JPS637126A - How to assemble a wiring junction box - Google Patents
How to assemble a wiring junction boxInfo
- Publication number
- JPS637126A JPS637126A JP61146846A JP14684686A JPS637126A JP S637126 A JPS637126 A JP S637126A JP 61146846 A JP61146846 A JP 61146846A JP 14684686 A JP14684686 A JP 14684686A JP S637126 A JPS637126 A JP S637126A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- resin
- assembly
- wiring
- junction box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Connection Or Junction Boxes (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の目的〕
廉１よ！すＩＪｆｌ−釦堕
本発明は、自動車等におけるワイヤハーネスや電気機能
部品等の端末間の接続や分岐を行なうための配線接続箱
を組立てる方法に関する。[Detailed description of the invention] [Object of the invention] Hello! TECHNICAL FIELD The present invention relates to a method of assembling a wiring junction box for connecting and branching terminals of wire harnesses, electrical functional parts, etc. in automobiles and the like.
え未ｑ茨肛
自動車等で各種の電気機器への配線を行うに当って、複
数のコネクタを外壁部に設けた絶縁性ケース内に、これ
らのコネクタの端子相互の間を連結する導電体を配設し
て配線接続箱を構成し、これらのコネクタに各種の機能
部品の端子やワイヤハーネスの端子などを接続すること
により、多くの配線を一挙に完成することが知られてい
る。When wiring various electrical devices in automobiles, etc., a conductor is placed inside an insulating case with multiple connectors installed on the outer wall to connect the terminals of these connectors. It is known that many wirings can be completed at once by arranging them to form a wiring junction box and connecting terminals of various functional parts, wire harness terminals, etc. to these connectors.
かかる配線接続箱は通常エンジンルーム内等に設置され
るから、高温にｕＢＮされるのみならず油や水などに接
触する機会が多く、特にエンジンルーム内を高圧水で噴
射洗浄する際などでは防水カバーがあっても内部に水が
浸入することが起り得る。そこで、たとえ水の浸入があ
っても配線間で電気の漏洩などを起さないように、絶縁
性ケース内に導電体を配設した配線板を装着したのち、
例えばエポキシ樹脂などの液状樹脂を注入硬化させてケ
ース内の空隙を充填すると共に配線板を包埋し、絶縁性
を強化した配線接続箱を完成することが行われていた。Since such a wiring junction box is usually installed inside the engine room, there are many opportunities to not only expose it to high temperatures but also come into contact with oil and water. Even with a cover, water can still get inside. Therefore, in order to prevent electricity from leaking between the wiring even if water entered, we installed a wiring board with a conductor inside an insulating case.
For example, a liquid resin such as an epoxy resin is injected and hardened to fill the void inside the case and embed the wiring board, thereby completing a wiring junction box with reinforced insulation.
しかしながら、絶縁性ケースすなわち配線接続箱の表カ
バーや裏カバーには、コネクタのハウジングが形成され
ていて、導電体の一部などに形成されたタブ型の接続端
子がコネクタ内に貫通露出するようになっているので、
これらの貫通孔から液状樹脂が洩れ出すと接続端子に樹
脂が固着するなどしてコネクタとしての機能が損われる
おそれがある。そこで、樹脂の洩れなどが起らないよう
に、また樹脂の充填量が過大となって樹脂が膨張するな
どして表カバー上への浴出などが起らないように、パツ
キン等の取り付けや樹脂注入量の管理などに細心の注意
を払う必要があった。しかもなお、液状樹脂の硬化時間
が長く、生産性が悪いという問題もあった。However, the connector housing is formed on the insulating case, that is, the front cover and back cover of the wiring junction box, so that the tab-shaped connection terminal formed on a part of the conductor penetrates and is exposed inside the connector. Therefore,
If liquid resin leaks from these through holes, there is a risk that the resin will stick to the connection terminals and the function of the connector will be impaired. Therefore, in order to prevent the resin from leaking, and to prevent the resin from expanding and spilling onto the front cover due to the excessive amount of resin being filled, It was necessary to pay close attention to controlling the amount of resin injected. Moreover, there was also the problem that the curing time of the liquid resin was long, resulting in poor productivity.
