JPS6371576U - - Google Patents
Info
- Publication number
- JPS6371576U JPS6371576U JP16591786U JP16591786U JPS6371576U JP S6371576 U JPS6371576 U JP S6371576U JP 16591786 U JP16591786 U JP 16591786U JP 16591786 U JP16591786 U JP 16591786U JP S6371576 U JPS6371576 U JP S6371576U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wiring board
- printed wiring
- via hole
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16591786U JPS6371576U (2) | 1986-10-29 | 1986-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16591786U JPS6371576U (2) | 1986-10-29 | 1986-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6371576U true JPS6371576U (2) | 1988-05-13 |
Family
ID=31096399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16591786U Pending JPS6371576U (2) | 1986-10-29 | 1986-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6371576U (2) |
-
1986
- 1986-10-29 JP JP16591786U patent/JPS6371576U/ja active Pending
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