JPS6367295U - - Google Patents
Info
- Publication number
- JPS6367295U JPS6367295U JP16165786U JP16165786U JPS6367295U JP S6367295 U JPS6367295 U JP S6367295U JP 16165786 U JP16165786 U JP 16165786U JP 16165786 U JP16165786 U JP 16165786U JP S6367295 U JPS6367295 U JP S6367295U
- Authority
- JP
- Japan
- Prior art keywords
- ground conductor
- shield plate
- high frequency
- substrate
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Waveguides (AREA)
Description
第１図は、本考案の高周波回路のシールド構造
の一実施例の一部切り欠き斜視図であり、第２図
は、第１図のＢ矢視拡大図であり、第３図は、第
１図の要部拡大斜視図であり、第４図は、従来の
高周波回路のシールド構造の一部切り欠き斜視図
であり、第５図は、第４図のＡ―Ａ矢視断面図で
ある。
２：基板、３：接地導体、２０；表接地導体、
２１：スルーホール、２８：シールド板、２９：
半田付け。
FIG. 1 is a partially cutaway perspective view of an embodiment of the shielding structure for a high frequency circuit of the present invention, FIG. 2 is an enlarged view taken in the direction of arrow B in FIG. 1, and FIG. 1 is an enlarged perspective view of the main part of FIG. 1, FIG. 4 is a partially cutaway perspective view of a shield structure of a conventional high frequency circuit, and FIG. 5 is a cross-sectional view taken along the line A--A in FIG. be. 2: Board, 3: Ground conductor, 20; Surface ground conductor,
21: Through hole, 28: Shield plate, 29:
Soldering.
Claims (1)
に分離された複数の区画を形成する高周波回路の
シールド構造において、前記基板の裏面に接地導
体を設け、表面に前記シールド板に沿つてこのシ
ールド板の厚さより幅の広い表接地導体を設け、
この表接地導体を前記接地導体にスルーホールを
介して電気的接続するとともに半田付けにより前
記シールド板に電気的接続して構成したことを特
徴とする高周波回路のシールド構造。 In a shielding structure for a high frequency circuit in which a shield plate is erected on one substrate to form a plurality of sections separated in terms of high frequency, a ground conductor is provided on the back surface of the substrate, and a ground conductor is provided on the front surface along the shield plate. Provide a surface grounding conductor that is wider than the thickness of this shield plate,
A shield structure for a high frequency circuit, characterized in that the front ground conductor is electrically connected to the ground conductor via a through hole and electrically connected to the shield plate by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16165786U JPS6367295U (en) | 1986-10-22 | 1986-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16165786U JPS6367295U (en) | 1986-10-22 | 1986-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6367295U true JPS6367295U (en) | 1988-05-06 |
Family
ID=31088175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16165786U Pending JPS6367295U (en) | 1986-10-22 | 1986-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6367295U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09116310A (en) * | 1995-10-17 | 1997-05-02 | Nippon Telegr & Teleph Corp <Ntt> | Multi-input multi-output switch circuit |
-
1986
- 1986-10-22 JP JP16165786U patent/JPS6367295U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09116310A (en) * | 1995-10-17 | 1997-05-02 | Nippon Telegr & Teleph Corp <Ntt> | Multi-input multi-output switch circuit |