JPS6370488A - Manufacture of metal base board - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method of manufacturing a metal base substrate used in electrical equipment, electronic equipment, computers, communication equipment, etc.

[Background technology]

Conventionally, metal base substrates are made by placing +4 foils on the upper and lower surfaces of a metal plate with holes drilled at desired positions via prepreg.
16 were molded under heat and pressure, and the openings were filled with resin melted from the prepreg. For the through-hole circuit, the center of the resin-filled hole was re-opened and conductive treatment was performed, and the non-resin-filled hole was If you want to remove the resin from the resin filling hole, use a drill, press, etc. to remove the resin, but completely removing the resin will result in residual resin, enlargement of the hole due to over-shaving, and the occurrence of false cedar. There was a problem.

[Purpose of the invention]

An object of the present invention is to select a method for manufacturing a gold 4-based substrate in which resin-filled holes and resin-unfilled holes can be arbitrarily selected.

[Disclosure of the invention]

The present invention uses gold to cover the holes above and below arbitrary holes among the holes in the metal plate that are drilled at the required positions. ? 2if-The method for manufacturing a metal base board is characterized by heating and pressurizing a laminate in which gold foil is placed above and below the entire surface of the gold plate with a resin layer interposed therebetween. The unfilled holes can be arbitrarily selected, and the present invention will be described in detail below.

Metal plates used in the present invention include aluminum plates, stainless steel m plates, XS plates, iron plates, Nilikel plates, copper plates, silicon steel plates, etc. with holes drilled at the required positions! @Germany, combinations etc. can be used and there is nothing to specify in particular.Resin layers include 11 phenolic resins, cresol fat-saving, epoxy resins, unsaturated polyester resins, melamine resins, polyimides, polybutadiene, polyamides, polyamide-imides. Add solvents such as water, methyl alcohol, acetone, cyclohexanone, styrene, etc. to adjust the viscosity as necessary to polysulfone, polybutylene terephthalate, polyether ether ketone, fluoride juho, etc. alone, modified products, mixed proboscises, etc. A coating layer with a resin face applied, a resin film made into a sheet, a resin sheet or a resin varnish can be used as a lantern synthetic fiber such as glass, inorganic fibers such as asbestos, polyester, polyamide, polyvinyl alcohol, acrylic, etc. A prepreg made of natural fibers such as cotton, cotton, etc., impregnated into base materials such as cloth, nonwoven fabric, mat, paper, or combinations thereof, and dried, using one or two sheets as necessary. Coating layer, tree effect film, resin sheet, etc. as necessary.
A combination of prepregs can also be used.

Money! Foils include copper, aluminum, iron, stainless steel,
A metal foil such as nickel or silver foil with an adhesive layer (as required) is used.

The present invention will be explained below based on examples.

Implementation @1 A hole is drilled at a desired position n1 in an aluminum plate with a thickness of 1.0 and u, and a hole is inserted above and below any arbitrary hole to a thickness of 0.035.
After placing the fin copper foil, a laminate was formed in which copper foil with a thickness of 0.035 LW was placed on the top and bottom of the entire surface of the aluminum plate through epoxy resin-impregnated glass cloth prepreg with a thickness of g and 1 inch, respectively. A metal base substrate was obtained by pressure molding at a pressure of 40 Kq/cage and 160° C. for 60 minutes.

Example 2 Holes were drilled at the required positions on an iron plate with a thickness of 1.0 mm, and aluminum foil with a thickness of 0.018 ta was placed above and below arbitrary holes to cover the holes. Each bottom has a thickness of 0.1
Thickness 0.018 through silk epoxy resin impregnated glass cloth prepreg! A laminate with nI copper foil was molded at a pressure of 4
0 Krv'd and 160° C. for 60 minutes to obtain a metal base substrate.

Example: A 1.0'1g thick aluminum plate with holes drilled at the required positions is placed on top and bottom of an epoxy resin-impregnated glass cloth prepreg with a thickness of 0.035 = p'A 7M.
A molding pressure of 40 + v'cd is applied to the stacked body with
A Gold 11 base substrate was obtained by blue heating and pressure molding at 160°C for 60 minutes.

〔Effect of the invention〕

As is clear from Table 1, the properties of the non-resin-filled holes in the present base substrates of Examples 1 and 2 and the comparative example were good, confirming the superiority of the metal base substrate of the present invention. . However, the resin-unfilled holes in the Hiei example were obtained by drilling resin-filled holes.

Claims (2)

[Claims] (1) After placing metal foil to cover the holes above and below arbitrary holes of the holes drilled in the metal plate at the required positions, metal foil was placed above and below the entire surface of the metal plate via a resin layer. A method for manufacturing a metal base substrate, which comprises heating and press-molding a laminate. (2) The method for manufacturing a metal base substrate according to claim 1, wherein the resin layer is a prepreg.