JPS637543U - - Google Patents
Info
- Publication number
- JPS637543U JPS637543U JP9982886U JP9982886U JPS637543U JP S637543 U JPS637543 U JP S637543U JP 9982886 U JP9982886 U JP 9982886U JP 9982886 U JP9982886 U JP 9982886U JP S637543 U JPS637543 U JP S637543U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- band
- grace
- thermal head
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案に係るサーマルヘツドの実施例
を示す要部の縦断面正面図、第２図は従来のサー
マルヘツドを示す要部の縦断面図である。
１……絶縁基板、２……グレーズ層、２ｂ，２
ｃ……帯状突部、３……発熱抵抗体層、４……給
電体層、５……保護層、６……インクリボン、７
……プラテン、８……記録紙。
FIG. 1 is a longitudinal sectional front view of the main parts of a thermal head according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of the main parts of a conventional thermal head. 1... Insulating substrate, 2... Glaze layer, 2b, 2
c...Striped protrusion, 3...Heating resistor layer, 4...Power supply layer, 5...Protective layer, 6...Ink ribbon, 7
...Platen, 8...Recording paper.
Claims (1)
ス層を形成し、このグレース層上に複数個の発熱
抵抗体層を配設し、各発熱抵抗体層に電力を供給
するための給電体層を発熱抵抗体層に接続してな
るサーマルヘツドにおいて、前記グレース層上に
、グレース層の円周方向に間隔を隔てて複数の帯
状突部を突設し、これらの帯状突部のうち印字方
向先端側の帯状突部上に前記発熱抵抗体層の発熱
部を配設したことを特徴とするサーマルヘツド。 (2) ２個の前記帯状突部が形成され、両帯状突
部間に一方の給電体層が配設されている実用新案
登録請求の範囲第１項記載のサーマルヘツド。 (3) 前記両帯状突部間の給電体層はグレース層
の円周方向における中央位置に配設されている実
用新案登録請求の範囲第２項記載のサーマルヘツ
ド。[Claims for Utility Model Registration] (1) A grace layer whose upper surface has an arc-shaped cross section is formed on an insulating substrate, and a plurality of heat generating resistor layers are disposed on the grace layer, and each heat generating resistor layer is formed on an insulating substrate. In a thermal head formed by connecting a power supply layer for supplying power to a heat generating resistor layer, a plurality of band-shaped protrusions are provided on the grace layer at intervals in a circumferential direction of the grace layer. . A thermal head, characterized in that the heating portion of the heating resistor layer is disposed on the leading end side of the band-like projections in the printing direction. (2) The thermal head according to claim 1, wherein the two band-shaped protrusions are formed, and one of the power supply layers is disposed between the two band-shaped protrusions. (3) The thermal head according to claim 2, wherein the power supply layer between the two band-like protrusions is disposed at a central position in the circumferential direction of the grace layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9982886U JPH0624210Y2 (en) | 1986-07-01 | 1986-07-01 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9982886U JPH0624210Y2 (en) | 1986-07-01 | 1986-07-01 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS637543U true JPS637543U (en) | 1988-01-19 |
| JPH0624210Y2 JPH0624210Y2 (en) | 1994-06-29 |
Family
ID=30969069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9982886U Expired - Lifetime JPH0624210Y2 (en) | 1986-07-01 | 1986-07-01 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0624210Y2 (en) |
-
1986
- 1986-07-01 JP JP9982886U patent/JPH0624210Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0624210Y2 (en) | 1994-06-29 |