鰐犬支娑邊」ｌンｌｔｌへ
本発明は、前述のような従来技術における問題に鑑みて
、防水性及び機能上において信頼性の高い配線接続箱を
製造する生産性の高い方法を提供しようとするものであ
る。In view of the problems in the prior art as described above, the present invention provides a highly productive method for manufacturing a wiring junction box that is highly reliable in terms of waterproofness and functionality. That is.
問題を解決するための手
前記の如き本発明の目的は、導体貫通孔等を設けた電気
絶縁性の基板と配線用の成形された導体とを積層して配
線板組立体を形成し、該配線板組立体をその周囲に所定
の間隙を維持して樹脂成形用モールド内に装着し、該モ
ールド内に包埋用樹脂を充填して該配線板組立体を包埋
し、該モールドから取り外して得られた包埋組立体を筺
体内に装着することを特徴とする配線接続箱の組立法に
よって達成できる。An object of the present invention as described above is to form a wiring board assembly by laminating an electrically insulating substrate provided with conductor through holes, etc. and a molded conductor for wiring, and to form a wiring board assembly. The wiring board assembly is mounted in a resin mold while maintaining a predetermined gap around it, the mold is filled with embedding resin to embed the wiring board assembly, and the wiring board assembly is removed from the mold. This can be achieved by a method for assembling a wiring junction box, which is characterized in that the embedding assembly obtained by the process is mounted in a housing.
ｌ既 以下、本発明の例を図によって説明する。Already Hereinafter, examples of the present invention will be explained with reference to the drawings.
第１図は、絶縁性の配線基板Ａと導体Ｂとを積層して配
線板組立体を形成する工程を示している。FIG. 1 shows a process of laminating an insulating wiring board A and a conductor B to form a wiring board assembly.
基板Ａは耐熱性の硬質樹脂などから形成され、導体Ｂの
端部に形成された、たとえばタブ状の接触端子すなどを
貫通固定させうる孔が設けられている。このような基板
Ａと導体Ｂとは、所定の配線を構成するように、それぞ
れ積層されて配線板組立体Ｃが形成される。The substrate A is made of a heat-resistant hard resin or the like, and is provided with a hole through which, for example, a tab-shaped contact terminal formed at the end of the conductor B can be fixed. The substrate A and the conductor B are laminated to form a wiring board assembly C, respectively, so as to form a predetermined wiring.
配線板組立体Ｃの最上層及び最下層の基板Ａ上には、そ
の上面または下面に枠状体ｄｌやボタン状体ｄ２あるい
は格子枠状体ｄ３などの間隙保持用部材りを予め一体と
して設けるか、または別体に形成した同様形状あるいは
額縁状体ｄ４などの間隙保持用部材りを嵌着などの方法
によって取り付け、必要に応じて端子すを挿入する孔ｅ
を備えた保護型Ｅをその上下両面から装着して保護組立
体Ｆとする。このような保護型Ｅは、たとえば金属や耐
熱性樹脂等で形成されたもので、樹脂成形用モールドＧ
の一部を構成するものである（第２〜３図）。On the uppermost and lowermost substrates A of the wiring board assembly C, a gap-maintaining member such as a frame-like body dl, a button-like body d2, or a lattice frame-like body d3 is integrally provided in advance on the upper or lower surface thereof. Alternatively, a similarly shaped or frame-shaped member d4 formed separately is attached by fitting or other methods, and a hole e into which a terminal is inserted as necessary.
A protection assembly F is obtained by attaching the protection type E equipped with the protection type E from both the top and bottom sides. Such a protective mold E is made of, for example, metal or heat-resistant resin, and is made of resin molding mold G.
(Figures 2 and 3).
樹脂成形用モールドＧの内部に装着された配線板組立体
Ｃの周囲には、間隙保持用部材りによって所定の幅の空
ＢＨが保持されているので、樹脂注入孔ｇから注入され
た樹脂■はこの空隙Ｈに充填され、基板Ａおよび間隙保
持用部材りに一体に密着して配線板組立体Ｃを包埋し、
包埋組立体Ｊを形成する（第４図）。Around the wiring board assembly C mounted inside the resin mold G, a gap BH of a predetermined width is maintained by a gap retaining member, so that the resin injected from the resin injection hole g is filled in this gap H and tightly adheres to the substrate A and the gap holding member to embed the wiring board assembly C,
An embedding assembly J is formed (FIG. 4).
