JPS6377376U - - Google Patents
Info
- Publication number
- JPS6377376U JPS6377376U JP17157686U JP17157686U JPS6377376U JP S6377376 U JPS6377376 U JP S6377376U JP 17157686 U JP17157686 U JP 17157686U JP 17157686 U JP17157686 U JP 17157686U JP S6377376 U JPS6377376 U JP S6377376U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- circuit board
- printed circuit
- resist layer
- dip surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のプリント基板の一実施例を示
す要部断面図、第２図、第３図はそれぞれ従来の
プリント基板の要部断面図である。
１……チツプ部品、２……接着剤、３……シル
ク印刷層、４……チツプ部品用ランド、５……ソ
ルダレジスト層、６……プリント基板、７……バ
イヤホール、８……穴埋め用ボンド、９……シル
クのエアー抜けによる切れ。
FIG. 1 is a sectional view of a main part showing an embodiment of the printed circuit board of the present invention, and FIGS. 2 and 3 are sectional views of main parts of a conventional printed circuit board, respectively. 1... Chip parts, 2... Adhesive, 3... Silk printing layer, 4... Land for chip parts, 5... Solder resist layer, 6... Printed circuit board, 7... Via hole, 8... Hole filling Bond, 9...Cut due to air leakage from silk.
Claims (1)
に位置する透孔を、その半田デイツプ面に形成さ
れるソルダレジスト層により閉成し、かつ半田デ
イツプ面と反対側の面のソルダレジスト層は前記
透孔の周辺を除いて形成したことを特徴とするプ
リント基板。 The through hole located under the chip component mounted on the solder dip surface side is closed by the solder resist layer formed on the solder dip surface, and the solder resist layer on the opposite side to the solder dip surface is A printed circuit board characterized in that the printed circuit board is formed excluding the periphery of the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986171576U JPH0427182Y2 (en) | 1986-11-07 | 1986-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986171576U JPH0427182Y2 (en) | 1986-11-07 | 1986-11-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6377376U true JPS6377376U (en) | 1988-05-23 |
| JPH0427182Y2 JPH0427182Y2 (en) | 1992-06-30 |
Family
ID=31107330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986171576U Expired JPH0427182Y2 (en) | 1986-11-07 | 1986-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0427182Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5617991U (en) * | 1979-07-20 | 1981-02-17 | ||
| JPS60110196A (en) * | 1983-11-18 | 1985-06-15 | 松下電器産業株式会社 | Through hole printed circuit board |
| JPS61188994A (en) * | 1985-02-18 | 1986-08-22 | 富士ファコム制御株式会社 | Marking for printed circuit board |
-
1986
- 1986-11-07 JP JP1986171576U patent/JPH0427182Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5617991U (en) * | 1979-07-20 | 1981-02-17 | ||
| JPS60110196A (en) * | 1983-11-18 | 1985-06-15 | 松下電器産業株式会社 | Through hole printed circuit board |
| JPS61188994A (en) * | 1985-02-18 | 1986-08-22 | 富士ファコム制御株式会社 | Marking for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0427182Y2 (en) | 1992-06-30 |