JPS6366423B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a wire bonding method in which a semiconductor pellet, which is a first bond point, and an external lead, which is a second bond point, are connected by a wire inserted through a tool of an ultrasonic wire bonding device. , particularly regarding wire cutting methods.

The conventional ultrasonic wire bonding method
This is done as shown in the figure. That is, as shown in FIG.
Connect with wire 4 inserted through. Next, as shown in Figure b, the clamper 5 holds the wire 4 and
Move from position a to position 5b and cut the wire 4. Subsequently, after the tool 3 is raised as shown in FIG. In the figure, reference numeral 6 denotes an ultrasonic oscillation horn holding the tool 3 at one end, which is attached to a bonding head (not shown).

The clamper 5 is attached to a bonding head (not shown), opened and closed by an opening/closing drive means (not shown), and moved in the wire insertion direction by a moving mechanism (not shown).

In this way, conventionally, the clamper 5 reciprocates in the wire insertion direction to cut the wire and feed out the wire, so a mechanism for moving the clamper 5 is required. In addition, the clamper 5 is moved by a certain amount in order to feed out the wire 4 under the tip of the tool 3, but the tool 3
There was a drawback that the wire feeding amount varied due to friction with the wire insertion hole 3a formed in the wire insertion hole 3a, movement error of the clamper 5, etc.

The present invention was made in view of the above-mentioned drawbacks of the prior art, and an object of the present invention is to provide a wire bonding method that does not require a clamper moving mechanism and can easily feed a fixed amount of wire under the tip of a tool. do.

Hereinafter, the present invention will be explained with reference to illustrated embodiments.

FIG. 2 is an operational explanatory diagram showing an embodiment of the wire bonding method according to the present invention. In addition, the first
The same members as those in the figures are given the same reference numerals and their explanations will be omitted. Note that since the clamper 5 is attached to the bonding head, it moves together with the tool 3. However, in the present invention, a moving mechanism for moving the clamper 5 in the wire insertion direction is not provided. First, as shown in FIG. 2a, the wire 4 is fed out from a spool (not shown) and extends to the tip of the tool 3, and the clamper 5 holds the wire 4 and is positioned above the pellet 1. From this state, the tool 3 held by the ultrasonic oscillation horn 6 is lowered by driving the bonding head (not shown) as shown in FIG. Bonding. After the bonding is completed, the clamper 5 opens. Then, as shown in FIG. 3C, the tool 3 rises and moves in the XY directions, and is located above the external lead 2. Subsequently, as shown in FIG. 4D, the tool 3 is lowered, the wire 4 is sandwiched between the external leads 2 and grounded, and bonding is performed by ultrasonic oscillation.

After the bonding is completed, the tool 3 is slightly raised in the wire insertion direction, as shown in FIG. Next, the same figure f
The clamper 5 closes and holds the wire 4 as shown in FIG. Furthermore, as soon as the clamper 5 closes, ultrasonic waves are instantaneously oscillated. This causes the tool 3 to vibrate and shake the wire 4, making the wire 4 more likely to break. Subsequently, the tool 3 and the clamper 5 rise as shown in FIG. In this state, the wire 4 has already been paid out under the tip of the tool 3. Thereafter, the tool 3 is moved onto the next pad to be bonded, and is in the state shown in FIG. Thereafter, the bonding of one semiconductor component is completed by sequentially repeating the operations from a to g in the figure.

In the above embodiment, the wire 4 is cut after the tool 3 is vibrated, but the wire 4 may be cut while the tool 3 is vibrated.

As is clear from the above description, according to the bonding method according to the present invention, after bonding to the external lead, which is the second bonding point, the tool is slightly raised in the wire insertion direction, and then oscillation is applied to shake the wire. Since the clamper is raised together with the tool to cut the wire, the clamper is only moved together with the tool and does not need to be moved independently. Therefore, there is no particular need for a mechanism for moving the clamper, which simplifies the mechanism. Further, since the wire is cut while the tool is elevated a certain length above the second bond point, a certain amount of wire is always paid out under the tip of the tool when the wire is cut.

[Brief explanation of drawings]

The figure shows the wire bonding method;
~c are explanatory diagrams of some operations of the conventional example, Figures 2a~g
FIG. 2 is an operation explanatory diagram showing an embodiment of the present invention. 1...Pellet, 2...External lead, 3...Tool,
4...wire, 5...clamper, 6...ultrasonic oscillation horn.

Claims (1)

[Claims] 1 In a wire bonding method in which a first bond point and a second bond point are connected by a wire inserted through a tool of an ultrasonic wire bonding device, after bonding to the second bond point, the tool is connected with the clamper open. A wire bonding method in which the clamper is raised slightly in the wire insertion direction, the clamper is then closed, the tool is oscillated to vibrate the wire, and the clamper is raised together with the tool to cut the wire.