このような包埋用樹脂Ｉとしては、従来用いられたよう
な二液反応型の熱硬化性樹脂でもよいが、熱可塑性樹脂
であるのが好ましい。かかる熱可塑性樹脂としてはたと
えば硬質塩化ビニル樹脂のようなものでもよ（、基板Ａ
や間隙保持用部材りとよく密着でき、かつ包理工程実施
の際にそれらを変形させないようなものであることが必
要である。Such embedding resin I may be a conventionally used two-component reaction type thermosetting resin, but is preferably a thermoplastic resin. Such a thermoplastic resin may be, for example, a hard vinyl chloride resin (substrate A).
It is necessary to be able to adhere well to the material and the gap holding member and not to deform them during the wrapping process.
そしてこのような熱可塑性樹脂を用いるときは、樹脂Ｉ
をモールドＧに注入する手段として、たとえば射出成形
などの方法を用いるのがよく、この場合は熱硬化性樹脂
を用いる場合のようにモールドＧを加熱する必要がなく
、冷却するだけでよいから成形の作業能率が一層よい。When using such a thermoplastic resin, resin I
It is best to use a method such as injection molding as a means of injecting into the mold G. In this case, there is no need to heat the mold G as in the case of using a thermosetting resin, and it is only necessary to cool the mold. The work efficiency is even better.
こうして得られた包埋組立体Ｊを、第５図に示すように
、配線接続箱の裏カバーにの中に装着し、表カバーＬを
装着したのち必要なリレーや機能部品などをそれぞれの
コネクタに装着し、最後に防水力バーＭを被着して配線
接続箱が完成する。As shown in Figure 5, the embedding assembly J obtained in this way is attached to the back cover of the wiring junction box, and after attaching the front cover L, the necessary relays and functional parts are connected to the respective connectors. Finally, the waterproof bar M is attached to complete the wiring junction box.
１−肛
以上説明した方法によれば、配線板組立体を樹脂により
包埋する工程が樹脂成形用モールド内で実施されるが、
その際の配線板組立体のモールドへの装着位置は間隙保
護用部材によって正確に規定されるので包埋樹脂層の厚
さが一定となり、従って絶縁性に関する欠陥が生じない
のみならず、筺体内への装着状態が一定した、高信頼性
の配線接続箱が得られる。1-According to the method described above, the step of embedding the wiring board assembly in resin is carried out in a resin mold.
At that time, the mounting position of the wiring board assembly on the mold is precisely defined by the gap protection member, so the thickness of the embedding resin layer is constant, and therefore not only no insulation defects occur, but also It is possible to obtain a highly reliable wiring junction box whose mounting condition is constant.
本発明の配線接続箱の組立法では、配線用基板と導体と
を組み立てたのちにその周囲に間隙を維持できるように
して樹脂成形用モールド内に装着して樹脂による包埋を
行なうので、配線板組立体は完全に一体に結合され、ま
たその表面は少量の樹脂によって均一な厚さに被覆され
て包埋の欠陥が生じないから、防水性がよ（て絶縁が完
全であるとともに著しく包理工程が高能率化される。そ
して、このようにあらかじめ樹脂包埋された配線板組立
体をカバー内に装着して配線接続箱を組立てるので、組
立作業も単純となりかつ効率化された。In the method for assembling a wiring junction box of the present invention, after assembling the wiring board and the conductor, the wiring board and the conductor are mounted in a resin mold with a gap maintained around them, and the wiring is embedded in the resin. The plate assembly is completely joined together and its surface is coated with a small amount of resin to a uniform thickness to prevent embedding defects, making it highly waterproof, completely insulated, and significantly encapsulated. The manufacturing process becomes highly efficient.In addition, since the wiring board assembly, which has been embedded in the resin in advance, is mounted inside the cover and the wiring junction box is assembled, the assembly work becomes simple and efficient.
