JPS6373992U - - Google Patents
Info
- Publication number
- JPS6373992U JPS6373992U JP16854386U JP16854386U JPS6373992U JP S6373992 U JPS6373992 U JP S6373992U JP 16854386 U JP16854386 U JP 16854386U JP 16854386 U JP16854386 U JP 16854386U JP S6373992 U JPS6373992 U JP S6373992U
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- layer
- molded product
- shield molded
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 3
- 239000012779 reinforcing material Substances 0.000 claims 2
- 238000001746 injection moulding Methods 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Description
第１図、第２図および第３図は、いずれも本考
案のシールド成形品の導通部の構成の一例を示す
断面図である。
１……シールド成形品の導通部、２……基材、
３……導電層、４……金属メツキ層、５……樹脂
層、６……金属片、７……ネジ、８……導通孔、
９……補強材。
FIG. 1, FIG. 2, and FIG. 3 are all cross-sectional views showing an example of the structure of the conductive part of the shield molded product of the present invention. 1... Conductive part of shield molded product, 2... Base material,
3... Conductive layer, 4... Metal plating layer, 5... Resin layer, 6... Metal piece, 7... Screw, 8... Conductive hole,
9...Reinforcement material.
Claims (1)
出成形により樹脂層５と一体化してなるシールド
成形品において、樹脂層５に導通孔８を設け、導
通孔８の底部に露出している導電層３により導通
を確保し、基材２の少なくとも導通孔８に対応す
る部分に補強材９を固定してなるシールド成形品
の導通部１。 (2) 導通孔８の底部に露出している導電層３の
上に金属メツキ層４を設けた実用新案登録請求の
範囲第１項に記載のシールド成形品の導通部１。 (3) 導電層３または金属メツキ層４の表面に金
属片６を接触させ、ネジ７で補強材９および金属
片６を樹脂層５に固定した実用新案登録請求の範
囲第１項または第２項に記載のシールド成形品の
導通部１。[Claims for Utility Model Registration] (1) In a shield molded product in which a base material 2 and a conductive layer 3 provided thereon are integrated with a resin layer 5 by injection molding, a conductive hole 8 is provided in the resin layer 5, A conductive part 1 of a shield molded product, in which conduction is ensured by a conductive layer 3 exposed at the bottom of a conductive hole 8, and a reinforcing material 9 is fixed to at least a portion of a base material 2 corresponding to the conductive hole 8. (2) The conductive part 1 of the shield molded product according to claim 1 of the utility model registration claim, in which a metal plating layer 4 is provided on the conductive layer 3 exposed at the bottom of the conductive hole 8. (3) Utility model registration claim 1 or 2, in which the metal piece 6 is brought into contact with the surface of the conductive layer 3 or the metal plating layer 4, and the reinforcing material 9 and the metal piece 6 are fixed to the resin layer 5 with screws 7. Conductive portion 1 of the shield molded product described in 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16854386U JPS6373992U (en) | 1986-11-01 | 1986-11-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16854386U JPS6373992U (en) | 1986-11-01 | 1986-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6373992U true JPS6373992U (en) | 1988-05-17 |
Family
ID=31101514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16854386U Pending JPS6373992U (en) | 1986-11-01 | 1986-11-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6373992U (en) |
-
1986
- 1986-11-01 JP JP16854386U patent/JPS6373992U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0343750U (en) | ||
| JPS6373992U (en) | ||
| JPS6373993U (en) | ||
| JPS6217198U (en) | ||
| JPS6370197U (en) | ||
| JPS61186619U (en) | ||
| JPH0390922U (en) | ||
| JPS6217199U (en) | ||
| JPS6370200U (en) | ||
| JPS6370198U (en) | ||
| JPS6370199U (en) | ||
| JPH01148310U (en) | ||
| JPH03106363U (en) | ||
| JPH0358056U (en) | ||
| JPH02109386U (en) | ||
| JPS61179622U (en) | ||
| JPS633417U (en) | ||
| JPS5834273U (en) | High frequency switch | |
| JPS6377338U (en) | ||
| JPS63105096U (en) | ||
| JPS63156732U (en) | ||
| JPH0247092U (en) | ||
| JPH0377619U (en) | ||
| JPS6427928U (en) | ||
| JPS6131718U (en) | Gate plate for resin molding equipment |