JPS6377776U - - Google Patents
Info
- Publication number
- JPS6377776U JPS6377776U JP17132686U JP17132686U JPS6377776U JP S6377776 U JPS6377776 U JP S6377776U JP 17132686 U JP17132686 U JP 17132686U JP 17132686 U JP17132686 U JP 17132686U JP S6377776 U JPS6377776 U JP S6377776U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit mounting
- mounting board
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図はこの考案の半導体装置の一実施例にお
ける半導体集積回路搭載基板の斜視図、第２図は
同上半導体集積回路基板を組み込んだＩＣカード
本体における第１図のＡ１―Ａ２線に相当する部
分の断面図、第３図は同上半導体装置におけるコ
アシートの部分の斜視図、第４図は同上半導体装
置の他の実施例の要部の断面図、第５図は同上半
導体装置のさらに異なる他の実施例における半導
体集積回路基板の斜視図、第６図は従来のＩＣカ
ードの斜視図である。
５……半導体集積回路基板、６，１１……接触
電極、７……段差部分、８……基材、１０，１０
ａ……穴、１３……コアシート、１２ａ，１２ｂ
……保護シート、１５……突起。
Fig. 1 is a perspective view of a semiconductor integrated circuit board in one embodiment of the semiconductor device of this invention, and Fig. 2 corresponds to line A1-A2 in Fig. 1 of an IC card body incorporating the same semiconductor integrated circuit board. 3 is a perspective view of the core sheet portion of the same semiconductor device as above, FIG. 4 is a sectional view of a main part of another embodiment of the same semiconductor device, and FIG. 5 is a still different example of the same semiconductor device as above. A perspective view of a semiconductor integrated circuit board in another embodiment, and FIG. 6 is a perspective view of a conventional IC card. 5... Semiconductor integrated circuit board, 6, 11... Contact electrode, 7... Step portion, 8... Base material, 10, 10
a... Hole, 13... Core sheet, 12a, 12b
...Protective sheet, 15...Protrusion.
Claims (1)
しＩＣカード本体に組み込まれる半導体集積回路
搭載基板と、 (b) 上記半導体集積回路搭載基板を埋め込みか
つ上記段差部分に嵌合して固定される突起を有し
上記半導体集積回路搭載基板に積層接着するコア
シートと、 (c) このコアシートの表裏両面に接着される保
護シートと、 よりなる半導体装置。[Scope of Claim for Utility Model Registration] (a) A semiconductor integrated circuit mounting board that has a stepped portion on the outer periphery of the surface on the contact terminal side and is incorporated into an IC card body; (b) A semiconductor integrated circuit mounting board that is embedded with the semiconductor integrated circuit mounting board and A semiconductor device comprising: a core sheet that has protrusions that fit into and are fixed to the stepped portion and is laminated and bonded to the semiconductor integrated circuit mounting substrate; (c) a protective sheet that is bonded to both the front and back surfaces of the core sheet; .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17132686U JPS6377776U (en) | 1986-11-10 | 1986-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17132686U JPS6377776U (en) | 1986-11-10 | 1986-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6377776U true JPS6377776U (en) | 1988-05-23 |
Family
ID=31106848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17132686U Pending JPS6377776U (en) | 1986-11-10 | 1986-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6377776U (en) |
-
1986
- 1986-11-10 JP JP17132686U patent/JPS6377776U/ja active Pending