第１図（ａｌは本発明の配線接続箱の組立法における配
線板組立体の組立工程を示す図、同図ｆｂ） 、 （Ｃ
）、（ｄ）は夫々別の形状の間隙保持用部材を設けた配
線板組立体の例の斜視図、第２図および第３図は、゛同
じく配線板組立体を樹脂成形用モールド内に装着する工
程のそれぞれ一部を示す図、第４図は同じくモールド内
での樹脂の充填状態を示す部分図、第５図は同じく配線
接続箱の組付は工程を説明する図である。
Ａ・・・配線用基板、Ｂ・・・導体、Ｃ・・・配線板組
立体、Ｄ・・・間隙保持用部材、Ｅ・・・保護型、Ｆ・
・・保護組立体、Ｇ・・・樹脂成形用モールド、Ｈ・・
・空隙、■・・・樹脂、Ｊ・・・包埋組立体、Ｋ・・・
裏カバー、Ｌ・・・表カバー、Ｍ・・・防水カバー。
（ａ）
第１図
（ｂ）
（Ｃ）
（ｄ）
第３図Figure 1 (al is a diagram showing the assembly process of the wiring board assembly in the wiring junction box assembly method of the present invention, figure fb), (C
) and (d) are perspective views of examples of wiring board assemblies provided with gap retaining members of different shapes, respectively, and FIGS. FIG. 4 is a partial view showing the filling state of resin in the mold, and FIG. 5 is a view illustrating the process of assembling the wiring junction box. A... Wiring board, B... Conductor, C... Wiring board assembly, D... Gap retaining member, E... Protection type, F...
・・Protection assembly, G ・Mold for resin molding, H・・
・Void, ■...Resin, J...Embedded assembly, K...
Back cover, L...front cover, M...waterproof cover. (a) Figure 1 (b) (C) (d) Figure 3
Claims (3)
の成形された導体とを積層して配線板組立体を形成し、
該配線板組立体をその周囲に所定の間隙を維持して樹脂
成形用モールド内に装着し、該モールド内に包埋用樹脂
を充填して該配線板組立体を包埋し、該モールドから取
外して得られた包埋組立体を筺体内に装着することを特
徴とする配線接続箱の組立法。(1) Form a wiring board assembly by laminating an electrically insulating substrate provided with conductor through holes etc. and a molded conductor for wiring,
The wiring board assembly is mounted in a resin mold while maintaining a predetermined gap around it, the mold is filled with embedding resin to embed the wiring board assembly, and the wiring board assembly is removed from the mold. A method for assembling a wiring junction box, characterized in that an embedded assembly obtained by removing the assembly is mounted inside a housing.
が、基板と一体に形成された部材である特許請求の範囲
第１項の組立法。(2) The assembly method according to claim 1, wherein the means for maintaining a predetermined gap around the wiring board assembly is a member formed integrally with the board.
が、基板とは別体として形成された部材である特許請求
の範囲第１項の組立法。(3) The assembly method according to claim 1, wherein the means for maintaining a predetermined gap around the wiring board assembly is a member formed separately from the board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61146846A JPS637126A (en) | 1986-06-25 | 1986-06-25 | How to assemble a wiring junction box |
| US07/059,639 US4781600A (en) | 1986-06-25 | 1987-06-08 | Junction box and a process of assembling the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61146846A JPS637126A (en) | 1986-06-25 | 1986-06-25 | How to assemble a wiring junction box |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS637126A true JPS637126A (en) | 1988-01-13 |
| JPH0357688B2 JPH0357688B2 (en) | 1991-09-03 |
Family
ID=15416857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61146846A Granted JPS637126A (en) | 1986-06-25 | 1986-06-25 | How to assemble a wiring junction box |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS637126A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5734125A (en) * | 1995-01-10 | 1998-03-31 | Sumitomo Wiring Systems, Ltd. | Junction box |
-
1986
- 1986-06-25 JP JP61146846A patent/JPS637126A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5734125A (en) * | 1995-01-10 | 1998-03-31 | Sumitomo Wiring Systems, Ltd. | Junction box |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0357688B2 (en) | 1991-09-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |