JPS636741U - - Google Patents
Info
- Publication number
- JPS636741U JPS636741U JP10029586U JP10029586U JPS636741U JP S636741 U JPS636741 U JP S636741U JP 10029586 U JP10029586 U JP 10029586U JP 10029586 U JP10029586 U JP 10029586U JP S636741 U JPS636741 U JP S636741U
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- solder
- pattern
- circuit board
- patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の膜回路基板を示す平面図、第
２図ａは本考案においてセラミツクキヤツプと膜
回路基板とを組み合せた状態を示す断面図、ｂは
本考案のはんだ粒発生状況を示す平面図、第３図
ａは従来例の膜回路基板を示す平面図、ｂはセラ
ミツクキヤツプを示す平面図、第４図ａは従来に
おけるセラミツクキヤツプと膜回路基板とを組み
合せた状態を示す断面図、ｂは従来におけるはん
だ粒発生状況を示す平面図である。
１……シール用Ａｕパターン、１ａ……拡大パ
ターン、２……膜回路基板、３……セラミツクキ
ヤツプ、４ｂ……はんだ粒。
Fig. 1 is a plan view showing the membrane circuit board of the present invention, Fig. 2a is a sectional view showing a state in which the ceramic cap and the membrane circuit board are combined in the present invention, and Fig. 2 b shows the state of generation of solder particles in the present invention. FIG. 3A is a plan view showing a conventional membrane circuit board, FIG. 3B is a plan view showing a ceramic cap, and FIG. 4A is a sectional view showing a combination of a conventional ceramic cap and a membrane circuit board. , b are plan views showing the state of generation of solder grains in the prior art. 1...Au pattern for sealing, 1a...enlarged pattern, 2...membrane circuit board, 3...ceramic cap, 4b...solder grains.
Claims (1)
面にそれぞれ形成されたシール用Ａｕパターン間
をはんだ付けにより接合して突き合せ部を気密封
止する構造において、前記シール用Ａｕパターン
の一部に、余剰はんだを捕捉させる拡大パターン
を一体に形成したことを特徴とするはんだシール
用Ａｕパターン。 In a structure in which sealing Au patterns formed on the abutting surfaces of a ceramic cap and a membrane circuit board are joined by soldering to hermetically seal the abutting portions, a portion of the sealing Au patterns is An Au pattern for a solder seal, characterized by integrally forming an enlarged pattern that traps solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10029586U JPS636741U (en) | 1986-06-30 | 1986-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10029586U JPS636741U (en) | 1986-06-30 | 1986-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS636741U true JPS636741U (en) | 1988-01-18 |
Family
ID=30969983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10029586U Pending JPS636741U (en) | 1986-06-30 | 1986-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS636741U (en) |
-
1986
- 1986-06-30 JP JP10029586U patent/JPS636741U/ja active Pending