半導体装
置の一実施例の主要部を示す断面図、第2図及び第3図
はそれぞれ第1図の実施例の熱平衡状態、及び電圧印加
状態のエネルギーバンド状態図、第4図は本発明の第2
のトンネルダイオード型半導体装置の一実施例を示す断
面図、第5図は第4図の実施例の熱平衡状態のエネルギ
ーバンド状態図である。 1−−− n型GaAs基板、2 ・n型Aj’ o、
5Gao−p^S層、3・・・高純度GaAs層、4・
・・高純度^e 0−3aaQ−7As層、5・・・n
型GaAs層、6.7・・・電極、8・・・不純物準位
、9・・・量子準位、11・・・p型GaAs基板、1
2 ・P型A1!、)、5GaO,gAs層、13 ・
・・高純度GaAs層、14 ・・・高純度^e o−
5Gao、5Av層、15 ・−p型GaAs層、16
.17・・・電極、18・・・不純物準位、19・・・
量子準位。 滞 41!I
FIG. 1 is a sectional view showing the main parts of an embodiment of the first tunnel diode type semiconductor device of the present invention, and FIGS. 2 and 3 show the thermal equilibrium state and voltage application state of the embodiment of FIG. 1, respectively. FIG. 4 shows the energy band phase diagram of the second embodiment of the present invention.
FIG. 5 is a cross-sectional view showing an embodiment of the tunnel diode type semiconductor device of FIG. 4, and FIG. 5 is an energy band phase diagram of the embodiment of FIG. 1--- n-type GaAs substrate, 2 ・n-type Aj'o,
5 Gao-p^S layer, 3... High purity GaAs layer, 4...
・・High purity^e 0-3aaQ-7As layer, 5...n
type GaAs layer, 6.7... electrode, 8... impurity level, 9... quantum level, 11... p-type GaAs substrate, 1
2 ・P type A1! ), 5GaO, gAs layer, 13 ・
... High purity GaAs layer, 14 ... High purity ^e o-
5 Gao, 5 Av layer, 15 ・-p-type GaAs layer, 16
.. 17... Electrode, 18... Impurity level, 19...
quantum level. Stay 41! I

Claims (2)

【特許請求の範囲】[Claims] (1)n型の第1の半導体層にこれより電子親和力の小
さい第2の半導体層又は第1の絶縁体層が設けられ、さ
らに前記第2の半導体層又は第1の絶縁体層上にこれよ
り電子親和力の小さい第3の半導体層が設けられ、さら
に前記第3の半導体層上にこれより電子親和力の小さい
第4の半導体層又は第2の絶縁体層が設けられ、さらに
前記第4の半導体層又は第2の絶縁体層上にこれより電
子親和力の大きいn型の第5の半導体層が設けられて少
なくとも一つの量子井戸を構成してなるトンネルダイオ
ード型半導体装置において、前記第1の半導体層と前記
第5の半導体層との間に印加される所定電圧において前
記量子井戸内の量子準位に一致する不純物準位を構成す
るn型不純物が前記第2の半導体層又は第1の絶縁体層
と前記第4の半導体層又は第2の絶縁体層の少なくとも
いずれか一つに含まれていることを特徴とするトンネル
ダイオード型半導体装置。
(1) A second semiconductor layer or a first insulator layer having a smaller electron affinity is provided on the n-type first semiconductor layer, and a second semiconductor layer or a first insulator layer is further provided on the second semiconductor layer or the first insulator layer. A third semiconductor layer having a lower electron affinity than this is provided, further a fourth semiconductor layer or a second insulating layer having a lower electron affinity is provided on the third semiconductor layer, and further the fourth In the tunnel diode type semiconductor device, an n-type fifth semiconductor layer having a higher electron affinity is provided on the semiconductor layer or the second insulator layer to constitute at least one quantum well. The n-type impurity constituting an impurity level that matches the quantum level in the quantum well at a predetermined voltage applied between the semiconductor layer and the fifth semiconductor layer is in the second semiconductor layer or the first semiconductor layer. and at least one of the fourth semiconductor layer and the second insulator layer.
(2)p型の第1の半導体層上にこれより電子親和力と
禁制帯幅の和の大きい第2の半導体層又は第1の絶縁体
層が設けられ、さらに前記第2の半導体層又は第1の絶
縁体層上にこれより電子親和力と禁制帯幅の和の小さい
第3の半導体層が設けられ、さらに前記第3の半導体層
上にこれより電子親和力と禁制帯幅の和の大きい第4の
半導体層又は第2の絶縁体層が設けられ、さらに前記第
4の半導体層又は第2の絶縁体層上にこれより電子親和
力と禁制帯の和の小さいp型の第5の半導体層が設けら
れて少なくとも一つの量子井戸を構成してなるトンネル
ダイオード型半導体装置において、前記第1の半導体層
と前記第5の半導体層との間に印加される所定電圧にお
いて前記量子井戸内の量子準位に一致する不純物準位を
形成するp型不純物が前記第2の半導体層又は第1の絶
縁体層と前記第4の半導体層又は第2の絶縁体層の少な
くともいずれかに含まれていることを特徴とするトンネ
ルダイオード型半導体装置。
(2) A second semiconductor layer or a first insulator layer having a larger sum of electron affinity and forbidden band width is provided on the p-type first semiconductor layer, and further the second semiconductor layer or the first insulator layer is provided on the p-type first semiconductor layer. A third semiconductor layer having a smaller sum of electron affinity and forbidden band width is provided on the first insulating layer, and a third semiconductor layer having a larger sum of electron affinity and forbidden band width is provided on the third semiconductor layer. A p-type fifth semiconductor layer having a smaller sum of electron affinity and forbidden band is provided on the fourth semiconductor layer or second insulator layer. In a tunnel diode type semiconductor device comprising at least one quantum well provided with A p-type impurity forming an impurity level matching the level is contained in at least one of the second semiconductor layer or the first insulator layer and the fourth semiconductor layer or the second insulator layer. A tunnel diode type semiconductor device characterized by:
JP21020386A 1986-09-05 1986-09-05 Tunnel diode type semiconductor device Pending JPS6365680A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21020386A JPS6365680A (en) 1986-09-05 1986-09-05 Tunnel diode type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21020386A JPS6365680A (en) 1986-09-05 1986-09-05 Tunnel diode type semiconductor device

Publications (1)

Publication Number Publication Date
JPS6365680A true JPS6365680A (en) 1988-03-24

Family

ID=16585498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21020386A Pending JPS6365680A (en) 1986-09-05 1986-09-05 Tunnel diode type semiconductor device

Country Status (1)

Country Link
JP (1) JPS6365680A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5825240A (en) * 1994-11-30 1998-10-20 Massachusetts Institute Of Technology Resonant-tunneling transmission line technology
JP4917030B2 (en) * 2005-04-13 2012-04-18 三菱電機株式会社 Elevator equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5825240A (en) * 1994-11-30 1998-10-20 Massachusetts Institute Of Technology Resonant-tunneling transmission line technology
JP4917030B2 (en) * 2005-04-13 2012-04-18 三菱電機株式会社 Elevator equipment

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