JPS6366233U - - Google Patents

Info

Publication number
JPS6366233U
JPS6366233U JP1986160405U JP16040586U JPS6366233U JP S6366233 U JPS6366233 U JP S6366233U JP 1986160405 U JP1986160405 U JP 1986160405U JP 16040586 U JP16040586 U JP 16040586U JP S6366233 U JPS6366233 U JP S6366233U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode array
metal wire
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986160405U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986160405U priority Critical patent/JPS6366233U/ja
Publication of JPS6366233U publication Critical patent/JPS6366233U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Exposure Or Original Feeding In Electrophotography (AREA)
  • Wire Bonding (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Laser Beam Printer (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案実施例の光プリンタヘツドの平
面図、第２図はその要部の断面図ａと平面図ｂで
ある。 １……発光ダイオードアレイ、１１，１１……
発光部、１２，１２……電極、１２１……ワイヤ
ボンド領域、２，２……駆動素子、３……基板、
４，４……金属細線、５……絶縁膜、５１……透
孔。 FIG. 1 is a plan view of an optical printer head according to an embodiment of the present invention, and FIG. 2 is a sectional view a and a plan view b of the main parts thereof. 1... Light emitting diode array, 11, 11...
Light emitting part, 12, 12... Electrode, 121... Wire bond area, 2, 2... Drive element, 3... Substrate,
4, 4...Thin metal wire, 5...Insulating film, 51...Through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 整列された複数の発光部と、発光部に給電する
電極を有した発光ダイオードアレイと、発光ダイ
オードアレイに近接配置された駆動素子と、発光
ダイオードアレイの電極と駆動素子とをワイヤボ
ンド配線する金属細線とを具備した光プリンタヘ
ツドにおいて、発光ダイオードアレイの電極のワ
イヤボンド領域の上には略鍵穴状の透孔を有する
絶縁膜が形成され金属細線はその透孔から露出し
た電極部分に配線されている事を特徴とする光プ
リンタヘツド。 A light emitting diode array having a plurality of aligned light emitting parts, an electrode for feeding power to the light emitting parts, a driving element disposed in close proximity to the light emitting diode array, and a metal wire bonding wiring between the electrodes of the light emitting diode array and the driving element. In an optical printer head equipped with a thin metal wire, an insulating film having a substantially keyhole-shaped through hole is formed on the wire bond area of the electrode of the light emitting diode array, and the thin metal wire is wired to the electrode portion exposed from the through hole. An optical printer head characterized by:
JP1986160405U 1986-10-20 1986-10-20 Pending JPS6366233U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986160405U JPS6366233U (en) 1986-10-20 1986-10-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986160405U JPS6366233U (en) 1986-10-20 1986-10-20

Publications (1)

Publication Number Publication Date
JPS6366233U true JPS6366233U (en) 1988-05-02

Family

ID=31085755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986160405U Pending JPS6366233U (en) 1986-10-20 1986-10-20

Country Status (1)

Country Link
JP (1) JPS6366233U (en)

Similar Documents

Publication Publication Date Title
JPS62101250U (en)
JPS6366233U (en)
JPS6457050U (en)
JPS62104956U (en)
JPS63184739U (en)
JPS63176639U (en)
JPS61196559U (en)
JPS6260053U (en)
JPS6118848U (en) optical print head
JPS6258059U (en)
JPS6368441U (en)
JPH01104343U (en)
JPH0159637U (en)
JPS6179556U (en)
JPS6159364U (en)
JPS61140554U (en)
JPS63153561U (en)
JPS648760U (en)
JPS6183064U (en)
JPS6183936U (en)
JPS5889956U (en) light emitting diode element
JPS6349948U (en)
JPS6349945U (en)
JPS63119042U (en)
JPS636853U (en)