JPS6367261U - - Google Patents
Info
- Publication number
- JPS6367261U JPS6367261U JP16332086U JP16332086U JPS6367261U JP S6367261 U JPS6367261 U JP S6367261U JP 16332086 U JP16332086 U JP 16332086U JP 16332086 U JP16332086 U JP 16332086U JP S6367261 U JPS6367261 U JP S6367261U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- solder layer
- component according
- thickness
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
Landscapes
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
図面は本考案に係る電子部品の実施例を示し、
第１図は斜視図、第２図は平面図、第３図は側面
図、第４図は基板への搭載工程を示す一部切欠側
面図、第５図は別の実施例を示す第１図に相当す
る斜視図、第６図及び第７図は夫々さらに別の実
施例を示す側面図である。
１Ｂ……接続用端子、１ａ……接続面、２……
ハンダ層。
The drawings show examples of electronic components according to the present invention,
Fig. 1 is a perspective view, Fig. 2 is a plan view, Fig. 3 is a side view, Fig. 4 is a partially cutaway side view showing the mounting process on the board, and Fig. 5 is the first embodiment showing another embodiment. The perspective view corresponding to the figure, and FIGS. 6 and 7 are side views showing still further embodiments, respectively. 1B... Connection terminal, 1a... Connection surface, 2...
solder layer.
Claims (1)
ある電子部品。 前記ハンダ層の厚みが２０μｍ以上である実
用新案登録請求の範囲第項に記載の電子部品。 前記ハンダ層の厚みが１００μｍないし５０
０μｍである実用新案登録請求の範囲第項に記
載の電子部品。 前記ハンダ層が、フラツクスを含有するもの
である実用新案登録請求の範囲第項に記載の電
子部品。 前記ハンダ層が、繊維を含有するものである
実用新案登録請求の範囲第項ないし第項の何
れかに記載の電子部品。 前記接続用端子が、複数個並んで設けられ、
前記ハンダ層が、それら複数個の接続用端子どう
しに亘つて連続する帯状のものである実用新案登
録請求の範囲第項に記載の電子部品。[Scope of claim for utility model registration] An electronic component in which a solder layer is attached to the connection surface of the connection terminal. The electronic component according to claim 1, wherein the solder layer has a thickness of 20 μm or more. The thickness of the solder layer is 100 μm to 50 μm.
The electronic component according to claim 1 of the utility model registration claim, which has a diameter of 0 μm. The electronic component according to claim 1, wherein the solder layer contains flux. The electronic component according to any one of claims 1 to 3, wherein the solder layer contains fibers. A plurality of the connection terminals are provided side by side,
The electronic component according to claim 1, wherein the solder layer is in the form of a continuous band extending between the plurality of connection terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16332086U JPS6367261U (en) | 1986-10-23 | 1986-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16332086U JPS6367261U (en) | 1986-10-23 | 1986-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6367261U true JPS6367261U (en) | 1988-05-06 |
Family
ID=31091410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16332086U Pending JPS6367261U (en) | 1986-10-23 | 1986-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6367261U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH032655U (en) * | 1989-05-29 | 1991-01-11 |
-
1986
- 1986-10-23 JP JP16332086U patent/JPS6367261U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH032655U (en) * | 1989-05-29 | 1991-01-11 |